Peripheral operating requirements and behaviors
Table 16. 32kHz oscillator DC electrical specifications (continued)
Symbol
C
para
V
pp1
Description
Parasitical capacitance of EXTAL32 and XTAL32
Peak-to-peak amplitude of oscillation
Min.
—
—
Typ.
5
0.6
Max.
7
—
Unit
pF
V
1. When a crystal is being used with the 32 kHz oscillator, the EXTAL32 and XTAL32 pins should only be connected to
required oscillator components and must not be connected to any other devices.
6.3.3.2
Symbol
f
osc_lo
t
start
f
ec_extal32
v
ec_extal32
32kHz oscillator frequency specifications
Description
Oscillator crystal
Crystal start-up time
Externally provided input clock frequency
Externally provided input clock amplitude
Min.
—
—
—
700
Table 17. 32kHz oscillator frequency specifications
Typ.
32.768
1000
32.768
—
Max.
—
—
—
V
BAT
Unit
kHz
ms
kHz
mV
Notes
1. Proper PC board layout procedures must be followed to achieve specifications.
2. This specification is for an externally supplied clock driven to EXTAL32 and does not apply to any other clock input. The
oscillator remains enabled and XTAL32 must be left unconnected.
3. The parameter specified is a peak-to-peak value and V
IH
and V
IL
specifications do not apply. The voltage of the applied
clock must be within the range of V
SS
to V
BAT
.
6.4 Memories and memory interfaces
6.4.1 Flash electrical specifications
This section describes the electrical characteristics of the flash memory module.
6.4.1.1
Flash timing specifications — program and erase
The following specifications represent the amount of time the internal charge pumps are
active and do not include command overhead.
Table 18. NVM program/erase timing specifications
Symbol
t
hvpgm4
t
hversscr
t
hversblk32k
Description
Longword Program high-voltage time
Sector Erase high-voltage time
Erase Block high-voltage time for 32 KB
Min.
—
—
—
—
Typ.
7.5
13
52
52
Max.
18
113
452
452
Unit
μs
ms
ms
ms
Notes
t
hversblk128k
Erase Block high-voltage time for 128 KB
1. Maximum time based on expectations at cycling end-of-life.
K10 Sub-Family Data Sheet, Rev. 4 5/2012.
30
Freescale Semiconductor, Inc.