ESDR0524PMUTAG
PACKAGE DIMENSIONS
UDFN10 2.5x1, 0.5P
CASE 517BB−01
ISSUE O
L
D
PIN ONE
REFERENCE
2X
2X
L
A B
L1
E
OPTIONAL
CONSTRUCTIONS
DETAIL A
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ASME Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. DIMENSION b APPLIES TO PLATED
TERMINAL AND IS MEASURED BETWEEN
0.15 AND 0.30mm FROM TERMINAL.
DIM
A
A1
A3
b
b2
D
E
e
L
L1
MILLIMETERS
MIN
MAX
0.55
0.45
0.00
0.05
0.13 REF
0.15
0.25
0.45
0.35
2.50 BSC
1.00 BSC
0.50 BSC
0.30
0.40
---
0.05
0.10 C
0.10 C
0.10 C
10X
A3
A
A1
0.08 C
SIDE VIEW
2X
DETAIL A
A1
C
SEATING
PLANE
b2
1
5
10X
L
10
6
8X
e
b
0.10 C A
B
PACKAGE
OUTLINE
BOTTOM VIEW
0.05 C
NOTE 3
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
ON Semiconductor
and
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“Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All
operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights
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3
ÉÉÉ
ÉÉÉ
ÇÇÇ
DETAIL B
0.50
10X
ÍÍÍ
ÍÍÍ
DETAIL B
TOP VIEW
EXPOSED Cu
MOLD CMPD
A3
OPTIONAL
CONSTRUCTION
RECOMMENDED
SOLDERING FOOTPRINT*
2X
0.45
1.30
0.50
PITCH
8X
0.25
DIMENSIONS: MILLIMETERS
ESDR0524P/D
ONSEMI [ ON SEMICONDUCTOR ]
