Data Sheet
LAYOUT AND DESIGN RECOMMENDATIONS
ADXL350
soldering profile.
0.3mm
0.8mm
3.35mm
0.5mm
3.53mm
Figure 65. Recommended Printed Wiring Board Land Pattern
(Dimensions shown in millimeters)
T
P
RAMP-UP
t
P
CRITICAL ZONE
T
L
TO T
P
TEMPERATURE
T
L
T
SMAX
T
SMIN
t
L
t
S
PREHEAT
RAMP-DOWN
10271-044
t
25°C TO PEAK
TIME
Figure 66. Recommended Soldering Profile
Table 22. Recommended Soldering Profile
Profile Feature
Average Ramp Rate from Liquid Temperature (T
L
) to Peak Temperature (T
P
)
Preheat
Minimum Temperature (T
SMIN
)
Maximum Temperature (T
SMAX
)
Time from T
SMIN
to T
SMAX
(t
S
)
T
SMAX
to T
L
Ramp-Up Rate
Liquid Temperature (T
L
)
Time Maintained Above T
L
(t
L
)
Peak Temperature (T
P
)
Time of Actual T
P
− 5°C (t
P
)
Ramp-Down Rate
Time 25°C to Peak Temperature
1
2
10271-015
Sn63/Pb37
3°C/sec max
100°C
150°C
60 sec to 120 sec
3°C/sec max
183°C
60 sec to 150 sec
240 + 0/−5°C
10 sec to 30 sec
6°C/sec max
6 minutes max
Condition
Pb-Free
3°C/sec max
150°C
200°C
60 sec to 180 sec
3°C/sec max
217°C
60 sec to 150 sec
260 + 0/−5°C
20 sec to 40 sec
6°C/sec max
8 minutes max
Based on JEDEC Standard J-STD-020D.1.
For best results, the soldering profile should be in accordance with the recommendations of the manufacturer of the solder paste used.
Rev. 0 | Page 33 of 36
AD [ ANALOG DEVICES ]
