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  • 北京元坤伟业科技有限公司

         该会员已使用本站17年以上

  • DXP18BN5016DB
  • 数量-
  • 厂家-
  • 封装-
  • 批号-
  • -
  • QQ:857273081QQ:857273081 复制
    QQ:1594462451QQ:1594462451 复制
  • 010-62104931、62106431、62104891、62104791 QQ:857273081QQ:1594462451
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  • DXP18BN5016DB图
  • 深圳市惊羽科技有限公司

     该会员已使用本站11年以上
  • DXP18BN5016DB
  • 数量96800 
  • 厂家MURATA-村田 
  • 封装车规-被动器件 
  • 批号▉▉:2年内 
  • ▉▉¥10一一有问必回一一有长期订货一备货HK仓库
  • QQ:43871025QQ:43871025 复制
  • 131-4700-5145---Q-微-恭-候---有-问-秒-回 QQ:43871025

产品型号DXP18BN5016DB的Datasheet PDF文件预览

Reference Only  
SpecNo.JEFK243A-0002H-01  
P1/10  
Micro Chip Transformer DXP18BN□□□□□□  
Reference Specification  
1. Scope  
This reference specification applies to Micro Chip Transformer DXP18BN Series.  
2. Part Numbering  
(ex.)  
DX  
(1)  
P
18  
B
N
50 14  
(6) (7)  
T
L
(2) (3) (4) (5)  
(8) (9)  
(1) Micro Chip Transformer  
(2) Structure (P: Film Type)  
(3) Dimension (L×W)  
(4) Type of Transformer (B: Balun)  
(5) Category  
(6) Port Impedance (50:50ohm / 75: 75ohm)  
(7) Impedance ratio (14: one to four)  
(8) Main Application (:50870MHz/:470790MHz/D:470870MHz)  
(9) Packing Code L:Taping / B:Bulk  
3. Electrical Specification  
Freq.  
Range  
[MHz]  
input-output  
Impedance  
[ohm]  
Rated  
Power  
[dBm]  
Customer  
Part Number  
Murata  
Part Number  
Insertion Loss  
[dB max.]  
CMRR  
[dB min.]  
DXP18BN5014TL  
DXP18BN5014TB  
DXP18BN5014HL  
DXP18BN5014HB  
DXP18BN5016DL  
DXP18BN5016DB  
DXP18BN7514TL  
DXP18BN7514TB  
50-870  
470-790  
470-870  
50-870  
50-200  
50-200  
50-300  
75-300  
1.5  
1.2  
1.2  
1.5  
25  
20  
Operating Temperature : -40 to +85°C  
Storage Temperature : -40 to +85°C  
4. Standard Testing Condition  
<Unless otherwise specified>  
<In case of doubt>  
Temperature : 20 ± 2°C  
Humidity : 60 to 70%(RH)  
Temperature : Ordinary Temperature 15 to 35°C  
Humidity : Ordinary Humidity 25 to 85%(RH)  
Atmospheric Pressure : 86 to106kPa  
5. Style and Dimensions  
Dimension  
Eqivalent Circuit  
(Top View)  
(5)GND  
(6)B1  
(4)B2  
(6) (5) (4)  
(1) (2) (3)  
Polarity  
Marking  
1.6±0.1  
0.2±0.1  
0.4±0.1  
(1)UB  
(2)NC  
(3)GND  
0.3±0.1  
(Bottom View)  
: Electrode  
(in mm)  
Unit Mass (typ.)  
0.003g  
MURATA MFG.CO.,LTD  
Reference Only  
SpecNo.JEFK243A-0002H-01  
P2/10  
NC (Non-Contact) Terminal  
Don't connect NC terminal with any signal lines/GND lines on the circuit board.  
6. Marking  
Polarity Marking is on the upper surface of a Product.  
7. Electrical Performance  
No.  
Item  
Specification  
Meet item 3.  
