HCNW136现货热卖使用介绍供应商报价哪里找芯片批发报价-中国IC网-芯三七

Single Channel, High Speed

Optocouplers

6N135/6

Technical Data

HCNW135/6

HCNW4502/3

HCPL-2502

HCPL-0452/3

HCPL-0500/1

HCPL-4502/3

Features

Description

Applications

• High Voltage Insulation

• Video Signal Isolation

• Power Transistor Isolation

in Motor Drives

• Line Receivers

• Feedback Element in

Switched Mode Power

Supplies

• High Speed Logic Ground

Isolation – TTL/TTL, TTL/

CMOS, TTL/LSTTL

• Replaces Pulse Transformers

• Replaces Slow

Phototransistor Isolators

• Analog Signal Ground

Isolation

These diode-transistor optocoup-

lers use an insulating layer

between a LED and an integrated

photodetector to provide elec-

trical insulation between input

and output. Separate connections

for the photodiode bias and

output-transistor collector

increase the speed up to a

hundred times that of a conven-

tional phototransistor coupler by

reducing the base-collector

capacitance.

• 15 kV/µs Minimum Common

Mode Transient Immunity at

V_CM= 1500 V (4503/0453)

• High Speed: 1 Mb/s

• TTL Compatible

• Available in 8-Pin DIP, SO-8,

Widebody Packages

• Open Collector Output

• Guaranteed Performance

from Temperature: 0°C

to 70°C

• Safety Approval

UL Recognized – 3750 V rms

for 1 minute (5000 V rms for

1 minute for HCNW and

Option 020 devices) per

UL1577

CSA Approved

IEC/EN/DIN EN 60747-5-2

Approved

Functional Diagram

–V_IORM= 630 V peak for

HCPL-4503#060

–V_IORM= 1414 V peak for

HCNW devices

8

7

6

5

NC

ANODE

CATHODE

NC

1

2

3

4

V

CC

TRUTH TABLE

(POSITIVE LOGIC)

*

V

B

LED

V

O

ON

OFF

LOW

HIGH

V

O

• Dual Channel Version

Available (253X/4534/053X/

0534)

GND

• MIL-PRF-38534 Hermetic

Version Available (55XX/

65XX/4N55)

* NOTE: FOR 4502/3, 0452/3,

PIN 7 IS NOT CONNECTED.

A 0.1 µF bypass capacitor must be connected between pins 5 and 8.

CAUTION: It is advised that normal static precautions be taken in handling and assembly of this component to

prevent damage and/or degradation which may be induced by ESD.

2

I

These single channel optocoup-

lers are available in 8-Pin DIP,

SO-8 and Widebody package

configurations.

output current for 1 TTL load and Schematic

a 5.6 kΩ pull-up resistor. CTR for

CC

8

V

CC

these devices is 19% minimum at

I

F

2

+

I_F= 16 mA.

ANODE

V

The 6N135, HCPL-0500, and

HCNW135 are for use in TTL/

CMOS, TTL/LSTTL or wide

bandwidth analog applications.

Current transfer ratio (CTR) for

these devices is 7% minimum at

I_F= 16 mA.

The HCPL-4502, HCPL-0452,

and HCNW4502 provide the

electrical and switching

performance of the 6N136,

HCPL-0501, and HCNW136 with

increased ESD protection.

F

I

O

6

5

–

3

V

O

CATHODE

SHIELD

GND

HCPL-4503/0453

HCNW4503

I

B

7

V

*

B

The HCPL-4503, HCPL-0453,

and HCNW4503 are similar to the

HCPL-4502, HCPL-0452, and

HCNW4502 optocouplers but

have increased common mode

transient immunity of 15 kV/µs

minimum at V_CM= 1500 V

guaranteed.

* NOTE: FOR HCPL-4502/-3, HCPL-0452/3,

HCNW4502/3, PIN 7 IS NOT CONNECTED.

The 6N136, HCPL-2502,

HCPL-0501, and HCNW136 are

designed for high speed TTL/TTL

applications. A standard 16 mA

TTL sink current through the

input LED will provide enough

Selection Guide

Widebody

Minimum CMR

8-Pin DIP (300 Mil)

Small-Outline SO-8

(400 Mil)

Hermetic

Current

V_CMTransfer

Single

Channel

Package

Dual

Channel

Package*

Single

Channel

Package

Dual

Channel

Package*

Single

Channel

Package

Single and

Dual Channel

Packages*

dV/dt

(V/µs)

(V)

Ratio (%)

1,000

10

7

6N135

HCPL-2530

HCPL-2531

HCPL-0500

HCPL-0530

HCPL-0531

HCNW135

19

6N136

HCPL-4502†

HCPL-2502

HCPL-0501

HCPL-0452†

HCNW136

HCNW4502†

15

19

9

15,000 1500

1,000 10

HCPL-4503† HCPL-4534 HCPL-0453† HCPL-0534 HCNW4503†

HCPL-55XX

HCPL-65XX

4N55

*Technical data for these products are on separate Agilent publications.

