GS1559 Data Sheet
2.4 Solder Reflow Profiles
The GS1559 is available in a Pb or Pb-free package. It is recommended that the
Pb package be soldered with Pb paste using the Standard Eutectic profile shown
in
and the Pb-free package be soldered with Pb-free paste using the
reflow profile shown in
NOTE: It is possible to solder a Pb-free package with Pb paste using a Standard
Eutectic profile with a reflow temperature maintained at 245
o
C – 250
o
C.
Temperature
60-150 sec.
10-20 sec.
230˚C
220˚C
3˚C/sec max
183˚C
6˚C/sec max
150˚C
100˚C
25˚C
Time
120 sec. max
6 min. max
Figure 2-1: Standard Eutectic Solder Reflow Profile (Pb package, Pb paste)
Temperature
60-150 sec.
20-40 sec.
260˚C
250˚C
3˚C/sec max
217˚C
6˚C/sec max
200˚C
150˚C
25˚C
Time
60-180 sec. max
8 min. max
Figure 2-2: Maximum Pb-free Solder Reflow Profile (Pb-free package, Pb-free
paste)
30572 - 4
July 2005
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GENNUM [ GENNUM CORPORATION ]