Definition and Measurement Method  
7.1 Insertion  
Insertion Loss is given by Sds21 mag extracted from the below circuit.  
Loss  
(IL)  
Port Impedance [ohm]  
Port1  
50  
50  
50  
75  
Port2  
100  
100  
150  
150  
Port3  
100  
100  
150  
150  
5014H  
5014T  
5016D  
7514T  
IL[dB] = 20log10(Sds21)  
Where  
Sds21 is S-parameter of single mode stimulus - Differential mode response  
Parasitics and loss factors caused by the test board have to be removed.  
UB  
B1  
Port2  
Port1  
GND  
NC  
Port3  
GND  
B2  
7.2 CMRR  
Meet item 3.  
CMRR is given by the following equation, S-parameters are extracted from  
the below circuit.  
Port Impedance [ohm]  
Port1  
50  
50  
50  
75  
Port2  
100  
100  
150  
150  
Port3  
100  
100  
150  
150  
5014H  
5014T  
5016D  
7514T  
CMRR[dB] = 20log10(Sds21/Scs21)=20log10{(S21+S31)/(S21-S31)}  
Where  
Sds21 is S-parameter of single mode stimulus - Differential mode response  
Scs21 is S-parameter of single mode stimulus - Common mode response  
Parasitics and loss factors caused by the test board have to be removed.  
UB  
B1  
Port2  
Port1  
GND  
NC  
Port3  
GND  
B2  
MURATA MFG.CO.,LTD  
Reference Only  
SpecNo.JEFK243A-0002H-01  
P3/10  
8. Mechanical Performance  
No.  
Item  
Specification  
Meet all dimension on item 5.  
Test Method  
Visual Inspection and measurement with microscope.  
8.1 Appearance  
and  
Dimensions  
The electrodes shall be at least Flux:Ethanol solution of rosin,25(wt)%  
95% covered with new solder Pre-Heating : 150±10°C 60s to 90s  
8.2 Solderability  
coating.  
Solder : Sn-3.0Ag-0.5Cu  
Solder Temperature : 240±5°C  
Immersion Time : 3±1 seconds  
Immersion and emersion rates : 25mm/s  
Flux : Ethanol solution of rosin,25(wt)%  
Pre-Heating : : 150±10°C 60s to 90s  
Solder : Sn-3.0Ag-0.5Cu  
8.3 Resistance  
to Soldering  
Heat  
Meet Table 1.  
Table 1  
Appearance  
IL  
No damaged  
Meet Item 3.  
Solder Temperature : 270±5°C  
Immersion Time : 10±1 seconds  
Immersion and emersion rates : 25mm/s  
Then measured after exposure in the room  
condition for 4 to 48 hours.  
CMRR  
8.4  
Drop  
It shall be dropped on concrete or steel board.  
Method : free fall  
Height : 1 m  
The Number of Times : 3 times  
8.5 Vibration  
It shall be soldered on the substrate.  
Oscillation Frequency : 10 to 2000 to 10Hz  
for 15 minutes  
Total Amplitude 3.0mm or Acceleration 196m/s2  
whichever is smaller  
Testing Time : A period of 2 hours in each of 3  
mutually perpendicular directions. (Total 6 hours)  
It shall be soldered on the Glass-epoxy substrate.  
8.6  
Bending  
Strength  
Deflection : 3mm  
(t=1.0mm).  
Keeping time : 5 seconds  
Speed of Applying Force : 0.5mm/s  
Pressure jig  
F
R230  
Deflection  
45  
45  
Product  
(in mm)  
9. Environmental Performance(Products shall be soldered on the substrate.)  
No.  
Item  
Specification  
Test Method  
9.1 Temperature  
Cycle  
Meet Table 1.  
1 Cycle  
Step 1 -40°C(+0°C,-3°C) / 30(+3,-0) min  
Step 2 Ordinary Temp. / within 3 min  
Step 3 +85(+3°C,-0°C) / 30(+3,-0) min  
Step 4 Ordinary Temp. / within 3 min  
Total of 100 cycles.  