†Pin 7, transistor base, is not connected.

Ordering Information

Specify Part Number followed by Option Number (if desired).

Example:

HCPL-4503#XXXX

020 = UL 5000 V rms/1 Minute Option*

060 = IEC/EN/DIN EN 60747-5-2 V_IORM= 630 V peak Option**

300 = Gull Wing Surface Mount Option†

500 = Tape and Reel Packaging Option

XXXE = Lead Free Option

Option data sheets available. Contact your Agilent sales representative or authorized distributor for information.

*For 6N135/6 and HCPL-4502/3 only.

**For HCPL-4503 only. Combination of Option 020 and Option 060 is not available.

†Gull wing surface mount option applies to through hole parts only.

Remarks: The notation “#” is used for existing products, while (new) products launched since 15th July

2001 and lead free option will use “-”

3

Package Outline Drawings

8-Pin DIP Package (6N135/6, HCPL-4502/3, HCPL-2502)

7.62 ± 0.25

(0.300 ± 0.010)

9.65 ± 0.25

(0.380 ± 0.010)

8

1

7

6

5

6.35 ± 0.25

(0.250 ± 0.010)

TYPE NUMBER

OPTION CODE*

DATE CODE

A XXXXZ

YYWW

U R

UL

2

3

4

RECOGNITION

1.78 (0.070) MAX.

1.19 (0.047) MAX.

+ 0.076

- 0.051

0.254

5° TYP.

+ 0.003)

- 0.002)

3.56 ± 0.13

(0.140 ± 0.005)

(0.010

4.70 (0.185) MAX.

0.51 (0.020) MIN.

2.92 (0.115) MIN.

DIMENSIONS IN MILLIMETERS AND (INCHES).

1.080 ± 0.320

0.65 (0.025) MAX.

(0.043 ± 0.013)

*MARKING CODE LETTER FOR OPTION NUMBERS

"L" = OPTION 020

"V" = OPTION 060

2.54 ± 0.25

(0.100 ± 0.010)

OPTION NUMBERS 300 AND 500 NOT MARKED.

NOTE: FLOATING LEAD PROTRUSION IS 0.25 mm (10 mils) MAX.

8-Pin DIP Package with Gull Wing Surface Mount Option 300 (6N135/6, HCPL-4502/3)

LAND PATTERN RECOMMENDATION

9.65 ± 0.25

1.016 (0.040)

(0.380 ± 0.010)

6

5

8

1

7

6.350 ± 0.25

(0.250 ± 0.010)

10.9 (0.430)

2.0 (0.080)

2

3

4

1.27 (0.050)

9.65 ± 0.25

(0.380 ± 0.010)

1.780

(0.070)

MAX.

1.19

(0.047)

MAX.

7.62 ± 0.25

(0.300 ± 0.010)

+ 0.076

- 0.051

0.254

3.56 ± 0.13

(0.140 ± 0.005)

+ 0.003)

- 0.002)

(0.010

1.080 ± 0.320

(0.043 ± 0.013)

0.635 ± 0.25

(0.025 ± 0.010)

12° NOM.

0.635 ± 0.130

(0.025 ± 0.005)

2.54

(0.100)

BSC

DIMENSIONS IN MILLIMETERS (INCHES).

LEAD COPLANARITY = 0.10 mm (0.004 INCHES).

NOTE: FLOATING LEAD PROTRUSION IS 0.25 mm (10 mils) MAX.

4

Small Outline SO-8 Package (HCPL-0500/1, HCPL-0452/3)

LAND PATTERN RECOMMENDATION

8

1

7

2

6

5

4

5.994 ± 0.203

(0.236 ± 0.008)

XXX

YWW

3.937 ± 0.127

(0.155 ± 0.005)

TYPE NUMBER

(LAST 3 DIGITS)

7.49 (0.295)

DATE CODE

3

PIN ONE

1.9 (0.075)

0.406 ± 0.076

(0.016 ± 0.003)

1.270

(0.050)

BSC

0.64 (0.025)

0.432

(0.017)

*

7°

5.080 ± 0.127

(0.200 ± 0.005)

45° X

3.175 ± 0.127

(0.125 ± 0.005)

0 ~ 7°

0.228 ± 0.025

(0.009 ± 0.001)

1.524

(0.060)

0.203 ± 0.102

(0.008 ± 0.004)

TOTAL PACKAGE LENGTH (INCLUSIVE OF MOLD FLASH)

5.207 ± 0.254 (0.205 ± 0.010)

*

0.305

(0.012)

MIN.

DIMENSIONS IN MILLIMETERS (INCHES).

LEAD COPLANARITY = 0.10 mm (0.004 INCHES) MAX.

8-Pin Widebody DIP Package (HCNW135/6, HCNW4502/3)

11.00

(0.433)

11.15 ± 0.15

(0.442 ± 0.006)

MAX.

