NCP1200
PACKAGE DIMENSIONS
PDIP−8
P SUFFIX
CASE 626−05
ISSUE L
NOTES:
1. DIMENSION L TO CENTER OF LEAD WHEN
FORMED PARALLEL.
8
5
2. PACKAGE CONTOUR OPTIONAL (ROUND OR
SQUARE CORNERS).
3. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
−B−
1
4
MILLIMETERS
INCHES
MIN
DIM MIN
MAX
10.16
6.60
4.45
0.51
1.78
MAX
0.400
0.260
0.175
0.020
0.070
A
B
C
D
F
9.40
6.10
3.94
0.38
1.02
0.370
0.240
0.155
0.015
0.040
F
−A−
NOTE 2
L
G
H
J
2.54 BSC
0.100 BSC
0.76
0.20
2.92
1.27
0.30
3.43
0.030
0.008
0.115
0.050
0.012
0.135
K
L
C
7.62 BSC
0.300 BSC
M
N
−−−
0.76
10
_
1.01
−−−
0.030
10
_
0.040
J
−T−
SEATING
PLANE
N
M
D
K
G
H
M
M
M
0.13 (0.005)
T
A
B
The product described herein (NCP1200), may be covered by the following U.S. patents: 6,271,735, 6,362,067, 6,385,060, 6,429,709, 6,587,357. There may
be other patents pending.
ON Semiconductor and
are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice
to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability
arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages.
“Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All
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NCP1200/D
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16
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