PACKAGE OPTION ADDENDUM
www.ti.com
11-Apr-2013
PACKAGING INFORMATION
Orderable Device
LM567CM
LM567CM/NOPB
LM567CMX/NOPB
LM567CN
LM567CN/NOPB
NE567V
Status
(1)
Package Type Package Pins Package
Drawing
Qty
SOIC
SOIC
SOIC
PDIP
PDIP
PDIP
D
D
D
P
P
P
8
8
8
8
8
8
95
95
2500
40
40
40
Eco Plan
(2)
Lead/Ball Finish
Call TI
CU SN
CU SN
Call TI
Call TI
Call TI
MSL Peak Temp
(3)
Op Temp (°C)
0 to 70
0 to 70
0 to 70
0 to 70
0 to 70
0 to 70
Top-Side Markings
(4)
Samples
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
TBD
Green (RoHS
& no Sb/Br)
Green (RoHS
& no Sb/Br)
TBD
Green (RoHS
& no Sb/Br)
TBD
Call TI
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Call TI
Level-1-NA-UNLIM
Call TI
LM
567CM
LM
567CM
LM
567CM
LM
567CN
LM
567CN
LM
567CN
(1)
The marketing status values are defined as follows:
ACTIVE:
Product device recommended for new designs.
LIFEBUY:
TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND:
Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW:
Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE:
TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check
for the latest availability
information and additional product content details.
TBD:
The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS):
TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt):
This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br):
TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4)
Multiple Top-Side Markings will be inside parentheses. Only one Top-Side Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a
continuation of the previous line and the two combined represent the entire Top-Side Marking for that device.
Addendum-Page 1
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