MSP430xG461x
MIXED SIGNAL MICROCONTROLLER
SLAS508I − APRIL 2006 − REVISED MARCH 2011
AVAILABLE OPTIONS
{
PACKAGED DEVICES
}
T
A
PLASTIC 100-PIN TQFP
(PZ)
MSP430FG4616IPZ
MSP430FG4617IPZ
MSP430FG4618IPZ
MSP430FG4619IPZ
−40°C to 85°C
40°C
MSP430CG4616IPZ
MSP430CG4617IPZ
MSP430CG4618IPZ
MSP430CG4619IPZ
†
PLASTIC 113-BALL BGA
(ZQW)
MSP430FG4616IZQW
MSP430FG4617IZQW
MSP430FG4618IZQW
MSP430FG4619IZQW
MSP430CG4616IZQW
MSP430CG4617IZQW
MSP430CG4618IZQW
MSP430CG4619IZQW
For the most current package and ordering information, see the Package Option
Addendum at the end of this document, or see the TI
web site at www.ti.com.
‡
Package
drawings, thermal data, and symbolization are available at
www.ti.com/packaging.
DEVELOPMENT TOOL SUPPORT
All MSP430 microcontrollers include an Embedded Emulation Module (EEM) allowing advanced debugging
and programming through easy-to-use development tools. Recommended hardware options include:
D
Debugging and Programming Interface
−
−
MSP-FET430UIF (USB)
MSP-FET430PIF (Parallel Port)
D
Debugging and Programming Interface with Target Board
−
MSP-FET430U100 (for PZ package)
D
Standalone Target Board
−
MSP-TS430PZ100 (for PZ package)
D
Production Programmer
−
MSP-GANG430
2
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•
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