Numonyx™ Embedded Flash Memory (J3 v D, Monolithic)
Table 1:
56-Lead TSOP Dimension Table
Millimeters
Nom
Inches
Nom
Parameter
Symbol
Min
Max
Min
Max
Lead Count
N
q
Y
Z
56
3°
56
3°
Lead Tip Angle
0°
5°
0°
5°
Seating Plane Coplanarity
Lead to Package Offset
0.100
0.350
0.004
0.014
0.150
0.250
0.006
0.010
3.2
Easy BGA Package, 32-, 64-, 128-, and 256-Mbit
Figure 4: Easy BGA Mechanical Specifications
Ball A1
Corner
Ball A1
D
S1
Corner
1
2
3
4
5
6
7
8
8
7
6
5
4
3
2
1
S2
A
B
C
D
E
F
A
B
C
D
E
F
E
G
H
G
H
e
b
Bottom View - Ball Side Up
Top View - Plastic Backside
Complete Ink Mark Not Shown
A1
A2
A
Seating
Plane
Y
Table 2:
Easy BGA Package Dimensions Table (Sheet 1 of 2)
Millimeters
Inches
Symb
Parameter
ol
Note
s
Min
Nom
Max
Min
Nom
Max
Package Height (32, 64, 128, 256 Mbit)
Ball Height
A
1.200
0.0472
A1
A2
b
0.250
0.330
0.0098
0.0130
Package Body Thickness (32, 64, 128, 256 Mbit)
Ball (Lead) Width
0.780
0.430
0.0307
0.0169
0.530
0.0209
December 2007
316577-06
Datasheet
13
NUMONYX [ NUMONYX B.V ]