9.00 ± 0.15

(0.354 ± 0.006)

7

6

5

8

TYPE NUMBER

DATE CODE

A

HCNWXXXX

YYWW

1

3

2

4

10.16 (0.400)

TYP.

1.55

(0.061)

MAX.

7° TYP.

+ 0.076

- 0.0051

0.254

+ 0.003)

- 0.002)

(0.010

5.10

(0.201)

MAX.

3.10 (0.122)

3.90 (0.154)

0.51 (0.021) MIN.

2.54 (0.100)

TYP.

1.78 ± 0.15

(0.070 ± 0.006)

0.40 (0.016)

0.56 (0.022)

DIMENSIONS IN MILLIMETERS (INCHES).

NOTE: FLOATING LEAD PROTRUSION IS 0.25 mm (10 mils) MAX.

5

8-Pin Widebody DIP Package with Gull Wing Surface Mount Option 300 (HCNW135/6,

HCNW4502/3)

11.15 ± 0.15

(0.442 ± 0.006)

LAND PATTERN RECOMMENDATION

7

6

5

8

9.00 ± 0.15

(0.354 ± 0.006)

13.56

(0.534)

1

3

2

4

2.29

1.3

(0.09)

(0.051)

12.30 ± 0.30

(0.484 ± 0.012)

1.55

(0.061)

MAX.

11.00

MAX.

(0.433)

4.00

MAX.

(0.158)

1.78 ± 0.15

(0.070 ± 0.006)

1.00 ± 0.15

(0.039 ± 0.006)

0.75 ± 0.25

(0.030 ± 0.010)

+ 0.076

- 0.0051

2.54

(0.100)

BSC

0.254

+ 0.003)

- 0.002)

(0.010

DIMENSIONS IN MILLIMETERS (INCHES).

7° NOM.

LEAD COPLANARITY = 0.10 mm (0.004 INCHES).

NOTE: FLOATING LEAD PROTRUSION IS 0.25 mm (10 mils) MAX.

Solder Reflow Temperature Profile

300

PREHEATING RATE 3°C + 1°C/–0.5°C/SEC.

REFLOW HEATING RATE 2.5°C ± 0.5°C/SEC.

PEAK

TEMP.

245°C

PEAK

TEMP.

240°C

PEAK

TEMP.

230°C

200

2.5°C ± 0.5°C/SEC.

SOLDERING

TIME

200°C

30

160°C

150°C

140°C

SEC.

30

SEC.

3°C + 1°C/–0.5°C

100

PREHEATING TIME

150°C, 90 + 30 SEC.

50 SEC.

TIGHT

TYPICAL

LOOSE

ROOM

TEMPERATURE

0

50

100

150

200

250

TIME (SECONDS)

6

Recommended Pb-Free IR Profile

TIME WITHIN 5 °C of ACTUAL

PEAKTEMPERATURE

t

p

20-40 SEC.

260 +0/-5 °C

T

p

217 °C

L

RAMP-UP

3 °C/SEC. MAX.

150 - 200 °C

RAMP-DOWN

6 °C/SEC. MAX.

T

smax

T

smin

t

s

t

L

60 to 150 SEC.

PREHEAT

60 to 180 SEC.

25

t 25 °C to PEAK

TIME

NOTES:

THE TIME FROM 25 °C to PEAK TEMPERATURE = 8 MINUTES MAX.

= 200 °C, T = 150 °C

T

smax

smin

UL

IEC/EN/DIN EN 60747-5-2

Approved under

IEC 60747-5-2:1997 + A1:2002

EN 60747-5-2:2001 + A1:2002

DIN EN 60747-5-2 (VDE 0884

Teil 2):2003-01

Regulatory Information

Recognized under UL 1577,

Component Recognition

Program, File E55361.

The devices contained in this data

sheet have been approved by the

following organizations:

CSA

(HCNW and Option 060 only)

Approved under CSA Component

Acceptance Notice #5, File CA

88324.

Insulation and Safety Related Specifications

8-Pin DIP

Widebody

(300 Mil) SO-8 (400 Mil)

Parameter

Symbol

Value

Units

Conditions

Minimum External

Air Gap (External

Clearance)

L(101)

7.1

4.9

9.6

mm

Measured from input terminals

to output terminals, shortest

distance through air.

Minimum External

Tracking (External

Creepage)

Minimum Internal

Plastic Gap

L(102)

7.4

4.8

10.0

1.0

mm

Measured from input terminals

to output terminals, shortest

distance path along body.

Through insulation distance,

conductor to conductor, usually

the direct distance between the

photoemitter and photodetector

inside the optocoupler cavity.

0.08

(Internal Clearance)

Minimum Internal

Tracking (Internal

Creepage)

Tracking Resistance

(Comparative

Tracking Index)

Isolation Group

NA

200

IIIa

NA

200

IIIa

4.0

200

IIIa

mm

Measured from input terminals

to output terminals, along

internal cavity.

