4.0 Applications
Bt860/861
4.1 PC Board Considerations
Multiport YCrCb to NTSC/PAL /SECAM
Table 4-1. Typical Parts List
Location
Description
Vendor
Part Number
CSR13F476KM
C1, C15
C16
47 µF Capacitor
Mallory
AVX
5% 270 pF Ceramic Capacitor
5% 330 pF Ceramic Capacitor
5% 22 pF Ceramic Capacitor
5% 33 pF Ceramic Capacitor
08055A271JATMA
08055A331JATMA
08055A220JATMA
08055A330JATMA
08053G105ZAT2A
C17
AVX
C18
AVX
C19
AVX
C2
20% 1.0 µF Ceramic
AVX
Capacitor
C20
C3–14
L1
5% 27 pF Ceramic Capacitor
0.1 µF Ceramic Capacitor
Ferrite Bead-Surface Mount
5% 1.8 µH Inductor
AVX
Erie
08055A270JATMA
RPE112Z5U104M50V
2743021447
Fair-Rite
KOA
HP
L2
KL32TEIR8J
P
Dual Schottky Diodes
1 MΩ Resistor
BAT54F
R1
DALE
CRCW08051004FRT1
R
DALE
CRCW080575ROFRT1
CRCW08053010FRT1
1% 75 Ω Metal Film Resister
load
RSET1,
RSET2
1% 301 Ω Metal Film Resistor Dale
TRAP
Ceramic Resonator
Murata
TPSx.xMJ
(where x.x = sound carrier
frequency in MHz)
XTAL
50 ppm, 14.31818 MHz
Fundamental Crystal
Hooray
H1431818-18
NOTE(S): Vendor numbers are listed only as a guide. Substitution of devices with similar
characteristics will not affect BT860/861 performance.
4.1.5 COMP Decoupling
The COMP1 and COMP2 pins should be decoupled to the closest VAA pin with a
0.1 µF ceramic capacitor. Greater low-frequency supply noise will require a
larger value. The COMP1 and COMP2 capacitors must be as close as possible to
the COMP1, COMP2, and VAA pins.
4.1.6 VREF Decoupling
A 1.0 µF ceramic capacitor should be used to decouple VREF to AGND.
4.1.7 VBIAS Decoupling
A 0.1 µF ceramic capacitor should be used to decouple VBIAS1 and VBIAS2 to
AGND.
4-4
Conexant
D860DSA
CONEXANT [ CONEXANT SYSTEMS, INC ]
