SSM2211
ABSOLUTE MAXIMUM RATINGS
Absolute maximum ratings apply at 25°C, unless otherwise noted.
Table 4.
Parameter
Supply Voltage
Input Voltage
Common-Mode Input Voltage
ESD Susceptibility
Storage Temperature Range
Operating Temperature Range
Junction Temperature Range
Lead Temperature Range, Soldering (60 sec)
Rating
6V
V
DD
V
DD
2000 V
−65°C to +150°C
−40°C to +85°C
−65°C to +165°C
300°C
THERMAL RESISTANCE
θ
JA
is specified for the worst-case conditions, that is, a device
soldered in a circuit board for surface-mount packages.
Table 5. Thermal Resistance
Package Type
8-Lead LFCSP_VD (CP-Suffix)
8-Lead SOIC_N (S-Suffix)
1
θ
JA
50
121
Unit
°C/W
°C/W
For the LFCSP_VD,
θ
JA
is measured with exposed lead frame soldered to the
printed circuit board.
2
For the SOIC_N,
θ
JA
is measured with the device soldered to a 4-layer printed
circuit board.
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
ESD CAUTION
Rev. D | Page 5 of 24
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