CTI

Volts DIN IEC 112/VDE 0303 Part 1

Material Group

(DIN VDE 0110, 1/89, Table 1)

Option 300 - surface mount classification is Class A in accordance with CECC 00802.

7

IEC/EN/DIN EN 60747-5-2 Insulation Related Characteristics

(HCPL-4503 OPTION 060 ONLY)

Description

Symbol

Characteristic

Units

Installation classification per DIN VDE 0110/1.89, Table 1

for rated mains voltage ≤ 300 V rms

for rated mains voltage ≤ 450 V rms

Climatic Classification

Pollution Degree (DIN VDE 0110/1.89)

Maximum Working Insulation Voltage

Input to Output Test Voltage, Method b*

I-IV

I-III

55/100/21

2

V

630

V peak

IORM

V

_IORMx 1.875 = V_PR, 100% Production Test with t_m= 1 sec,

V_PR

1181

945

Partial Discharge < 5 pC

Input to Output Test Voltage, Method a*

V

_IORMx 1.5 = V_PR, Type and sample test,

V peak

t_m= 60 sec, Partial Discharge < 5 pC

Highest Allowable Overvoltage*

(Transient Overvoltage, t_ini= 10 sec)

V

6000

IOTM

Safety Limiting Values

(Maximum values allowed in the event of a failure,

also see Figure 9, Thermal Derating curve.)

Case Temperature

T_S

I_S,INPUT

P_S,OUTPUT

175

230

600

≥ 10⁹

°C

mA

mW

Input Current

Output Power

Insulation Resistance at T_S, V = 500 V

R_S

Ω

IO

IEC/EN/DIN EN 60747-5-2 Insulation Related Characteristics (HCNW135/6, HCNW4502/3

ONLY)

Description

Symbol Characteristic Units

Installation classification per DIN VDE 0110/1.89, Table 1

for rated mains voltage ≤ 600 V rms

for rated mains voltage ≤ 1000 V rms

Climatic Classification

Pollution Degree (DIN VDE 0110/1.89)

Maximum Working Insulation Voltage

Input to Output Test Voltage, Method b*

I-IV

I-III

55/85/21

2

V

IORM

1414

V peak

V

_IORMx 1.875 = V_PR, 100% Production Test with t_m= 1 sec,

V_PR

2652

Partial Discharge < 5 pC

Input to Output Test Voltage, Method a*

V_IORMx 1.5 = V_PR, Type and sample test,

2121

8000

V peak

t_m= 60 sec, Partial Discharge < 5 pC

Highest Allowable Overvoltage*

(Transient Overvoltage, t_ini= 10 sec)

V

IOTM

Safety Limiting Values

(Maximum values allowed in the event of a failure,

also see Figure 9, Thermal Derating curve.)

Case Temperature

Input Current

Output Power

T_S

I_S,INPUT

P_S,OUTPUT

150

400

700

≥ 10⁹

°C

mA

mW

Insulation Resistance at T_S, V = 500 V

R_S

Ω

IO

*Refer to the front of the optocoupler section of the current catalog, under Product Safety Regulations section IEC/EN/DIN EN

60747-5-2, for a detailed description.

Note: Isolation characteristics are guaranteed only within the safety maximum ratings which must be ensured by protective circuits in

application.

8

Absolute Maximum Ratings

Parameter

Symbol

Device

Min.

-55

Max. Units Note

Storage Temperature*

Operating Temperature*

T

125

100

°C

S

T

A

8-Pin DIP

SO-8

Widebody

-55

85

25

Average Forward Input Current*

Peak Forward Input Current*

(50% duty cycle, 1 ms pulse width)

Peak Transient Input Current*

I

mA

1

2

F(AVG)

I

8-Pin DIP

SO-8

Widebody

8-Pin DIP

SO-8

Widebody

8-Pin DIP

SO-8

Widebody

8-Pin DIP

SO-8

F(PEAK)

50

40

1

I

A

V

F(TRANS)

(≤ 1 µs pulse width, 300 pps)

0.1

5

Reverse LED Input Voltage* (Pin 3-2)

Input Power Dissipation*

V

R

3

45

P

mW

3

IN

Widebody

40

8

Average Output Current* (Pin 6)

Peak Output Current*

Emitter-Base Reverse Voltage*

(Pin 5-7, except 4502/3, 0452/3)

I

mA

V

O(AVG)

I

16

5

O(PEAK)

V

EBR

Supply Voltage (Pin 8-5)

Output Voltage (Pin 6-5)

Supply Voltage* (Pin 8-5)

Output Voltage* (Pin 6-5)

Base Current* (Pin 7, except 4502/3, 0452/3)

Output Power Dissipation*

V

O

-0.5

30

20

15

5

V

mA

mW

CC

V

CC

V

I

P

O

B

100

4

O

Lead Solder Temperature*

(Through-Hole Parts Only)

1.6 mm below seating plane, 10 seconds

up to seating plane, 10 seconds

T

8-Pin DIP

Widebody

260

°C

LS

Reflow Temperature Profile

T

SO-8 and

Option 300

See Package Outline

Drawings section

RP

*Data has been registered with JEDEC for the 6N135/6N136.