Then measured after exposure in the room condition for  
4 to 48 hours.  
9.2 Humidity  
Temperature : 70±2°C  
Humidity : 90~95%(RH)  
Time : 1000(+48 hours,-0 hours)  
Then measured after exposure in the  
room condition for 4 to 48 hours.  
9.3 Heat  
Resistance  
Temperature : 85±2°C  
Time : 1000(+48 hours,-0 hours)  
Then measured after exposure in the  
room condition for 4 to 48 hours.  
9.4 Cold  
Resistance  
Temperature : -40± 2°C  
Time : 1000(+48 hours,-0 hours)  
Then measured after exposure in the  
room condition for 4 to 48 hours.  
MURATA MFG.CO.,LTD  
Reference Only  
SpecNo.JEFK243A-0002H-01  
P4/10  
10. Frequency Characteristics (Typ.)  
DXP18BN5014T  
DXP18BN7514T  
0.0  
0.0  
- 0.2  
- 0.4  
- 0.6  
- 0.8  
- 1.0  
- 1.2  
- 1.4  
- 1.6  
- 1.8  
- 2.0  
- 0.2  
- 0.4  
- 0.6  
- 0.8  
- 1.0  
- 1.2  
- 1.4  
- 1.6  
- 1.8  
- 2.0  
0
200M 400M 600M 800M 1000M  
Freq[Hz]  
0
200M 400M 600M 800M 1000M  
Freq[Hz]  
45  
40  
35  
30  
25  
20  
45  
40  
35  
30  
25  
20  
0
200M 400M 600M 800M 1000M  
Freq[Hz]  
0
200M 400M 600M 800M 1000M  
Freq[Hz]  
DXP18BN5016D  
DXP18BN5014H  
0.0  
0
- 0.2  
- 0.4  
- 0.6  
- 0.8  
- 1.0  
- 1.2  
- 1.4  
- 1.6  
- 1.8  
- 2.0  
0.2  
0.4  
0.6  
0.8  
1.0  
1.2  
1.4  
1.6  
1.8  
2.0  
400M  
500M 600M 700M 800M900M  
Freq[Hz]  
400M  
500M 600M 700M 800M900M  
Freq[Hz]  
45  
40  
35  
30  
25  
20  
45  
40  
35  
30  
25  
20  
400M  
500M 600M 700M 800M900M  
Freq[Hz]  
400M  
500M 600M 700M 800M900M  
Freq[Hz]  
MURATA MFG.CO.,LTD  
Reference Only  
SpecNo.JEFK243A-0002H-01  
P5/10  
11. Specification of Packaging  
11.1 Appearance and Dimensions ( 8mm-wide,Plastic tape)  
0.1  
1.5±  
0
0.20±0.05  
Sproket Hole  
Direction of feed  
1.82±0.05  
0.90±0.05  
4.0±0.1  
4.0±0.1  
2.0±0.05  
0.6±0.05  
11.2 Specification of Taping  
(1)Packing quantity(Standard quantity) 5000 pcs. / reel  
(2)Packing Method  
Products shall be packaged in each embossed cavity of plastic tape and sealed with cover tape.  
(3) Spliced point  
The cover tape have no spliced point.  
(4) Sprocket Hole  
Sprocket hole shall be located on the left hand side toward the direction of feed.  
(5)Missing components number  
Missing components number within 0.1% of the number per reel or 1 pc, whichever is greater, and are not  
continuous. The specified quantity per reel is kept.  
11.3 Pull Strength of the Tape Package  
Plastic Tape  
Cover Tape  
5N min.  
10N min.  
165 to 180 degree  
11.4 Peeling force of the Cover Tape  
F
Cover tape  
0.2 to 0.7N(Minimum value is Typical)  
Peeling verosity is 300 mm / min  
Plastic tape  
Leader  
11.5 Dimensions of Leader-tape, Trailer and Reel  
Trailer  
160 min.  
