Small Outline SO-8 Package
8
7
6
5
3.937
±
0.127
(0.155
±
0.005)
PIN ONE
1
0.406
±
0.076
(0.016
±
0.003)
2
XXX
YWW
5.994
±
0.203
(0.236
±
0.008)
TYPE NUMBER
(LAST 3 DIGITS)
DATE CODE
3
4
1.270 BSG
(0.050)
* 5.080
±
0.127
(0.200
±
0.005)
7°
0.432
(0.017)
45° X
3.175
±
0.127
(0.125
±
0.005)
0 ~ 7°
1.524
(0.060)
0.203
±
0.102
(0.008
±
0.004)
0.228
±
0.025
(0.009
±
0.001)
*
TOTAL PACKAGE LENGTH (INCLUSIVE OF MOLD FLASH)
5.207
±
0.254 (0.205
±
0.010)
DIMENSIONS IN MILLIMETERS (INCHES).
LEAD COPLANARITY = 0.10 mm (0.004 INCHES) MAX.
0.305 MIN.
(0.012)
Solder Reflow Temperature Profile
(Surface Mount Option Parts)
260
240
220
200
180
160
140
120
100
80
60
40
20
0
0
Regulatory Information
The HCPL-260L/060L/263L/063L
are pending by the following
organizations:
∆T
= 145°C, 1°C/SEC
∆T
= 115°C, 0.3°C/SEC
UL
TEMPERATURE –
°C
Approval (pending) under UL
1577, Component Recognition
Program, File E55361.
∆T
= 100°C, 1.5°C/SEC
CSA
1
2
3
4
5
6
7
8
9
10
11
12
Approval (pending) under CSA
Component Acceptance Notice
#5, File CA 88324.
VDE
TIME – MINUTES
NOTE: USE OF NON-CHLORINE ACTIVATED FLUXES IS HIGHLY RECOMMENDED.
Approval (pending) according to
VDE 0884/06.92.
6 − 107
AGILENT [ AGILENT TECHNOLOGIES, LTD. ]