9

Electrical Specifications (DC)

Over recommended temperature (T_A= 0°C to 70°C) unless otherwise specified. See note 13.

Parameter

Current

Transfer Ratio

Symbol

CTR*

Device

6N135

HCPL-0500

HCNW135

HCPL-2502

Min. Typ.** Max. Units

Test Conditions

T_A= 25°C V_O= 0.4 V

Fig. Note

I_F= 16 mA, 1, 2, 5, 11

7

18

19

50

%

V_CC= 4.5 V

4

5

V_O= 0.5 V

T_A= 25°C V_O= 0.4 V

V_O= 0.5 V

15

19

22

50

25

24

6N136

T_A= 25°C V_O= 0.4 V

HCPL-4502/3

HCPL-0501

HCPL-0452/3

HCNW136

HCNW4502/3

6N135

HCPL-0500

HCNW135

6N136

15

25

V_O= 0.5 V

Logic Low

Output Voltage

V_OL

0.1

0.4

V

T_A= 25°C I_O= 1.1 mA

I_F= 16 mA,

V_CC= 4.5 V

0.1

0.5

0.4

I_O= 0.8 mA

T_A= 25°C I_O= 3.0 mA

HCPL-2502

HCPL-4502/3

HCPL-0501

HCPL-0452/3

HCNW136

HCNW4502/3

0.1

0.5

I_O= 2.4 mA

Logic High

Output Current

I_OH

*

0.003

0.01

0.5

1

50

200

µA

T_A= 25°C V_O= V_CC= 5.5 V I_F= 0 mA

T_A= 25°C V_O= V_CC= 15 V

V_O= V_CC= 15 V

7

3

Logic Low

Supply Current

Logic High

Supply Current

Input Forward

Voltage

I_CCL

50

µA

V

I_F= 16 mA, V_O= Open, V_CC= 15 V

13

I_CCH

*

0.02

1.5

1

2

1.7

1.8

1.85

1.95

T_A= 25°C I_F= 16 mA, V_O= Open,

V_CC= 15 V

T_A= 25°C I_F= 16 mA

V_F*

8-Pin DIP

SO-8

Widebody

1.45

1.35

5

1.68

T_A= 25°C I_F= 16 mA

I_R= 10 µA

Input Reverse

Breakdown

Voltage

Temperature

Coefficient of

Forward Voltage

Input

BV_R*

8-Pin DIP

SO-8

Widebody

8-Pin DIP

SO-8

Widebody

8-Pin DIP

SO-8

V

3

I_R= 100 µA

∆V_F/

∆T_A

-1.6

mV/°C I_F= 16 mA

-1.9

60

C_IN

pF

f = 1 MHz, V_F= 0 V

Capacitance

Widebody

8-Pin DIP

SO-8

90

Transistor DC

Current Gain

h_FE

150

130

180

160

V_O= 5 V, I_O= 3 mA

V_O= 0.4 V, I_B= 20 µA

V_O= 5 V, I_O= 3 mA

V_O= 0.4 V, I_B= 20 µA

Widebody

*For JEDEC registered parts.

**All typicals at T_A= 25°C.

10

Switching Specifications (AC)

Over recommended temperature (T_A= 0°C to 70°C), V_CC= 5 V, I_F= 16 mA unless otherwise specified.

Parameter

Sym.