2.0±0.5  
190 min.  
210 min.  
Label  
Empty tape Top tape  
φ
13.0±0.2  
φ
60± 10  
10  
13±1.4  
φ
21.0±0.8  
Direction of feed  
φ
180±03  
MURATA MFG.CO.,LTD  
SpecNo.JEFK243A-0002G-01  
P6/10  
11.6 Marking for reel  
Customer part number, MURATA part number, Inspection number(1), RoHS Marking(2), Quantity, etc  
1) « Expression of Inspection No. »  
□□ OOOO ×××  
(1)  
(2)  
(3)  
(1) Factory Code  
(2) Date  
First digit  
: Year / Last digit of year  
: Month / Jan. to Sep. 1 to 9, Oct. to Dec. O,N,D  
Second digit  
Third, Fourth digit : Day  
(3) Serial No.  
2) « Expression of RoHS Marking »  
ROHS – Y ()  
(1) (2)  
(1) RoHS regulation conformity parts.  
(2) MURATA classification number  
11.7 Marking for Outside package  
Customer name Purchasing Order Number, Customer Part Number, MURATA part number,  
RoHS Marking (2), Quantity, etc  
11.8 Specification of Outer Case  
Outer Case Dimensions  
Label  
Standard Reel Quantity in Outer Case  
(mm)  
(Reel)  
H
W
D
H
186  
186  
93  
5
D
Above Outer Case size is typical. It depends on a quantity of an  
order.  
W
!
12. Caution  
12.1. Mounting Direction  
Mount products in right direction.  
Wrong direction which is 180 ° rotated from right direction cause serious trouble.  
right direction  
wrong direction  
12.2. Limitation of Applications  
Please contact us before using our products for the applications listed below which require especially  
high reliability for the prevention of defects which might directly cause damage to the third party's life, body  
or property.  
(1) Aircraft equipment  
(6) Transportation equipment (vehicles, trains, ships, etc.)  
(7) Traffic signal equipment  
(8) Disaster prevention / crime prevention equipment  
(9) Data-processing equipment  
(10) Applications of similar complexity and / or reliability  
requirements to the applications listed in the above.  
(2) Aerospace equipment  
(3) Undersea equipment  
(4) Power plant control equipment  
(5) Medical equipment  
13. Notice  
Products can only be soldered with reflow.  
This product is designed for solder mounting.  
Please consult us in advance for applying other mounting method such as conductive adhesive.  
13.1 NC (Non-Contact) Terminal  
Don't connect NC terminal with any signal lines/GND lines on the circuit board, unless otherwise, it may affect on  
the performance of this part.  
Solder the NC terminal on soldering pad, which has no electrical connection with any other lines, to secure the  
fixing strength of the part and to prevent displacement of the part during reflow soldering.  
13.2 Flux and Solder  
Flux  
Use rosin-based flux, (with converting chlorine content 0.06 to 0.1(wt)%. ),  
but not highly acidic flux  
(with Halogen content exceeding 0.2(wt)% conversion to chlorine).  
Do not use water-soluble flux.  
Solder  
Use Sn-3.0Ag-0.5Cu solder  
Standard thickness of the solder paste should be 100 to 150µm.  
MURATA MFG.CO.,LTD  
SpecNo.JEFK243A-0002G-01  
P7/10  
13.3 Standard Land Dimensions (Reflow)  
0.20 0.20  
0.45  
1.30  
0.40  
Resis  
Copper foil pattern  
No pattern  
0.40  
(in mm)  
13.4 Assembling  
<Thermal Shock>  
Pre-heating should be in such a way that the temperature difference between solder and  
ceramic surface is limited to 100°C MAX. Also cooling into solvent after soldering  
should be in such a way that the temperature difference is limited to 100°C max.  
