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    550 参数 Datasheet PDF下载

    550图片预览
    型号： 550
    PDF下载： 下载PDF文件 查看货源
    内容描述： 奔腾4处理器，支持超线程技术 [Pentium 4 Processors Supporting Hyper-Threading Technology]
    分类和应用：
    文件页数/大小： 96 页 / 1585 K
    品牌： INTEL [ INTEL CORPORATION ]
     浏览型号550的Datasheet PDF文件第1页浏览型号550的Datasheet PDF文件第2页浏览型号550的Datasheet PDF文件第3页浏览型号550的Datasheet PDF文件第4页浏览型号550的Datasheet PDF文件第6页浏览型号550的Datasheet PDF文件第7页浏览型号550的Datasheet PDF文件第8页浏览型号550的Datasheet PDF文件第9页  
    Contents
    Figures
    2-1
    2-2
    2-3
    2-4
    3-1
    3-2
    3-3
    3-4
    3-5
    3-6
    3-7
    4-1
    4-2
    5-1
    5-2
    5-3
    5-4
    6-1
    7-1
    7-2
    7-3
    7-4
    7-5
    7-6
    7-7
    7-8
    7-9
    Phase Lock Loop (PLL) Filter Requirements.............................................................................. 19
    VCC Static and Transient Tolerance for 775_VR_CONFIG_04A............................................... 28
    VCC Static and Transient Tolerance for 775_VR_CONFIG_04B............................................... 30
    VCC Overshoot Example Waveform .......................................................................................... 33
    Processor Package Assembly Sketch ........................................................................................ 35
    Processor Package Drawing 1 ................................................................................................... 36
    Processor Package Drawing 2 ................................................................................................... 37
    Processor Package Drawing 3 ................................................................................................... 38
    Processor Top-Side Marking Example ....................................................................................... 40
    Processor Top-Side Marking Example for Processors Supporting Intel
    ®
    EM64T ...................... 41
    Processor Land Coordinates (Top View).................................................................................... 42
    Landout Diagram (Top View – Left Side).................................................................................... 44
    Landout Diagram (Top View – Right Side) ................................................................................. 45
    Thermal Profile for Processors with PRB = 1 ............................................................................. 77
    Thermal Profile for Processors with PRB = 0 ............................................................................. 78
    Case Temperature (TC) Measurement Location ........................................................................ 79
    Thermal Monitor 2 Frequency and Voltage Ordering .................................................................81
    Processor Low Power State Machine......................................................................................... 87
    Mechanical Representation of the Boxed Processor.................................................................. 89
    Space Requirements for the Boxed Processor (Side View) ....................................................... 90
    Space Requirements for the Boxed Processor (Top View) ........................................................ 90
    Space Requirements for the Boxed Processor (Overall View) ................................................... 91
    Boxed Processor Fan Heatsink Power Cable Connector Description ........................................ 92
    Baseboard Power Header Placement Relative to Processor Socket ......................................... 93
    Boxed Processor Fan Heatsink Airspace Keepout Requirements (Top View) ........................... 94
    Boxed Processor Fan Heatsink Airspace Keepout Requirements (Side View) .......................... 94
    Boxed Processor Fan Heatsink Set Points................................................................................. 95
    Datasheet
    5

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