Characteristics
BAT46 Series
Figure 7.
Forward voltage drop versus
forward current (typical values,
high-level)
Figure 8.
Relative variation of thermal
impedance junction to ambient
versus pulse duration - printed
circuit board, epoxy FR4
e
CU
= 35 µm (SOD-323)
I
FM
(A)
1.E+00
1.00
Z
th(j-a)
/R
th(j-a)
Single pulse
SOD-323
Tj=125 °C
1.E-01
Tj=25 °C
0.10
V
FM
(V)
1.E-02
0.0
0.1
0.2
0.3
0.4
0.5
0.6
0.7
0.8
0.9
1.0
0.01
1.E-02
1.E-01
t
P
(s)
1.E+00
Epoxy FR4
S
CU
=2.25 mm²
e
CU
=35 µm
1.E+01
1.E+02
Figure 9.
Relative variation of thermal
impedance junction to ambient
versus pulse duration -
aluminium oxide substrate
10 mm x 8 mm x 0.5 mm (SOT-23)
Figure 10. Variation of thermal impedance
junction to ambient versus pulse
duration - printed circuit board,
epoxy FR4, e
CU
= 35 µm (SOT-323)
Z
th(j-a)
(°C/W)
1000
Single pulse
SOT-323
Z
th(j-a)
/R
th(j-a)
1.00
Single pulse
SOT-23
0.10
100
t
P
(s)
0.01
1.E-02
1.E-01
1.E+00
Alumine substrate
10 x 8 x 0.5 mm
t
P
(s)
1.E+01
1.E+02
10
1.E-02
1.E-01
1.E+00
1.E+01
1.E+02
Figure 11. Thermal resistance junction to
ambient versus copper surface
under each lead, epoxy FR4,
e
CU
= 35 µm (SOD-323)
R
th(j-a)
(°C/W)
600
550
500
450
400
350
S
CU
(mm²)
300
0
5
10
15
20
25
30
35
40
45
50
4/11
STMICROELECTRONICS [ STMICROELECTRONICS ]
