Micrel, Inc.
SY10E142
SY100E142
TRUTH TABLE
SEL
L
H
MODE
LOAD
SHIFT
DC ELECTRICAL CHARACTERISTICS
V
EE
= V
EE
(Min.) to V
EE
(Max.); V
CC
= V
CCO
= GND
T
A
= 0
°
C
Symbol
I
IH
I
EE
Parameter
Input HIGH Current
Power Supply Current
10E
100E
—
—
120
120
145
145
—
—
120
120
145
145
—
—
120
138
145
165
—
—
150
T
A
= +25
°
C
—
—
150
T
A
= +85
°
C
Max.
150
Unit
µA
mA
Condition
—
—
—
—
Min. Typ. Max. Min. Typ.
Max. Min. Typ.
AC ELECTRICAL CHARACTERISTICS
V
EE
= V
EE
(Min.) to V
EE
(Max.); V
CC
= V
CCO
= GND
T
A
= 0
°
C
Symbol
f
SHIFT
t
PD
Parameter
Max. Shift Frequency
Propagation Delay to Output
CLK
MR
Set-up Time
D
SEL
Hold Time
D
SEL
Reset Recovery Time
Minimum Pulse Width
CLK, MR
Within-Device Skew
Rise/Fall Time
20% to 80%
700
600
600
50
300
300
75
900
400
—
300
900
800
800
–100
150
100
–150
700
—
75
525
—
1000
1000
—
—
—
—
—
—
—
800
T
A
= +25
°
C
700
600
600
50
300
300
75
900
400
—
300
900
800
800
–100
150
100
–150
700
—
75
525
—
1000
1000
—
—
—
—
—
—
—
800
T
A
= +85
°
C
Max.
—
1000
1000
ps
50
300
300
75
900
400
—
300
–100
150
100
–150
700
—
75
525
—
—
ps
—
—
—
—
—
800
ps
ps
ps
ps
—
—
1
—
—
—
Unit
MHz
ps
600
600
800
800
Condition
—
—
700
900
Min. Typ. Max. Min. Typ.
Max. Min. Typ.
t
S
t
H
t
RR
t
PW
t
skew
t
r
t
f
Note:
1. Within-device skew is defined as identical transitions on similar paths through a device.
M9999-032006
hbwhelp@micrel.com or (408) 955-1690
3
MICREL [ MICREL SEMICONDUCTOR ]
