Thermal
Table 64. Suggested PLL Configurations (continued)
RCWL
Ref
No.
1
400 MHz Device
Input
Clock
Freq
(MHz)
2
CSB
Freq
(MHz)
—
—
—
Core
Freq
(MHz)
533 MHz Device
Input
Clock
Freq
(MHz)
2
CSB
Freq
(MHz)
—
—
—
Core
Freq
(MHz)
667 MHz Device
Input
Clock
Freq
(MHz)
2
66
66
66
CSB
Freq
(MHz)
200
266
333
Core
Freq
(MHz)
600
667
667
SPMF
CORE
PLL
0000110
0000101
0000100
306
405
504
1
2
0011
0100
0101
The PLL configuration reference number is the hexadecimal representation of RCWL, bits 4–15 associated with the SPMF and
COREPLL settings given in the table.
The input clock is CLKIN for PCI host mode or PCI_CLK for PCI agent mode.
20 Thermal
This section describes the thermal specifications of the MPC8347EA.
20.1
Thermal Characteristics
Table 65. Package Thermal Characteristics for TBGA
Characteristic
Symbol
R
θJA
R
θJMA
R
θJMA
R
θJMA
R
θJMA
R
θJMA
R
θJB
R
θJC
Value
14
11
11
8
9
7
3.8
1.7
Unit
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
Notes
1, 2
1, 3
1, 3
1, 3
1, 3
1, 3
4
5
provides the package thermal characteristics for the 672 35
×
35 mm TBGA of the MPC8347EA.
Junction-to-ambient natural convection on single-layer board (1s)
Junction-to-ambient natural convection on four-layer board (2s2p)
Junction-to-ambient (at 200 ft/min) on single-layer board (1s)
Junction-to-ambient (at 200 ft/min) on four-layer board (2s2p)
Junction-to-ambient (at 2 m/s) on single-layer board (1s)
Junction-to-ambient (at 2 m/s) on four-layer board (2s2p)
Junction-to-board thermal
Junction-to-case thermal
MPC8347EA PowerQUICC II Pro Integrated Host Processor Hardware Specifications, Rev. 12
84
Freescale Semiconductor
FREESCALE [ FREESCALE SEMICONDUCTOR, INC ]
