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ESDR0524PMUTAG 参数 Datasheet PDF下载

ESDR0524PMUTAG图片预览
型号: ESDR0524PMUTAG
PDF下载: 下载PDF文件 查看货源
内容描述: 瞬态电压抑制器低电容ESD保护高速数据 [Transient Voltage Suppressors Low Capacitance ESD Protection for High Speed Data]
分类和应用: 瞬态抑制器二极管电视光电二极管PC局域网
文件页数/大小: 3 页 / 95 K
品牌: ONSEMI [ ON SEMICONDUCTOR ]
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ESDR0524PMUTAG
Transient Voltage
Suppressors
Low Capacitance ESD Protection for
High Speed Data
The ESDR0524P transient voltage suppressor is designed to protect
high speed data lines from ESD. Ultra−low capacitance and low ESD
clamping voltage make this device an ideal solution for protecting
voltage sensitive high speed data lines. The flow−through style
package allows for easy PCB layout and matched trace lengths
necessary to maintain consistent impedance between high speed
differential lines such as HDMI.
Features
http://onsemi.com
MARKING
DIAGRAM
UDFN10
CASE 517BB
4P MG
G
Low Capacitance (0.3 pF Typical, I/O to I/O)
ESD Rating of Class 3B (Exceeding 8 kV) per Human Body model
and Class C (Exceeding 400 V) per Machine Model
Protection for the Following IEC Standards:
IEC 61000−4−2 (±8 kV Contact)
UL Flammability Rating of 94 V−0
This is a Pb−Free Device
Typical Applications
4P
= Specific Device Code
M
= Date Code
G
= Pb−Free Package
(Note: Microdot may be in either location)
PIN CONFIGURATION
AND SCHEMATIC
N/C N/C
10
1
I/O
9
2
I/O
GND N/C N/C
8
3
GND
7
4
I/O
6
5
I/O
HDMI
DVI
Display Port
MDDI
eSATA
Pin 1
Pin 2
Pin 4
Pin 5
MAXIMUM RATINGS
(T
J
= 25°C unless otherwise noted)
Rating
Operating Junction Temperature Range
Storage Temperature Range
Lead Solder Temperature
Maximum (10 Seconds)
IEC 61000−4−2 Contact (ESD)
IEC 61000−4−2 Air (ESD)
Symbol
T
J
T
stg
T
L
ESD
ESD
Value
−55
to +125
−55
to +150
260
±8.0
±15
Unit
°C
°C
°C
Pin 3,8
ORDERING INFORMATION
kV
kV
Device
ESDR0524PMUTAG
Package
UDFN10
(Pb−Free)
Shipping
3000 /
Tape & Reel
Stresses exceeding Maximum Ratings may damage the device. Maximum
Ratings are stress ratings only. Functional operation above the Recommended
Operating Conditions is not implied. Extended exposure to stresses above the
Recommended Operating Conditions may affect device reliability.
†For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specification
Brochure, BRD8011/D.
See Application Note AND8308/D for further description of
survivability specs.
©
Semiconductor Components Industries, LLC, 2010
July, 2010
Rev. 1
1
Publication Order Number:
ESDR0524P/D