R
Spartan-3 FPGA Family: Pinout Descriptions
as the Pb-free option. The mechanical dimensions of the
standard and Pb-free packages are similar, as shown in the
mechanical drawings provided in
Not all Spartan-3 densities are available in all packages.
However, for a specific package there is a common footprint
for that supports the various devices available in that pack-
age. See the footprint diagrams that follow.
Package Overview
shows the 10 low-cost, space-saving production
package styles for the Spartan-3 family. Each package style
is available as a standard and an environmentally-friendly
lead-free (Pb-free) option. The Pb-free packages include an
extra ‘G’ in the package style name. For example, the stan-
dard "VQ100" package becomes "VQG100" when ordered
Table 80:
Spartan-3 Family Package Options
Package
VQ100 / VQG100
CP132 / CPG132
TQ144 / TQG144
PQ208 / PQG208
FT256 / FTG256
FG320 / FGG320
FG456 / FGG456
FG676 / FGG676
FG900 / FGG900
FG1156 / FGG1156
(1)
Leads
100
132
144
208
256
320
456
676
900
1156
Type
Maximum
I/O
63
89
97
141
173
221
333
489
633
784
Pitch
(mm)
0.5
0.5
0.5
0.5
1.0
1.0
1.0
1.0
1.0
1.0
Area
(mm)
16 x 16
8x8
22 x 22
30.6 x 30.6
17 x 17
19 x 19
23 x 23
27 x 27
31 x 31
35 x 35
Height
(mm)
1.20
1.10
1.60
4.10
1.55
2.00
2.60
2.60
2.60
2.60
Very-thin Quad Flat Pack
Chip-Scale Package
Thin Quad Flat Pack
Quad Flat Pack
Fine-pitch, Thin Ball Grid Array
Fine-pitch Ball Grid Array
Fine-pitch Ball Grid Array
Fine-pitch Ball Grid Array
Fine-pitch Ball Grid Array
Fine-pitch Ball Grid Array
Notes:
1. The FG(G)1156 package is being discontinued and is not recommended for new designs. See
for the latest updates.
Selecting the Right Package Option
Spartan-3 FPGAs are available in both quad-flat pack
(QFP) and ball grid array (BGA) packaging options. While
QFP packaging offers the lowest absolute cost, the BGA
Table 81:
Comparing Spartan-3 Packaging Options
Characteristic
Maximum User I/O
Packing Density (Logic/Area)
Signal Integrity
Simultaneous Switching Output (SSO) Support
Thermal Dissipation
Minimum Printed Circuit Board (PCB) Layers
Hand Assembly/Rework
Quad Flat-Pack (QFP)
141
Good
Fair
Limited
Fair
4
Possible
Ball Grid Array (BGA)
633
Better
Better
Better
Better
6
Very Difficult
packages are superior in almost every other aspect, as
summarized in
Consequently, Xilinx recommends
using BGA packaging whenever possible.
DS099-4 (v2.4) June 25, 2008
Product Specification
119
XILINX [ XILINX, INC ]