13.5 Standard Soldering Condition  
(1) Soldering Condition  
Standard soldering profile and the limit soldering profile is as follows.  
The excessive limit soldering conditions may cause leaching of the electrode and / or resulting  
in the deterioration of product quality.  
Temp.  
(℃)  
260℃/10s  
230℃  
245±3℃  
220℃  
Limit Profile  
180  
150  
Standard Profile  
30~60s  
60s max.  
90s±30s  
Standard Profile  
Time(s)  
Limit Profile  
Pre-heating  
150180°C 90s±30s  
above 220°C30s60s  
245±3°C  
Heating  
above 230°C60s max.  
260°C10s  
Peak temperature  
Cycle of reflow  
2 times  
2 times  
(2) Reworking with Soldering iron  
The following conditions must be strictly followed when using a soldering iron after being  
mounted by reflow soldering.  
Tip temperature / Soldering time : 350°C max / 3(+1,-0)s  
Soldering iron output :30W max  
Tip diameter : φ3mm  
Reworking should be limited to 2 times.  
Notes: Do not touch the products directly with the soldering iron.  
MURATA MFG.CO.,LTD  
SpecNo.JEFK243A-0002G-01  
(3) Solder Volume  
P8/10  
Solder shall be used not to be exceeded the upper limits as shown below.  
Upper limit  
Upper limit  
Recommendable  
Recommendable  
t
1/3 T  
t T (T:thickness of electrodes)  
Accordingly increasing the solder volume, the mechanical stress to Chip is also increased.  
Exceeding solder volume may cause the failure of mechanical or electrical performance.  
13.6 Resin coating  
The electric characteristics may change and/or it may affect on the product's performance due to high cure-stress  
of resin to be used for coating / molding products. So please pay your careful attention when you select resin.  
In prior to use, please make the reliability evaluation with the product mounted in your application set.  
13.7 Attention regarding P.C.B. bending  
The following shall be considered when designing and laying out P.C.B.'s.  
(1) P.C.B. shall be designed so that products are not subject to the mechanical stress due to  
warping the board.  
Products direction]  
Products shall be location the sideways  
a
Direction (Length : a<b) to the machanical  
b
Stress.  
Poor example  
Good example  
Warping direction]  
Products(warping direction 1, warping direction  
2) shall be located carefully so that products are  
not subjected to the mechanical stress due to  
warping the board. Because they may be  
subjected the mechanical stress in order of  
warping direction 1>warping direction 2.  
a
a
b
b
Wraping direction 1  
(warping direction 1)  
Wraping direction 2  
(warping direction 2)  
(2) Components location on P.C.B. separation.  
It is effective to implement the following measures, to reduce stress in separating the board.  
It is best to implement all of the following three measures; however, implement as many measures  
as possible to reduce stress.  
Contents of Measures  
Stress Level  
(1) Turn the mounting direction of the component parallel to the board separation surface.  
(2) Add slits in the board separation part.  
(3) Keep the mounting position of the component away from the board separation surface.  
A
A
A
>
D *1  
B
C
>
>
C
Perforation  
B
D
A
Slit  
*1 A > D is valid when stress is added vertically to the perforation as with Hand Separation.  
If a Cutting Disc is used, stress will be diagonal to the PCB, therefore A > D is invalid.  
MURATA MFG.CO.,LTD  
SpecNo.JEFK243A-0002G-01  
P9/10  
(3) Mounting Components Near Screw Holes  
When a component is mounted near a screw hole, it may be affected by the board deflection that occurs  
During the tightening of the screw. Mount the component in a position as far away from the screw holes  
as possible.  
Recommended  
Screw Hole  
Portion of  
Perforation  
13.8 Attention Regarding P.C.B. Design  
< The Arrangement of Products >  
×
P.C.B.  
P.C.B. shall be designed so that products are far from the portion  
of perforation.  
