Overview
— Up to four physical banks (chip selects), each bank up to 1 Gbyte independently addressable
— DRAM chip configurations from 64 Mbits to 1 Gbit with ×8/×16 data ports
— Full error checking and correction (ECC) support
— Support for up to 16 simultaneous open pages (up to 32 pages for DDR2)
— Contiguous or discontiguous memory mapping
— Read-modify-write support
— Sleep-mode support for SDRAM self refresh
— Auto refresh
— On-the-fly power management using CKE
— Registered DIMM support
— 2.5-V SSTL2 compatible I/O for DDR1, 1.8-V SSTL2 compatible I/O for DDR2
Dual three-speed (10/100/1000) Ethernet controllers (TSECs)
•
— Dual controllers designed to comply with IEEE 802.3™, 802.3u™, 820.3x™, 802.3z™,
802.3ac™ standards
— Ethernet physical interfaces:
– 1000 Mbps IEEE Std. 802.3 GMII/RGMII, IEEE Std. 802.3z TBI/RTBI, full-duplex
– 10/100 Mbps IEEE Std. 802.3 MII full- and half-duplex
— Buffer descriptors are backward-compatible with MPC8260 and MPC860T 10/100
programming models
— 9.6-Kbyte jumbo frame support
— RMON statistics support
— Internal 2-Kbyte transmit and 2-Kbyte receive FIFOs per TSEC module
— MII management interface for control and status
— Programmable CRC generation and checking
PCI interface
•
— Designed to comply with PCI Specification Revision 2.3
— Data bus width:
– 32-bit data PCI interface operating at up to 66 MHz
— PCI 3.3-V compatible
— PCI host bridge capabilities
— PCI agent mode on PCI interface
— PCI-to-memory and memory-to-PCI streaming
— Memory prefetching of PCI read accesses and support for delayed read transactions
— Posting of processor-to-PCI and PCI-to-memory writes
— On-chip arbitration supporting five masters on PCI
— Accesses to all PCI address spaces
— Parity supported
— Selectable hardware-enforced coherency
MPC8347EA PowerQUICC II Pro Integrated Host Processor Hardware Specifications, Rev. 12
Freescale Semiconductor
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FREESCALE [ Freescale ]
