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FDS4465 参数 Datasheet PDF下载

FDS4465图片预览
型号: FDS4465
PDF下载: 下载PDF文件 查看货源
内容描述: P沟道1.8V指定的PowerTrench MOSFET [P-Channel 1.8V Specified PowerTrench MOSFET]
分类和应用: 晶体晶体管功率场效应晶体管开关脉冲光电二极管PC
文件页数/大小: 5 页 / 137 K
品牌: FAIRCHILD [ FAIRCHILD SEMICONDUCTOR ]
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FDS4465
Electrical Characteristics
Symbol
BV
DSS
∆BV
DSS
∆T
J
I
DSS
I
GSSF
I
GSSR
T
A
= 25°C unless otherwise noted
Parameter
Drain–Source Breakdown Voltage
Breakdown Voltage Temperature
Coefficient
Zero Gate Voltage Drain Current
Gate–Body Leakage, Forward
Gate–Body Leakage, Reverse
(Note 2)
Test Conditions
V
GS
= 0 V, I
D
= –250
µA
I
D
= –250
µA,
Referenced to 25°C
V
DS
= –16 V,
V
GS
= 8 V,
V
GS
= –8 V,
V
GS
= 0 V
V
DS
= 0 V
V
DS
= 0 V
Min
–20
Typ
Max Units
V
Off Characteristics
–12
–1
100
–100
mV/°C
µA
nA
nA
On Characteristics
V
GS(th)
∆V
GS(th)
∆T
J
R
DS(on)
Gate Threshold Voltage
Gate Threshold Voltage
Temperature Coefficient
Static Drain–Source
On–Resistance
V
DS
= V
GS
, I
D
= –250
µA
I
D
= –250
µA,
Referenced to 25°C
V
GS
= –4.5 V,
I
D
= –13.5 A
I
D
= –12 A
V
GS
= –2.5 V,
I
D
= –10.5 A
V
GS
= –1.8 V,
V
GS
=–4.5 V, I
D
=–13.5A, T
J
=125°C
V
GS
= –4.5 V,
V
DS
= –5 V,
V
DS
= –5 V
I
D
= –13.5 A
–0.4
–0.6
3
6.7
8.0
9.8
9.0
–1.5
V
mV/°C
8.5
10.5
14
13
mΩ
I
D(on)
g
FS
On–State Drain Current
Forward Transconductance
–50
70
A
S
Dynamic Characteristics
C
iss
C
oss
C
rss
Input Capacitance
Output Capacitance
Reverse Transfer Capacitance
(Note 2)
V
DS
= –10 V,
f = 1.0 MHz
V
GS
= 0 V,
8237
1497
750
pF
pF
pF
Switching Characteristics
t
d(on)
t
r
t
d(off)
t
f
Q
g
Q
gs
Q
gd
Turn–On Delay Time
Turn–On Rise Time
Turn–Off Delay Time
Turn–Off Fall Time
Total Gate Charge
Gate–Source Charge
Gate–Drain Charge
V
DD
= –10V,
V
GS
= –4.5 V,
I
D
= –1 A,
R
GEN
= 6
20
24
300
140
36
38
480
224
120
ns
ns
ns
ns
nC
nC
nC
V
DS
= –10 V,
V
GS
= –4.5 V
I
D
= –13.5 A,
86
20
11
Drain–Source Diode Characteristics and Maximum Ratings
I
S
V
SD
Maximum Continuous Drain–Source Diode Forward Current
Drain–Source Diode Forward
V
GS
= 0 V, I
S
= –2.1 A
Voltage
–2.1
(Note 2)
A
V
–0.6
–1.2
Notes:
1.
R
θJA
is the sum of the junction-to-case and case-to-ambient thermal resistance where the case thermal reference is defined as the solder mounting surface of
the drain pins. R
θJC
is guaranteed by design while R
θCA
is determined by the user's board design.
a) 50 °C/W when
2
mounted on a 1in
pad of 2 oz copper
b) 105 °C/W when
mounted on a .04 in
2
pad of 2 oz copper
c) 125 °C/W when mounted on a
minimum pad.
Scale 1 : 1 on letter size paper
2.
Pulse Test: Pulse Width < 300µs, Duty Cycle < 2.0%
FDS4465 Rev C1 (W)