Product  
Portion of  
Perforation  
×
The portion of perforation shall be designed as narrow as possible  
and shall be designed so as not to be applied the stress in the case  
of P.C.B. separation.  
×
P.C.B.  
Products shall not be arranged on the line of a series of holes when  
there are big holes in P.C.B. (Because the stress concentrate on the  
line of holes.)  
Product  
Hole  
< Products Placing >  
Support pins shall be set under P.C.B . to prevent causing a warp to P.C.B.  
during placing the products on the other side of P.C.B.  
Pick-up nozzle  
Product  
< P.C.B. Separation >  
P.C.B. shall not be separated with hand.  
P.C.B. shall be separated with the fixture so as not to cause P.C.B. bending.  
P.C.B.  
Support pin  
13.9 Cleaning Conditions  
Products shall be cleaned on the following conditions.  
(1) Cleaning temperature shall be limited to 60°C max. (40°C max. for Isopropyl alcohol.)  
(2) Ultrasonic cleaning shall comply with the following conditions, avoiding the resonance phenomenon  
at the mounted products and P.C.B..  
Power : 20W/ l max. Frequency : 28kHz to 40kHz Time : 5 minutes max.  
(3) Cleaner  
1. Alternative cleaner Isopropyl alcohol (IPA)  
2. Aqueous agent  
PINE ALPHA ST-100S  
(4) There shall be no residual flux and residual cleaner after cleaning.  
In the case of using aqueous agent, products shall be dried completely after rinse with de-ionized  
water in order to remove the cleaner.  
(5) Other cleaning  
Please contact us.  
13.10 Handling of a substrate  
After mounting products on a substrate, do not apply any stress to the product caused by bending or twisting to  
the substrate when cropping the substrate, inserting and removing a connector from the substrate or tightening  
screw to the substrate.  
Excessive mechanical stress may cause cracking in the product.  
Bending  
Twisting  
MURATA MFG.CO.,LTD  
SpecNo.JEFK243A-0002G-01  
P10/10  
13.11 Operating Environment  
Do not use this product under the following environmental conditions, on deterioration of the performance, such  
as insulation resistance may result from the use.  
(1) in corrosive gases (acidic gases, alkaline gases, chlorine, sulfur gases, organic gases and etc.)  
(2) in the atmosphere where liquid such as organic solvent, may splash on the products.  
13.12 Storage Condition  
(1) Storage period  
Use the products within 12 months after delivered.  
Solderability should be checked if this period is exceeded.  
(2) Storage environment conditions  
·Products should be stored in the warehouse on the following conditions.  
Temperature -10 ~ +40°C  
Humidity  
15 to 85% relative humidity No rapid change on temperature and humidity.  
· Products should not be stored in corrosive gases, such as sulfureous, acid gases, alkaline gases,  
to prevent the following deterioration. Poor solderability due to the oxidized electrode.  
· Products should be stored on the palette for the prevention of the influence from humidity,dust and so on.  
· Products should be stored in the warehouse without heat shock, vibration, direct sunlight and so on.  
· Products should not be stored under the air tights packaged condition.  
(3) Delivery  
Care should be taken when transporting or handling product to avoid excessive vibration or mechanical shock.  
!
14. Notes  
(1)Please make sure that your product has been evaluated in view of your specifications with our product being  
mounted to your product.  
(2)You are requested not to use our product deviating from the reference specifications.  
(3)The contents of this reference specification are subject to change without advance notice. Please approve our  
product specifications or transact the approval sheet for product specifications before ordering.  
MURATA MFG.CO.,LTD  
配单直通车
DXP18BN5016DB产品参数
型号:DXP18BN5016DB
是否Rohs认证: 符合
生命周期:Not Recommended
IHS 制造商:MURATA MANUFACTURING CO LTD
Reach Compliance Code:compliant
ECCN代码:EAR99
风险等级:5.66
变压器类型:RF TRANSFORMER
Base Number Matches:1
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