SNOSBQ4D – MAY 1999 – REVISED MARCH 2013
LM567C MDC MWC ToNE DECODER
Figure 17. Die Layout (C - Step)
Table 1. Die/Wafer Characteristics
Fabrication Attributes
Physical Die Identification
Die Step
Physical Attributes
Wafer Diameter
Dise Size (Drawn)
Thickness
Min Pitch
Special Assembly Requirements:
Note: Actual die size is rounded to the nearest micron.
Die Bond Pad Coordinate Locations (C - Step)
(Referenced to die center, coordinates in µm) NC = No Connection, N.U. = Not Used
SIGNAL NAME
OUTPUT FILTER
LOOP FILTER
INPUT
V+
TIMING RES
TIMING CAP
GND
OUTPUT
PAD# NUMBER
1
2
3
4
5
6
7
8
X/Y COORDINATES
X
-673
-673
-673
-356
673
673
178
-318
Y
686
-419
-686
-686
-122
76
686
679
X
91
91
91
91
91
91
117
117
x
x
x
x
x
x
x
x
PAD SIZE
Y
91
91
91
91
91
91
91
104
150mm
1600µm x 1626µm
63.0mils x 64.0mils
406µm Nominal
198µm Nominal
LM567C
C
General Die Information
Bond Pad Opening Size (min)
Bond Pad Metalization
Passivation
Back Side Metal
Back Side Connection
91µm x 91µm
0.5% COPPER_BAL.
ALUMINUM
VOM NITRIDE
BARE BACK
Floating
10
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