Electrical characteristics
Table 8.
Thermal characteristics
STM32F103xC, STM32F103xD, STM32F103xE
Symbol
T
STG
T
J
Ratings
Storage temperature range
Maximum junction temperature
Value
–65 to +150
150
Unit
°C
°C
5.3
5.3.1
Operating conditions
General operating conditions
Table 9.
Symbol
f
HCLK
f
PCLK1
f
PCLK2
V
DD
V
BAT
General operating conditions
Parameter
Internal AHB clock frequency
Internal APB1 clock frequency
Internal APB2 clock frequency
Standard operating voltage
Backup operating voltage
LQFP144
Power dissipation at T
A
=
85 °C for suffix 6 or T
A
=
105 °C for suffix 7
(1)
LQFP100
LQFP64
LFBGA100
LFBGA144
Ambient temperature for 6
suffix version
Maximum power dissipation
Low power dissipation
(3)
Maximum power dissipation
Low power dissipation
(3)
6 suffix version
–40
–40
–40
–40
–40
–40
Conditions
Min
0
0
0
2
1.8
Max
72
36
72
3.6
3.6
TBD
(2)
434
444
487
TBD
85
°C
105
105
°C
125
105
°C
7 suffix version
125
mW
V
V
MHz
Unit
P
D
T
A
Ambient temperature for 7
suffix version
T
J
Junction temperature range
1. If T
A
is lower, higher P
D
values are allowed as long as T
J
does not exceed T
J
max (see
2. TBD = to be determined.
3. In low power dissipation state, T
A
can be extended to this range as long as T
J
does not exceed T
J
max (see
5.3.2
Operating conditions at power-up / power-down
The parameters given in
are derived from tests performed under the ambient
temperature condition summarized in
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