t_PHL*

Device

6N135

HCPL-0500

HCNW135

6N136

Min. Typ.** Max. Units

Test Conditions

Fig. Note

Propagation

Delay Time

to Logic Low

at Output

0.2

1.5

2.0

µs

T_A= 25°C

R_L= 4.1 kΩ

5, 6,

11

8, 9

0.2

0.8

R_L= 1.9 kΩ

HCPL-2502

HCPL-4502/3

HCPL-0501

HCPL-0452/3

HCNW136

1.0

HCNW4502/3

Propagation

Delay Time to

Logic High at

Output

t_PLH*

6N135

HCPL-0500

HCNW135

1.3

0.6

1.5

2.0

µs

T_A= 25°C

R_L= 4.1 kΩ

R_L= 1.9 kΩ

5, 6,

11

8, 9

6N136

0.8

HCPL-2502

HCPL-4502/3

HCPL-0501

HCPL-0452/3

HCNW136

1.0

HCNW4502/3

Common Mode |CM_H|

Transient

Immunity at

Logic High

Level Output

6N135

HCPL-0500

HCNW135

1

kV/µs R_L= 4.1 kΩ I_F= 0 mA, T_A= 25°C,

V_CM= 10 V_p-p

12

7, 8,

9

C_L= 15 pF

6N136

R_L= 1.9 kΩ

HCPL-2502

HCPL-4502

HCPL-0501

HCPL-0452

HCNW4502

HCPL-4503

HCPL-0453

HCNW4503

6N135

HCPL-0500

HCNW135

15

30

1

R_L= 1.9 kΩ I_F= 0 mA, T_A= 25°C,

V

_CM= 1500 V ,

p-p

C_L= 15 pF

kV/µs R_L= 4.1 kΩ I_F= 16 mA, T_A= 25°C,

_CM= 10 V_p-p

C_L= 15 pF

Common Mode |CM_L|

Transient

12

7, 8,

9

V

Immunity at

Logic Low

Level Output

6N136

1

R_L= 1.9 kΩ

HCPL-2502

HCPL-4502

HCPL-0501

HCPL-0452

HCNW4502

HCPL-4503

HCPL-0453

HCNW4503

6N135/6

HCPL-2502

HCPL-0500/1

15

30

9

R_L= 1.9 kΩ I_F= 16 mA, T_A= 25°C,

_CM= 1500 V_p-p

C_L= 15 pF

MHz See Test Circuit

V

,

Bandwidth

BW

8, 10

10

HCNW135/6

11

*For JEDEC registered parts.

**All typicals at T_A= 25°C.

11

Package Characteristics

Over recommended temperature (T_A= 0°C to 70°C) unless otherwise specified.

Parameter

Sym.

Device

Min. Typ.* Max. Units Test Conditions Fig. Note

Input-Output

Momentary

Withstand

Voltage**

V

ISO

8-Pin DIP

SO-8

Widebody

3750

5000

V rms RH < 50%,

t = 1 min.,

6, 14

T = 25°C

A

6, 15

8-Pin DIP

(Option 020)

6, 12,

15

I_I-O

8-Pin DIP

1

µA

45% RH, t = 5 s,

_I-O= 3 kVdc,

6, 16

V

T = 25°C

V_I-O= 500 Vdc

A

Input-Output

Resistance

R_I-O

8-Pin DIP

SO-8

Widebody

10¹²

Ω

6

10¹²10¹³

10¹¹

T = 25°C

T = 100°C

A

Input-Output

Capacitance

C_I-O

8-Pin DIP

SO-8

0.6

pF

f = 1 MHz

6

Widebody

0.5

0.6

*All typicals at T_A= 25°C.

**The Input-Output Momentary Withstand Voltage is a dielectric voltage rating that should not be interpreted as an input-output

continuous voltage rating. For the continuous voltage rating refer to the IEC/EN/DIN EN 60747-5-2 Insulation Related Characteristics

Table (if applicable), your equipment level safety specification or Agilent Application Note 1074 entitled “Optocoupler Input-Output

Endurance Voltage,” publication number 5963-2203E.

Notes:

1. Derate linearly above 70°C free-air temperature at a rate of 0.8 mA/°C (8-Pin DIP).

Derate linearly above 85°C free-air temperature at a rate of 0.5 mA/°C (SO-8).

2. Derate linearly above 70°C free-air temperature at a rate of 1.6 mA/°C (8-Pin DIP).

Derate linearly above 85°C free-air temperature at a rate of 1.0 mA/°C (SO-8).

3. Derate linearly above 70°C free-air temperature at a rate of 0.9 mW/°C (8-Pin DIP).

Derate linearly above 85°C free-air temperature at a rate of 1.1 mW/°C (SO-8).

4. Derate linearly above 70°C free-air temperature at a rate of 2.0 mW/°C (8-Pin DIP).

Derate linearly above 85°C free-air temperature at a rate of 2.3 mW/°C (SO-8).

5. CURRENT TRANSFER RATIO in percent is defined as the ratio of output collector current, I_O, to the forward LED input current, I_F,

times 100.

6. Device considered a two-terminal device: Pins 1, 2, 3, and 4 shorted together and Pins 5, 6, 7, and 8 shorted together.

7. Common mode transient immunity in a Logic High level is the maximum tolerable (positive) dV_CM/dt on the leading edge of the

common mode pulse signal, V_CM, to assure that the output will remain in a Logic High state (i.e., V_O> 2.0 V). Common mode

transient immunity in a Logic Low level is the maximum tolerable (negative) dV_CM/dt on the trailing edge of the common mode pulse

signal, V_CM, to assure that the output will remain in a Logic Low state (i.e., V_O< 0.8 V).

8. The 1.9 kΩ load represents 1 TTL unit load of 1.6 mA and the 5.6 kΩ pull-up resistor.

9. The 4.1 kΩ load represents 1 LSTTL unit load of 0.36 mA and 6.1 kΩ pull-up resistor.

10. The frequency at which the ac output voltage is 3 dB below its mid-frequency value.

11. The JEDEC registration for the 6N136 specifies a minimum CTR of 15%. Agilent guarantees a minimum CTR of 19%.

12. See Option 020 data sheet for more information.

13. Use of a 0.1 µf bypass capacitor connected between pins 5 and 8 is recommended.

14. In accordance with UL 1577, each optocoupler is proof tested by applying an insulation test voltage ≥ 4500 V rms for 1 second

(leakage detection current limit, I_I-O≤ 5 µA). This test is performed before the 100% Production test shown in the IEC/EN/DIN EN

60747-5-2 Insulation Related Characteristics Table if applicable.

