Peripheral operating requirements and behaviors
5.4.2 Thermal attributes
Table 10. Thermal attributes
Board type
Single-layer (1S)
Symbol
R
θJA
Description
Thermal resistance, junction
to ambient (natural
convection)
Thermal resistance, junction
to ambient (natural
convection)
Thermal resistance, junction
to ambient (200 ft./min. air
speed)
Thermal resistance, junction
to ambient (200 ft./min. air
speed)
Thermal resistance, junction
to board
Thermal resistance, junction
to case
Thermal characterization
parameter, junction to
package top outside center
(natural convection)
80
LQFP
70
64
LQFP
71
48 QFN
84
32 QFN
92
Unit
°C/W
Notes
Four-layer (2s2p)
R
θJA
53
52
28
33
°C/W
Single-layer (1S)
R
θJMA
—
59
69
75
°C/W
Four-layer (2s2p)
R
θJMA
—
46
22
27
°C/W
—
—
—
R
θJB
R
θJC
Ψ
JT
34
15
0.6
34
20
5
10
2.0
5.0
12
1.8
8
°C/W
°C/W
°C/W
1. Determined according to JEDEC Standard JESD51-2,
Integrated Circuits Thermal Test Method Environmental Conditions
—Natural Convection (Still Air),
or EIA/JEDEC Standard JESD51-6,
Integrated Circuit Thermal Test Method
Environmental Conditions—Forced Convection (Moving Air).
2. Determined according to JEDEC Standard JESD51-8,
Integrated Circuit Thermal Test Method Environmental Conditions
—Junction-to-Board.
3. Determined according to Method 1012.1 of MIL-STD 883,
Test Method Standard, Microcircuits,
with the cold plate
temperature used for the case temperature. The value includes the thermal resistance of the interface material between
the top of the package and the cold plate.
4. Determined according to JEDEC Standard JESD51-2,
Integrated Circuits Thermal Test Method Environmental Conditions
—Natural Convection (Still Air).
6 Peripheral operating requirements and behaviors
6.1 Core modules
6.1.1 SWD Electricals
Table 11. SWD full voltage range electricals
Symbol
Description
Operating voltage
Table continues on the next page...
Min.
1.71
Max.
3.6
Unit
V
KL24 Sub-Family Data Sheet Data Sheet, Rev. 3, 9/19/2012.
Freescale Semiconductor, Inc.
23
FREESCALE [ FREESCALE SEMICONDUCTOR, INC ]
