Thermal
Table 60. Heat Sink and Thermal Resistance of MPC8343EA (PBGA) (continued)
29
×
29 mm PBGA
Heat Sink Assuming Thermal Grease
MEI, 75
×
85
×
12 no adjacent board, extrusion
MEI, 75
×
85
×
12 no adjacent board, extrusion
MEI, 75
×
85
×
12 mm, adjacent board, 40 mm side bypass
Air Flow
Thermal Resistance
1 m/s
2 m/s
1 m/s
7.7
6.6
6.9
Accurate thermal design requires thermal modeling of the application environment using computational
fluid dynamics software which can model both the conduction cooling and the convection cooling of the
air moving through the application. Simplified thermal models of the packages can be assembled using the
junction-to-case and junction-to-board thermal resistances listed in the thermal resistance table. More
detailed thermal models can be made available on request.
Heat sink vendors include the following list:
Aavid Thermalloy
80 Commercial St.
Concord, NH 03301
Internet: www.aavidthermalloy.com
Alpha Novatech
473 Sapena Ct. #12
Santa Clara, CA 95054
Internet: www.alphanovatech.com
International Electronic Research Corporation (IERC)
413 North Moss St.
Burbank, CA 91502
Internet: www.ctscorp.com
Millennium Electronics (MEI)
Loroco Sites
671 East Brokaw Road
San Jose, CA 95112
Internet: www.mei-thermal.com
Tyco Electronics
Chip Coolers™
P.O. Box 3668
Harrisburg, PA 17105-3668
Internet: www.chipcoolers.com
Wakefield Engineering
33 Bridge St.
Pelham, NH 03076
Internet: www.wakefield.com
603-224-9988
408-567-8082
818-842-7277
408-436-8770
800-522-2800
603-635-5102
MPC8343EA PowerQUICC II Pro Integrated Host Processor Hardware Specifications, Rev. 10
70
Freescale Semiconductor
FREESCALE [ FREESCALE SEMICONDUCTOR, INC ]