15. In accordance with UL 1577, each optocoupler is proof tested by applying an insulation test voltage ≥ 6000 V rms for 1 second

(leakage detection current limit, I_I-O≤ 5 µA). This test is performed before the 100% Production test shown in the IEC/EN/DIN EN

60747-5-2 Insulation Related Characteristics Table if applicable.

16. This rating is equally validated by an equivalent ac proof test.

12

WIDEBODY

8 PIN DIP, SO-8

16

12

40 mA

35 mA

30 mA

T

V

= 25°C

T

V

= 25°C

A

10

= 5.0 V

CC

40 mA

35 mA

30 mA

25 mA

20 mA

25 mA

20 mA

8

4

5

0

15 mA

10 mA

15 mA

10 mA

I

= 5 mA

F

I

= 5 mA

F

0

10

20

0

10

– OUTPUT VOLTAGE – V

20

V

– OUTPUT VOLTAGE – V

O

Figure 1. DC and Pulsed Transfer Characteristics.

8 PIN DIP, SO-8

WIDEBODY

1.5

1.0

1.5

1.0

6N135, HCPL-0500

6N136, HCPL-4502/3,

HCPL-2502

HCNW135/6,

HCNW4502/3

HCPL-0501/0452/0453

0.5

0

0.5

0.1

NORMALIZED

= 16 mA

I

V

= 16 mA

= 0.4 V

I

F

O

V

= 0.4 V

= 5 V

= 25°C

O

= 4.5 V

= 25 °C

V

CC

T

CC

T

A

0

1

10

100

0

1

10

100

I

– INPUT CURRENT – mA

I

– INPUT CURRENT – mA

F

Figure 2. Current Transfer Ratio vs. Input Current.

8 PIN DIP, SO-8

WIDEBODY

1000

100

1000

100

10

T

A

= 25° C

I

F

T

A

= 25°C

+

V

–

10

1.0

0.1

F

1.0

0.1

I

F

+

V

0.01

0.001

0.01

F

–

0.001

1.2 1.3

1.4

1.5

1.6

1.7

1.8

1.1

1.2

1.3

1.4

1.5

1.6

V

– FORWARD VOLTAGE – VOLTS

V

– FORWARD VOLTAGE – VOLTS

F

Figure 3. Input Current vs. Forward Voltage.

13

8 PIN DIP, SO-8

WIDEBODY

1.1

1.0

0.9

1.1

1.0

0.9

HCNW135/6,

HCNW4502/3

NORMALIZED

= 16 mA

I

0.8

0.7

0.6

F

V

= 0.4 V

= 5 V

= 25°C

O

V

CC

A

0.8

0.7

0.6

T

NORMALIZED

I

= 16 mA

F

6N135, HCPL-0500

6N136, HCPL-4502/3,

HCPL-2502

V

= 0.4 V

= 5 V

= 25°C

O

CC

V

T

0.5

0.4

A

HCPL-0501, 0452, 0453

-60 -40 -20

0

20 40 60 80 100

80

100

-60 -40 -20

0

20 40

60

T

– TEMPERATURE – °C

T

– TEMPERATURE – °C

A

Figure 4. Current Transfer Ratio vs. Temperature.

WIDEBODY

8 PIN DIP, SO-8

1000

800

2000

1500

I

= 16 mA, V

= 5.0 V

CC

F

I

= 16 mA, V

= 5.0 V

CC

F

6N135, HCPL-0500 (R = 4.1 kΩ)

6N136, HCPL-0501, HCPL-2502

HCPL-4502/3 (R = 1.9 kΩ)

HCPL-0452/3

L

HCNW135 (R = 4.1 kΩ)

HCNW136 (R = 1.9 kΩ)

HCNW4502/3

L

600

t

PHL

PLH

1000

500

0

400

200

0

t

PHL

PLH

-60 -40 -20

0

20 40 60 80 100

-60

-20

20

60

100

T

– TEMPERATURE – °C

T

– TEMPERATURE – °C

A

Figure 5. Propagation Delay vs. Temperature.

WIDEBODY

8 PIN DIP, SO-8

3.0

10.0

I

= 10 mA

= 16 mA

I

= 10 mA

F

= 16 mA

F

6.0

4.0

t

2.0

V

T

A

= 5.0 V

= 25 °C

V

T

A

= 5.0 V

= 25 °C

CC

t

PLH

PHL

1.0

0.8

t

PLH

0.6

1.0

0.6

0.4

t

PHL

0.4

0.2

0.1

1

2

3

4

5

6 7 8 9 10

1

2

L

4

10

40

100

R

– LOAD RESISTANCE – (kΩ)

R

– LOAD RESISTANCE – (kΩ)

L

Figure 6. Propagation Delay Time vs. Load Resistance.

