AMS2931
ELECTRICAL CHARACTERISTICS
Electrical Characteristics at V
IN
=14V, V
OUT
=3V I
O
=10mA, T
J
=25°C, R1 =27k, C2 = 100µF unless otherwise specified.
PARAMETER
Adjustable Version
Reference Voltage
I
O
≤
100 mA, -40°C
≤T ≤
125°C, R1=27k,
J
CONDITIONS
(Note 2)
Min.
1.14
AMS2931C
Typ.
1.20
Units
Max.
1.26
1.32
V
V
V
1.5
1
0.2
0.6
1
1
mV/V
%
V
V
mA
mA
mA
µV
rms
/V
mΩ
%/1000hr
%/V
V
V
V
V
Measured from V
OUT
to Adjust Pin
Output Voltage Range
Line Regulation
Load Regulation
Dropout Voltage
V
OUT
+ 0.6V
≤V ≤
26V
IN
1.08
3
24
.02
0.3
0.05
0.3
0.4
15
0.8
100
40
0.4
0.02
26
33
70
-30
-80
5mA
≤I ≤
100 mA
O
I
≤
10 mA
O
I = 100 mA
O
Quiescent Current
I = 10 mA
O
I = 100 mA
O
During Shutdown R
L
= 500Ω
Output Noise Voltage
Output Impedance
Long Term Stability
Ripple Rejection
Maximum Operational Input
Voltage
Maximum Line Transient
Reverse Polarity Input Voltage,
D/C
Reverse Polarity Input Voltage,
Transient
On/Off Threshold Voltage
On
Off
On/Off Threshold Current
3.25
I
O
= 10mA, Reference Voltage
≤
1.5V
T = 1ms,
τ ≤100ms
R
L
= 500Ω, V
O
≥
-0.3V
R
L
= 500Ω, T = 1ms,
τ ≤100ms
V
O
= 3V
-15
-50
10Hz-100kHz
100mA
DC
and 10mA
rms
,100Hz=10kHz
T =1000hr
f
O
= 120Hz
60
2.0
2.2
20
1.2
50
V
V
µA
Note 1:
Absolute Maximum Ratings are limits beyond which damage to the device may occur. For guaranteed performance limits and associated test conditions, see
the Electrical Characteristics tables.
Note 2:
See Circuit in Typical Applications. To ensure constant junction temperature, low duty cycle pulse testing is used.
Note 3:
Limits appearing in
boldface
type apply over the entire junction temperature range for operation. Limits appearing in normal type apply for
T
A
= T
J
= 25°C.
Note 4:
The junction-to-ambient thermal resistance are as follows: 195°C/W for the TO-92 (N) package, 160°C/W for the molded plastic SO-8 (S), 50°C/W for the
TO-220 package and 73°C/W for the TO-263 package. If the TO-220 package is used with a heat sink,
θ
JA
is the sum of the package thermal resistance junction-to-
case of 3°C/W and the thermal resistance added by the heat sink and the thermal interface. The thermal resistance of the TO-263 package can be reduced by
increasing the PCB copper area thermally connected to the package: using 0.5 square inches of copper area,
ϕ
JA
is 50°C/W; with 1 square inch of copper area
ϕ
JA
is
37°C/W; and with 1.6 or more square inches of copper area
ϕ
JA
is 32°C/W.
Advanced Monolithic Systems, Inc.
6680B Sierra Lane, Dublin, CA 94568 Phone (925) 556-9090 Fax (925) 556-9140
ADMOS [ ADVANCED MONOLITHIC SYSTEMS ]
