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MCP9808T-E/MS 参数 Datasheet PDF下载

MCP9808T-E/MS图片预览
型号: MCP9808T-E/MS
PDF下载: 下载PDF文件 查看货源
内容描述: 0.5A ° C最大精度数字温度传感器 [0.5°C Maximum Accuracy Digital Temperature Sensor]
分类和应用: 传感器换能器温度传感器输出元件PC
文件页数/大小: 52 页 / 1124 K
品牌: MICROCHIP [ MICROCHIP TECHNOLOGY ]
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MCP9808
3.0
PIN DESCRIPTION
PIN FUNCTION TABLE
MSOP
1
2
3
4
5
6
7
8
Symbol
SDA
SCL
Alert
GND
A2
A1
A0
V
DD
EP
Serial Data Line
Serial Clock Line
Temperature Alert Output
Ground
Slave Address
Slave Address
Slave Address
Power Pin
Exposed Thermal Pad (EP); must be connected to GND
Pin Function
The descriptions of the pins are listed in
TABLE 3-1:
DFN
1
2
3
4
5
6
7
8
9
3.1
Serial Data Line (SDA)
3.5
Address Pins (A0, A1, A2)
SDA is a bidirectional input/output pin, used to serially
transmit data to/from the host controller. This pin
requires a pull-up resistor. (See
These pins are device address input pins.
The address pins correspond to the Least Significant
bits (LSbs) of the address bits and the Most Significant
bits (MSbs): A6, A5, A4, A3. This is illustrated in
3.2
Serial Clock Line (SCL)
The SCL is a clock input pin. All communication and
timing is relative to the signal on this pin. The clock is
generated by the host or master controller on the bus.
(See
TABLE 3-2:
Device
MCP9808 ADDRESS BYTE
Address Code
A6
A5
0
0
A4
1
0
A3
1
1
Slave
Address
A2
x
x
A1
x
x
A0
x
x
3.3
Temperature Alert, Open-Drain
Output (Alert)
MCP9808
MCP9808
Note 1:
0
1
The MCP9808 temperature Alert output pin is an
open-drain output. The device outputs a signal when the
ambient temperature goes beyond the user-programmed
temperature limit. (See
2:
User-selectable address is shown by ‘x’.
A2, A1 and A0 must match the
corresponding device pin configuration.
Contact factory for this address code.
3.6
Power Pin (V
DD
)
3.4
Ground Pin (GND)
The GND pin is the system ground pin.
V
DD
is the power pin. The operating voltage range, as
specified in the DC electrical specification table, is
applied on this pin.
3.7
Exposed Thermal Pad (EP)
There is an internal electrical connection between the
Exposed Thermal Pad (EP) and the GND pin. The EP
may be connected to the system ground on the Printed
Circuit Board (PCB).
©
2011 Microchip Technology Inc.
DS25095A-page 11