4
11
7
3
6
10
PWD (ns)
T
R
(ns)
2
T
F
(ns)
5
4
9
1
3
0
0
20
40
T
A
(C)
60
80
8
0
20
40
T
A
(C)
60
80
2
0
20
40
T
A
(C)
60
80
Figure 4. Typical pulse width distortion vs.
temperature.
Figure 5. Typical rise time vs. temperature.
Figure 6. Typical fall time vs. temperature.
29
27
T
PLH
, T
PHL
(ns)
25
23
21
T
PLH
19
17
15
15
20
25
30
35
40
45
50
6
5
4
PWD (ns)
T
R
(ns)
T
PHL
21
19
17
15
13
11
9
7
5
3
3
2
1
0
15
20
25
30
35
40
45
50
1
0
5
10
15
20
25
30
35
C
I
(pF)
C
I
(pF)
C
I
(pF)
Figure 7. Typical propagation delays vs.
output load capacitance.
Figure 8. Typical pulse width distortion vs.
output load capacitance.
Figure 9. Typical rise time vs. load
capacitance.
OUTPUT POWER – P
S
, INPUT CURRENT – I
S
OUTPUT POWER – P
S
, INPUT CURRENT – I
S
10
9
8
FALL TIME (ns)
800
700
600
500
400
300
(230)
200
100
0
0
STANDARD 8 PIN DIP PRODUCT
P
S
(mW)
I
S
(mA)
800
700
600
500
400
300
200
(150)
100
0
0
SURFACE MOUNT SO8 PRODUCT
P
S
(mW)
I
S
(mA)
7
6
5
4
3
2
1
0
0
5
10
15
20
25
30
35
25
50
75 100 125 150 175 200
25
50
75 100 125 150 175 200
C
I
(pF)
T
A
– CASE TEMPERATURE – °C
T
A
– CASE TEMPERATURE – °C
Figure 10. Typical fall time vs. load
capacitance.
Figure 11. Thermal derating curve, dependence of Safety Limiting Value with case temperature
per IEC/EN/DIN EN 60747-5-2.
8
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