Philips Semiconductors
Product specification
UHF power transistor
BLV2047
handbook, full pagewidth
40
40
50
+V
bias
+V
CE
R1
L5
C6
C7
C8
C10
L6
L9
C9
L15
L14
L12 L13
C4
C3
C11
C12
C5
50
Ω
output
50
Ω
input
C1
L1
C2
L2 L3 L4
L7
L8 L10 L11
MBK406
Dimensions in mm.
The components are situated on one side of the copper-clad Teflon board, the other side is unetched and serves as a ground plane.
Earth connections from the component side to the ground plane are made by through metallization.
Fig.10 Component layout for 2000 MHz class-AB test circuit.
1999 Jun 09
7