BAT46 Series
Table 8.
SOT-323 dimensions
Package information
Dimensions
Ref.
A
E
Millimeters
Min.
Typ.
Max.
1.1
0.1
0.4
0.26
2.0
1.25
0.65
1.8
0.1
0
2.1
0.2
2.4
0.3
30°
0.071
0.004
0
2.2
1.35
Min.
0.031
0.0
0.010
0.004
0.071
0.045
Inches
Typ.
Max.
0.043
0.004
0.016
0.010
0.079
0.049
0.026
0.083
0.008
0.094
0.012
30°
0.086
0.053
A
e
b
D
0.8
0.0
0.25
0.1
1.8
1.15
A1
b
c
A1
D
E
c
θ
H
e
L
H
L
q
Figure 15. SOT-323 footprint (dimensions in mm)
0.95
1.0
2.9
0.8
0.50
In order to meet environmental requirements, ST offers these devices in ECOPACK®
packages. These packages have a lead-free second level interconnect. The category of
second level interconnect is marked on the package and on the inner box label, in
compliance with JEDEC Standard JESD97. The maximum ratings related to soldering
conditions are also marked on the inner box label. ECOPACK is an ST trademark.
ECOPACK specifications are available at: www.st.com.
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