SINGLE POSITIVE-EDGE-TRIGGERED D-TYPE FLIP-FLOP
SCES387K – MARCH 2002 – REVISED APRIL 2007
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DESCRIPTION/ORDERING INFORMATION (CONTINUED)
NanoFree™ package technology is a major breakthrough in IC packaging concepts, using the die as the
package.
This device is fully specified for partial-power-down applications using I
off
. The I
off
circuitry disables the outputs,
preventing damaging current backflow through the device when it is powered down.
FUNCTION TABLE
INPUTS
CLK
↑
↑
L
D
H
L
X
OUTPUT
Q
H
L
Q
0
LOGIC DIAGRAM (POSITIVE LOGIC)
CLK
CLK
Q
D
D
Q
Absolute Maximum Ratings
(1)
over operating free-air temperature range (unless otherwise noted)
MIN
V
CC
V
I
V
O
V
O
I
IK
I
OK
I
O
Supply voltage range
Input voltage range
(2)
Voltage range applied to any output in the high-impedance or power-off
Output voltage range
(2)
Input clamp current
Output clamp current
Continuous output current
Continuous current through V
CC
or GND
DBV package
θ
JA
Package thermal impedance
(3)
DCK package
DRY package
YZP package
T
stg
(1)
(2)
(3)
Storage temperature range
–65
V
I
< 0
V
O
< 0
state
(2)
–0.5
–0.5
–0.5
–0.5
MAX
3.6
3.6
3.6
V
CC
+ 0.5
–50
–50
±20
±100
206
252
234
132
150
°C
°C/W
UNIT
V
V
V
V
mA
mA
mA
mA
Stresses beyond those listed under "absolute maximum ratings" may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated under "recommended operating
conditions" is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
The input negative-voltage and output voltage ratings may be exceeded if the input and output current ratings are observed.
The package thermal impedance is calculated in accordance with JESD 51-7.
2
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