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MC74HC165AFG 参数 Datasheet PDF下载

MC74HC165AFG图片预览
型号: MC74HC165AFG
PDF下载: 下载PDF文件 查看货源
内容描述: 8位串行或并行输入/串行输出移位寄存器高性能硅栅CMOS [8−Bit Serial or Parallel−Input/ Serial−Output Shift Register High−Performance Silicon−Gate CMOS]
分类和应用: 移位寄存器触发器逻辑集成电路光电二极管
文件页数/大小: 12 页 / 135 K
品牌: ONSEMI [ ON SEMICONDUCTOR ]
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MC74HC165A
PACKAGE DIMENSIONS
SOEIAJ−16
F SUFFIX
CASE 966−01
ISSUE O
16
9
L
E
Q
1
E H
E
M
_
L
DETAIL P
1
8
Z
D
e
A
VIEW P
c
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSIONS D AND E DO NOT INCLUDE
MOLD FLASH OR PROTRUSIONS AND ARE
MEASURED AT THE PARTING LINE. MOLD FLASH
OR PROTRUSIONS SHALL NOT EXCEED 0.15
(0.006) PER SIDE.
4. TERMINAL NUMBERS ARE SHOWN FOR
REFERENCE ONLY.
5. THE LEAD WIDTH DIMENSION (b) DOES NOT
INCLUDE DAMBAR PROTRUSION. ALLOWABLE
DAMBAR PROTRUSION SHALL BE 0.08 (0.003)
TOTAL IN EXCESS OF THE LEAD WIDTH
DIMENSION AT MAXIMUM MATERIAL CONDITION.
DAMBAR CANNOT BE LOCATED ON THE LOWER
RADIUS OR THE FOOT. MINIMUM SPACE
BETWEEN PROTRUSIONS AND ADJACENT LEAD
TO BE 0.46 ( 0.018).
DIM
A
A
1
b
c
D
E
e
H
E
L
L
E
M
Q
1
Z
MILLIMETERS
MIN
MAX
−−−
2.05
0.05
0.20
0.35
0.50
0.18
0.27
9.90
10.50
5.10
5.45
1.27 BSC
7.40
8.20
0.50
0.85
1.10
1.50
10
_
0
_
0.70
0.90
−−−
0.78
INCHES
MIN
MAX
−−− 0.081
0.002
0.008
0.014
0.020
0.007
0.011
0.390
0.413
0.201
0.215
0.050 BSC
0.291
0.323
0.020
0.033
0.043
0.059
10
_
0
_
0.028
0.035
−−− 0.031
b
0.13 (0.005)
M
A
1
0.10 (0.004)
http://onsemi.com
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