TPS54560
SLVSBN0 –MARCH 2013
www.ti.com
ABSOLUTE MAXIMUM RATINGS(1)
over operating free-air temperature range (unless otherwise noted)
VALUE
UNIT
MIN
–0.3
–0.3
MAX
VIN
EN
65
8.4
BOOT
73
Input voltage
FB
V
–0.3
–0.3
–0.3
3
COMP
3
RT/CLK
BOOT-SW
3.6
8
Output voltage
SW
–0.6
–2
65
65
V
SW, 10-ns Transient
Electrostatic Discharge (HBM) QSS 009-105 (JESD22-A114A)
Electrostatic Discharge (CDM) QSS 009-147 (JESD22-C101B.01)
Operating junction temperature
2
kV
V
500
–40 to 150
–65 to 150
°C
°C
Storage temperature
(1) Stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. These are stress ratings
only and functional operation of the device at these or any other conditions beyond those indicated under recommended operating
conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
THERMAL INFORMATION
TPS54560
THERMAL METRIC(1)(2)
UNITS
DDA (8 PINS)
θJA
Junction-to-ambient thermal resistance (standard board)
Junction-to-top characterization parameter
Junction-to-board characterization parameter
Junction-to-case(top) thermal resistance
Junction-to-case(bottom) thermal resistance
Junction-to-board thermal resistance
42.0
5.9
ψJT
ψJB
23.4
45.8
3.6
°C/W
θJCtop
θJCbot
θJB
23.4
(1) For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.
(2) Power rating at a specific ambient temperature TA should be determined with a junction temperature of 150°C. This is the point where
distortion starts to substantially increase. See power dissipation estimate in application section of this data sheet for more information.
4
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