14

8 PIN DIP, SO-8

WIDEBODY

+3

+4

10

I

V

= 0

O

F

= V = 5.0 V

CC

+3

10

I

V

= 0

O

F

= V = 15 V

CC

+2

10

+1

10

+1

0

10

-1

10

-2

0

10

-60 -40 -20

0

20 40 60 80 100

-75 -50 -25

0

+25 +50 +75 +100

T

– TEMPERATURE – °C

T

– TEMPERATURE – °C

A

Figure 7. Logic High Output Current vs. Temperature.

8 PIN DIP, SO-8

WIDEBODY

0.30

0.20

0.10

0

0.50

0.40

T

= 25°C, R = 100 Ω, V = 5 V

CC

T

= 25°C, R = 100 Ω, V

= 5 V

CC

A

L

A

L

0.30

0.20

0.10

0

4

8

12

16

20

25

0

F

4

8

12

16

20

25

I

– QUIESCENT INPUT CURRENT – mA

I

– QUIESCENT INPUT CURRENT – mA

F

Figure 8. Small-Signal Current Transfer Ratio vs. Quiescent Input Current.

HCPL-4503 OPTION 060

(mW)

HCNW135/6, HCNW4502/3

(mW)

1000

800

700

600

500

400

300

200

100

0

P

S

900

800

700

600

500

400

300

200

I

(mA)

I (mA)

S

100

0

25 50 75 100 125 150 175 200

– CASE TEMPERATURE – °C

0

25

T – CASE TEMPERATURE – °C

S

50 75 100 125 150 175

T

S

Figure 9. Thermal Derating Curve, Dependence of Safety Limiting Value with Case Temperature per IEC/EN/DIN EN 60747-5-2.

15

6N135/6, HCPL-0500/1, HCPL-2502

= 25 °C

+12 V

+5

0

T

A

1

8

7

6

5

+12 V

0.1 µF

1.2 KΩ

2.1 KΩ

0.1 µF

15 KΩ

9.1 KΩ

2

3

4

Q

3

-5

V

O

47 µF

Q

2

100 Ω

1 KΩ

Q

V

1

FF

0.1 µF

470 Ω

(1 MΩ 12 pF

TEST INPUT)

-10

100 Ω

R

T

51 Ω

-15

-20

TRIM FOR

UNITY GAIN

22 Ω

Q

, Q , Q : 2N3904

2

3

1N4150

1

TYPICAL LINEARITY = ± 3% AT V = 1 V

IN

TYPICAL SNR = 50dB

p-p

0.1

1.0

10

100

TYPICAL R = 375 Ω

T

TYPICAL V dc = 3.8 V

O

f - FREQUENCY - MHz

TYPICAL I = 9 mA

F

HCNW135/6

Figure 10. Frequency Response.

I

F

I

PULSE

GEN.

F

8

7

6

5

1

2

3

4

+5 V

0

Z

t

= 50 Ω

= 5 ns

O

r

R

*

L

5 V

V

O

10% DUTY CYCLE

1/f < 100 µS

V

O

1.5 V

0.1µF

I

MONITOR

F

OL

C

= 1.5 µF

L

R

M

t

PHL

PLH

* PIN 7 UNCONNECTED IN HCPL-4502/3,

HCPL-0452/3, HCNW4502/3

Figure 11. Switching Test Circuit.

I

F

1

8

7

6

5

+5 V

B

R

2

L

*

V

CM

A

90% 90%

10%

r

10%

0 V

3

V

O

t

f

0.1 µF

V

O

4

5 V

V

FF

SWITCH AT A:

SWITCH AT B:

I

= 0 mA

F

V

O

OL

V

CM

= 16 mA

–

+

PULSE GEN.

*PIN 7 UNCONNECTED IN HCPL-4502/3, HCPL-0542/3, HCNW4502/3

Figure 12. Test Circuit for Transient Immunity and Typical Waveforms.

www.agilent.com/semiconductors

For product information and a complete list of

distributors, please go to our web site.

For technical assistance call:

Americas/Canada: +1 (800) 235-0312 or

(916)788-6763

Europe: +49 (0) 6441 92460

China: 10800 650 0017

Hong Kong: (+65) 6756 2394

India, Australia, New Zealand: (+65) 6755 1939

Japan: (+81 3) 3335-8152 (Domestic/Interna-

tional), or 0120-61-1280 (Domestic Only)

Korea: (+65) 6755 1989

Singapore, Malaysia, Vietnam, Thailand,

Philippines, Indonesia: (+65) 6755 2044

Taiwan: (+65) 6755 1843

Data subject to change.

Obsoletes 5989-0305EN

December 20, 2004

5989-2112EN

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