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SLAS628 – MARCH 2009
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.
ORDERING INFORMATION
(1)
MODEL
MAXIMUM
INTEGRAL
LINEARITY
(LSB)
±2.5
MAXIMUM
DIFFERENTIAL
LINEARITY
(LSB)
+1.5/–1
NO MISSING
CODES AT
RESOLUTION
(BIT)
18
64-pin QFN
ADS8284l
±4.5
+1.5/–1
18
RGC
–40°C to
85°C
PACKAGE
TYPE
PACKAGE
DESIGNATOR
TEMPERATURE
RANGE
ORDERING
INFORMATION
ADS8284IBRGCT
ADS8284IBRGCR
ADS8284IRGCT
ADS8284IRGCR
TRANSPORT
MEDIA
QUANTITY
250
2000
250
2000
ADS8284lB
(1)
For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI
website at
ABSOLUTE MAXIMUM RATINGS
(1)
over operating free-air temperature range (unless otherwise noted)
VALUE
CH(i) to AGND (both P and M inputs)
VCC to VEE
+VA to AGND
+VBD to BDGND
ADC control digital input voltage to GND
ADC control digital output to GND
Multiplexer control digital input voltage to GND
Power control digital input voltage to GND
Operating temperature range
Storage temperature range
Junction temperature (T
J
max)
QFN package
Lead temperature, soldering
(1)
Power dissipation
θJA
Thermal impedance
Vapor phase (60 sec)
Infrared (15 sec)
VEE–0.3 to VCC + 0.3
-0.3 to 18
–0.3 to 7
–0.3 to 7
–0.3 to (+VBD + 0.3)
–0.3 to (+VBD + 0.3)
–0.3 to (+VA + 0.3)
–0.3 to (+VCC + 0.3)
–40 to 85
–65 to 150
150
(T
J
Max–T
A
)/
θJA
86
215
220
°C/W
°C
°C
UNIT
V
V
V
V
V
V
V
V
°C
°C
°C
Stresses beyond those listed under
absolute maximum ratings
may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated under
recommended operating
conditions
is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
Copyright © 2009, Texas Instruments Incorporated
Product Folder Link(s) :ADS8284
3
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