PB5006 thru PB5010
General Semiconductor
PACKAGE OUTLINE DIMENSIONS
in inches (millimeters)
Case Type PB
Front Side View
0.118 (3.0) x 45°
CHAMFER
1.193 (30.3)
1.169 (29.7)
0.201 (5.1)
0.177 (4.5)
Side View
0.161 (4.1)
0.138 (3.5)
0.441 (11.2)
0.425 (10.8)
0.106 (2.70)
0.091 (2.30)
0.094 (2.40)
0.079 (2.00)
0.799 (20.3)
0.776 (19.7)
0.205 (5.20)
0.189 (4.80)
0.165 (4.20)
0.150 (3.80) 0.708 (18.0)
0.669 (17.0)
0.145 (3.7)
0.130 (3.3)
120° TYP.
5° TYP.
0.134 (3.4)
0.118 (3.0)
5° TYP.
0.118 (3.0)
0.102 (2.6)
0.043 (1.10)
0.035 (0.90)
0.402 (10.2)
0.386 (9.80)
0.303 (7.70)
0.287 (7.30)
0.303 (7.70)
0.287 (7.30)
0.032 (0.80)
0.024 (0.60)
Back Side View
1.041 (26.44) REF.
0.088 (2.24)
REF.
0.070 (1.78) REF.
0.633 (16.07)
REF.
0.066 (1.68)
REF.
0.214 (5.44) REF.
ASEMI [ 台湾ASEMI ]
