SL15316
Package Outline and Package Dimensions
16-Pin TSSOP Package (173 Mil)
9
16
6.250(0.246)
6.500(0.256)
4.300(0.169)
4.500(0.177)
Dimensions are in milimeters (inches)
Top line: (MIN) and Bottom line: (Max)
Pin-1 ID
1
8
4.900(0.193)
5.100(0.200)
1.200(0.047) MAX
0.250(0.010)
BSC
0.090(0.003)
0.200(0.008)
0.050(0.002)
0.150(0.006)
0.800(0.031)
1.050(0.041)
Gauge
Plane
0.076(0.003)
Seating Plane
0.500(0.020)
0.750(0.030)
0.190(0.007)
0.300(0.012)
0 to 8°
0.650(0.025)
BSC
Thermal Characteristics
Parameter
Symbol
Condition
Min
Typ
110
100
80
Max
Unit
°C/W
°C/W
°C/W
°C/W
θ JA
θ JA
θ JA
θ JC
Still air
-
-
-
-
-
-
-
-
Thermal Resistance
Junction to Ambient
1m/s air flow
3m/s air flow
Thermal Resistance
Junction to Case
Independent of air flow
35
Rev 1.0, August 7, 2008
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