X9313
Mini Small Outline Plastic Packages (MSOP)
N
M8.118 (JEDEC MO-187AA)
8 LEAD MINI SMALL OUTLINE PLASTIC PACKAGE
E1
-B-
E
INCHES
SYMBOL
A
A B C
MILLIMETERS
MIN
0.94
0.05
0.75
0.25
0.09
2.95
2.95
4.75
0.40
8
-
-
0.07
0.07
5
o
0
o
-
-
15
o
6
o
MAX
1.10
0.15
0.95
0.36
0.20
3.05
3.05
5.05
0.70
NOTES
-
-
-
9
-
3
4
-
-
6
-
7
-
-
-
-
Rev. 2 01/03
MIN
0.037
0.002
0.030
0.010
0.004
0.116
0.116
0.187
0.016
8
0.003
0.003
5
o
0
o
MAX
0.043
0.006
0.037
0.014
0.008
0.120
0.120
0.199
0.028
INDEX
AREA
1 2
TOP VIEW
0.20 (0.008)
A1
A2
4X
θ
0.25
(0.010)
GAUGE
PLANE
SEATING
PLANE -C-
R1
R
b
c
D
E1
A
A2
4X
θ
L
L1
e
E
L
L1
N
R
0.026 BSC
0.65 BSC
A1
-H-
e
D
b
0.10 (0.004)
-A-
0.20 (0.008)
C
SEATING
PLANE
0.037 REF
0.95 REF
C
a
C
L
E
1
C
R1
0
SIDE VIEW
15
o
6
o
α
-B-
0.20 (0.008)
C D
END VIEW
NOTES:
1. These package dimensions are within allowable dimensions of
JEDEC MO-187BA.
2. Dimensioning and tolerancing per ANSI Y14.5M-1994.
3. Dimension “D” does not include mold flash, protrusions or gate
burrs and are measured at Datum Plane. Mold flash, protrusion
and gate burrs shall not exceed 0.15mm (0.006 inch) per side.
4. Dimension “E1” does not include interlead flash or protrusions
and are measured at Datum Plane.
- H -
Interlead flash and
protrusions shall not exceed 0.15mm (0.006 inch) per side.
5. Formed leads shall be planar with respect to one another within
0.10mm (0.004) at seating Plane.
6. “L” is the length of terminal for soldering to a substrate.
7. “N” is the number of terminal positions.
8. Terminal numbers are shown for reference only.
9. Dimension “b” does not include dambar protrusion. Allowable
dambar protrusion shall be 0.08mm (0.003 inch) total in excess
of “b” dimension at maximum material condition. Minimum space
between protrusion and adjacent lead is 0.07mm (0.0027 inch).
10. Datums
-A -
-H-
.
and
- B -
to be determined at Datum plane
11. Controlling dimension: MILLIMETER. Converted inch dimen-
sions are for reference only.
9
FN8177.5
April 18, 2007
INTERSIL [ INTERSIL CORPORATION ]
