Si500S
Package Specifications
Table 1. Package Diagram Dimensions (mm)
Dimension
A
A1
b
D
e
E
L
0.95
Min
0.80
0.00
1.15
Nom
0.85
0.03
1.20
3.20 BSC
2.54 BSC
4.00 BSC
1.00
Max
0.90
0.05
1.25
Dimension
L1
aaa
bbb
ccc
ddd
eee
Min
0.00
Nom
0.05
Max
0.10
0.10
0.10
0.08
0.10
0.05
1.05
Table 2. Pad Connections
1
2
3
4
OE
GND
Output
VDD
Table 3. Tri-State/Powerdown/Driver Stopped
Function on OE (3rd Option Code)
A
Open
1
Level
0
Level
Active
Active
Tri-
State
B
Active
Tri-
State
Active
C
Active
Active
Power-
down
D
Active
Power-
down
Active
E
Active
Active
Driver
Stopped
F
Active
Driver
Stopped
Active
Dimension
C1
E
X1
Y1
(mm)
2.70
2.54
1.30
1.55
0 C CC CC
T TTT TT
Y Y WW
0 = Si500
CCCCC = mark code
TTTTTT = assembly manufacturing code
YY = year
WW = work week
Figure 1. Recommended Land Pattern
Figure 2. Top Mark
2
Rev. 0.3
SILABS [ SILICON LABORATORIES ]
