Maximum Solder Reflow Thermal Profile
300
PREHEATING RATE 3˚C + 1˚C/–0.5˚C/SEC.
REFLOW HEATING RATE 2.5˚C ± 0.5˚C/SEC.
PEAK
TEMP.
245˚C
PEAK
TEMP.
240˚C
200
PEAK
TEMP.
230˚C
TEMPERATURE (˚C)
2.5˚C ± 0.5˚C/SEC.
160˚C
150˚C
140˚C
3˚C + 1˚C/–0.5˚C
30
SEC.
30
SEC.
SOLDERING
TIME
200˚C
100
PREHEATING TIME
150˚C, 90 + 30 SEC.
50 SEC.
TIGHT
TYPICAL
LOOSE
0
50
ROOM TEMPERATURE
0
100
TIME (SECONDS)
150
200
250
Note: Use of non-chlorine-activated fluxes is highly recommended.
Recommended Pb-Free IR Profile
tp
Tp
217 ˚C
TL
Tsmax
Tsmin
260 +0/-5 ˚C
TIME WITHIN 5 ˚C of ACTUAL
PEAK TEMPERATURE
20-40 SEC.
TEMPERATURE (˚C)
RAMP-UP
3 ˚C/SEC. MAX.
150 - 200 ˚C
RAMP-DOWN
6 ˚C/SEC. MAX.
ts
PREHEAT
60 to 180 SEC.
25
t 25 ˚C to PEAK
tL
60 to 150 SEC.
TIME (SECONDS)
NOTES:
THE TIME FROM 25 ˚C to PEAK TEMPERATURE = 8 MINUTES MAX.
Tsmax = 200 ˚C, Tsmin = 150 ˚C
Note: Use of non-chlorine-activated fluxes is highly recommended.
AVAGO [ AVAGO TECHNOLOGIES LIMITED ]
