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SLTS211F – MAY 2003 – REVISED FEBRUARY 2007
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.
STANDARD APPLICATION
Margin Down
Margin Up
13 12 11
1
10
Track
V
I
2
PTH12030x
(Top View)
9
8
7
V
O
3
4
Inhibit
C
I
560
m
F
Electrolytic
(Required)
GND
R
SET
5
6
V
O
Sense
C
O
330
m
F
(Optional)
GND
L
O
A
D
A.
R
SET
= Required to set the output voltage to a value higher than the minimum value. See the Application Information
section for values.
ORDERING INFORMATION
For the most current package and ordering information, see the Package Option Addendum at the end of this datasheet, or see
the TI website at www.ti.com.
ABSOLUTE MAXIMUM RATINGS
Over operating free-air temperature range, all voltages are with respect to GND (unless otherwise noted)
MIN
V
Track
T
A
T
wave
Track pin voltage
Operating Temperature
Range
Wave solder temperature
Over V
I
range
Surface temperature of module body or pins
(5 seconds)
PTH12030WAH
PTH12030WAS
PTH12030WAZ
–55
Per Mil-STD-883D, Method 2002.3, 1 ms, 1/2 Sine, mounted
Mil-STD-883D, Method 2007.2 20-2000 Hz
Meets UL 94V-O
500
15
10
–0.3
–40
260
235
260
TYP
MAX
V
I
+ 0.3
85
(1)
UNIT
V
°C
(1)
(1)
°C
T
reflow
T
stg
Solder reflow temperature Surface temperature of module body or pins
Storage Temperature
Mechanical Shock
Mechanical Vibration
Weight
Flammability
125
°C
G
G
grams
(1)
During soldering of package version, do not elevate peak temperature of the module, pins, or internal components above the stated
maximum.
2
TI [ TEXAS INSTRUMENTS ]
