VND5012AK-E
Figure 4. Configuration Diagram (Top View) & Suggested Connections For Unused and n.c. Pins
V
CC
GND
N.C.
INPUT2
N.C.
INPUT1
N.C.
CURRENT SENSE1
N.C.
CURRENT SENSE2
CS_DIS
V
CC
1
2
3
4
5
6
7
8
9
10
11
12
24
23
22
21
20
19
18
17
16
15
14
13
OUTPUT2
OUTPUT2
OUTPUT2
OUTPUT2
OUTPUT2
OUTPUT2
OUTPUT1
OUTPUT1
OUTPUT1
OUTPUT1
OUTPUT1
OUTPUT1
TAB = V
CC
Connection / Pin
Floating
To Ground
Current Sense
Through 1KΩ
resistor
N.C.
X
X
Output
X
Input
X
Through 10KΩ
resistor
CS_DIS
X
Through 10KΩ
resistor
Table 4. Absolute Maximum Ratings
Symbol
V
CC
-V
CC
- I
GND
I
OUT
- I
OUT
I
IN
I
CSD
V
CSENSE
V
ESD
T
j
T
stg
DC supply voltage
Reverse DC supply voltage
DC reverse ground pin current
DC output current
Reverse DC output current
DC input current
DC current sense disable input current
Current sense maximum voltage
Electrostatic discharge (R=1.5kΩ; C=100pF)
Junction operating temperature
Storage temperature
Parameter
Value
41
-0.3
-200
Internally limited
-30
-1 to 10
-1 to 10
V
CC
-41
+V
CC
2000
-40 to 150
-55 to 150
Unit
V
V
mA
A
A
mA
mA
V
V
V
°C
°C
Table 5. Thermal Data
Symbol
R
thj-case
R
thj-amb
Parameter
Thermal resistance junction-case
Thermal resistance junction-ambient
Max Value
1.7
52 (see note 1)
Unit
°C/W
°C/W
Note: 1. When mounted on a standard single-sided FR4 board with 1cm
2
of Cu (at least 35µm thick) connected to TAB.
3/13
STMICROELECTRONICS [ STMICROELECTRONICS ]
