UCC28019
www.ti.com
SLUS755–APRIL 2007
ORDERING INFORMATION
OPERATING TEMPERATURE
RANGE, TA
PART NUMBER
UCC28019D
UCC28019P
PACKAGE(1)
SOIC 8-Pin (D) ead (Pb)-Free/Green
–40°C to 125°C
Plastic DIP 8 Pin (P) Lead
(Pb)-Free/Green
(1) SOIC (D) package is available taped and reeled by adding "R" suffix the the above part number, reeled quantities are 2500 devices per
reel.
ABSOLUTE MAXIMUM RATINGS(1)
over operating free-air temperature range (unless otherwise noted)
VALUE
–0.3 to 22
–0.3 to 16
–0.3 to 7
–24 to 7
–1 to 1
UNIT
VCC
GATE
Input voltage range
V
VINS, VSENSE, VCOMP, ICOMP
ISENSE
Input current range
VSENSE, ISENSE
Operating
mA
–55 to 150
–65 to 150
300°
Junction temperature, TJ
Lead temperature, TSOL
Storage
°C
Soldering, 10s
(1) Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings
only and functional operation of the device at these or any other condition beyond those included under “Recommended Operating
Conditions” is not implied. Exposure to absolute-maximum-rated conditions for extended periods of time may affect device reliability.
DISSIPATION RATINGS(1)
PACKAGE
THERMAL IMPEDANCE
JUNCTION TO AMBIENT
(°C/W)
TA = 25°C POWER RATING (W) TA = 85°C POWER RATING (W)
SOIC-8 (D)
PDIP-8 (P)
160
110
0.65
1
0.25
0.36
(1) Tested per JEDEC EIA/JESD 51-1. Thermal resistance is a strong function of board construction and layout. Air flow reduces thermal
resistance. This number is only a general guide. See TI document SPRA953 Thermal Metrics.
RECOMMENDED OPERATING CONDITIONS
over operating free-air temperature range (unless otherwise noted)
PARAMETER
VCC input voltage from a low-impedance source
Operating junction temperature
MIN
MAX
UNIT
V
VCCOFF(max) + 1 V
–40
21
TJ
125
°C
ELECTROSTATIC DISCHARGE (ESD) PROTECTION
over operating free-air temperature range (unless otherwise noted)
PARAMETER
Human Body Model (HBM)
RATING
UNIT
2
kV
V
Charged Device Model (CDM)
500
2
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