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HCPL-2530 参数 Datasheet PDF下载

HCPL-2530图片预览
型号: HCPL-2530
PDF下载: 下载PDF文件 查看货源
内容描述: 双通道高速光电耦合器高密度封装 [Dual Channel, High Speed Optocouplers High density packaging]
分类和应用: 光电输出元件
文件页数/大小: 14 页 / 179 K
品牌: AVAGO [ AVAGO TECHNOLOGIES LIMITED ]
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The SO-8 does not require “through holes” in a PCB.
This package occupies approximately one-third the
footprint area of the standard dual-in-line package. The
lead profile is designed to be compatible with standard
surface mount processes.
The HCPL-2530/0530 is for use in TTL/CMOS, TTL/LSTTL
or wide bandwidth analog applications. Current transfer
ratio (CTR) for the HCPL-2530/0530 is 7% minimum at I
F
= 16 mA.
The HCPL-2531/0531 is designed for high speed TTL/TTL
applications. A standard 16 mA TTL sink current through
the input LED will provide enough output current for 1
TTL load and a 5.6 k: pull-up resistor. CTR of the HCPL-
2531/0531 is 19% minimum at I
F
= 16 mA.
The HCPL-4534/0534 is an HCPL-2531/0531 with
increased common mode transient immunity of 15,000
V/μs minimum at V
CM
= 1500 V guaranteed.
Selection Guide
Minimum CMR
dV/dt
(V/μs)
1,000
8-pin DIP (300 Mil)
Current
Transfer
Ratio (%)
7
19
Small-Outline SO-8
Dual
Channel
Package
HCPL-0530
HCPL-0531
HCPL-0534
Widebody
(400 Mil)
Single
Channel
Package*
HCNW135
HCNW136
HCNW4502
HCNW4503
Hermetic
Single and
Dual Channel
Packages*
V
CM
(V)
10
Dual
Channel
Package
HCPL-2530
HCPL-2531
HCPL-4534
Single
Channel
Package*
6N135
6N136
HCPL-4502
HCPL-4503
Single
Channel
Package*
HCPL-0500
HCPL-0501
HCPL-0452
HCPL-0453
15,000
1,000
1500
10
19
9
HCPL-55XX
HCPL-65XX
4N55
* Technical data for these products are on separate Avago publications.
2