IRF7416PbF
Static Electrical Characteristics @ T
J
= 25°C (unless otherwise specified)
Parameter
Min. Typ. Max. Units
V
(BR)DSS
Drain-to-Source Breakdown Voltage
ΔV
(BR)DSS
/ΔT
J
Breakdown Voltage Temp. Coefficient
R
DS(on)
V
GS(th)
gfs
I
DSS
I
GSS
Static Drain-to-Source On-Resistance
Gate Threshold Voltage
Forward Transconductance
Drain-to-Source Leakage Current
Gate-to-Source Forward Leakage
Gate-to-Source Reverse Leakage
Conditions
-30
––– –––
V V
GS
= 0V, I
D
= -250μA
––– -0.024 ––– V/°C Reference to 25°C, I
D
= -1mA
V
GS
= -10V, I
D
= -5.6A
––– ––– 0.020
Ω
V
GS
= -4.5V, I
D
= -2.8A
––– ––– 0.035
-1.0 ––– -2.04
V V
DS
= V
GS
, I
D
= -250μA
5.6
––– –––
S V
DS
= -10V, I
D
= -2.8A
V
DS
= -24V, V
GS
= 0V
––– ––– -1.0
μA
V
DS
= -24V, V
GS
= 0V, T
J
= 125°C
––– –––
-25
V
GS
= -20V
––– ––– -100
nA
––– ––– 100
V
GS
= 20V
f
f
Dynamic Electrical Characteristics @ T
J
= 25°C (unless otherwise specified)
Parameter
Min. Typ. Max. Units
Conditions
Q
g
Q
gs
Q
gd
t
d(on)
t
r
t
d(off)
t
f
C
iss
C
oss
C
rss
Total Gate Charge
Gate-to-Source Charge
Gate-to-Drain ("Miller") Charge
Turn-On Delay Time
Rise Time
Turn-Off Delay Time
Fall Time
Input Capacitance
Output Capacitance
Reverse Transfer Capacitance
–––
–––
–––
–––
–––
–––
–––
–––
–––
–––
61
8.0
22
18
49
59
60
1700
890
410
92
12
32
–––
–––
–––
–––
–––
–––
–––
nC
I
D
= -5.6A
V
DS
= -24V
V
GS
= -10V, See Fig. 6 & 9
V
DD
= -15V
I
D
= -5.6A
R
G
= 6.2Ω
R
D
= 2.7Ω, See Fig. 10
V
GS
= 0V
V
DS
= -25V
ƒ = 1.0MHz, See Fig. 5
fÃ
ns
f
pF
Diode Characteristics
Parameter
I
S
I
SM
V
SD
t
rr
Q
rr
Continuous Source Current
(Body Diode)
Pulsed Source Current
(Body Diode)
Diode Forward Voltage
Reverse Recovery Time
Reverse Recovery Charge
Min. Typ. Max. Units
–––
–––
–––
–––
–––
–––
–––
–––
56
99
-3.1
A
-45
-1.0
85
150
V
ns
nC
Conditions
MOSFET symbol
showing the
integral reverse
G
D
Ã
S
p-n junction diode.
T
J
= 25°C, I
S
= -5.6A, V
GS
= 0V
T
J
= 25°C,I
F
= -5.6A
di/dt = 100A/μs
e
e
Notes:
Repetitive rating; pulse width limited by
Starting T
J
= 25°C, L = 25mH
max. junction temperature. ( See fig. 11 )
I
SD
≤
-5.6A, di/dt
≤
100A/µs, V
DD
≤
V
(BR)DSS
,
T
J
≤
150°C
R
G
= 25Ω, I
AS
= -5.6A. (See Figure 12)
Pulse width
≤
300µs; duty cycle
≤
2%.
Surface mounted on FR-4 board, t
≤
10sec.
2
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