HMC787ALC3BTR中文资料应用文章市场行情现货热卖使用介绍-中国IC网-芯三七

GaAs, MMIC, Fundamental Mixer,

3 GHz to 10 GHz

Data Sheet

HMC787A

FEATURES

FUNCTIONAL BLOCK DIAGRAM

Conversion loss: 9 dB typical at 3 GHz to 9 GHz

Local oscillator (LO) to radio frequency (IF) isolation:

43 dB typical at 3 GHz to 9 GHz

RF to intermediate frequency (IF) isolation: 26 dB typical at

3 GHz to 9 GHz

HMC787A

GND 1

LO 2

9

8

7

GND

RF

GND 3

GND

Input third-order intercept (IP3): 24 dBm typical at

3 GHz to 9 GHz

Input 1 dB compression point (P1dB): 17 dBm typical at

3 GHz to 9 GHz

Input second-order intercept (IP2): 67 dBm typical at

3 GHz to 9 GHz

PACKAGE

BASE

GND

Figure 1.

Passive double-balanced topology

Wide IF frequency range: dc to 4 GHz

12-terminal, ceramic, leadless chip carrier (LCC) package

APPLICATIONS

Microwave radio

Industrial, scientific, and medical (ISM) band and ultrawide

band (UWB) radio

Test equipment and sensors

Military end use

GENERAL DESCRIPTION

The HMC787A is a general-purpose, double balanced mixer in

a 12-terminal, RoHS compliant, ceramic leadless chip carrier

(LCC) package that can be used as an upconverter or down-

converter from 3 GHz to 10 GHz. This mixer is fabricated in a

gallium arsenide (GaAs), metal semiconductor field effect

transistor (MESFET) process and requires no external components

or matching circuitry. The HMC787A provides excellent local

oscillator (LO) to radio frequency (RF) and LO to intermediate

frequency (IF) isolation due to optimized balun structures and

operates with a LO drive level of 17 dBm. The ceramic LCC

package eliminates the need for wire bonding and is compatible

with high volume, surface-mount manufacturing techniques.

Rev. 0

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HMC787A* Product Page Quick Links

Last Content Update: 11/04/2016

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HMC787A

Data Sheet

TABLE OF CONTENTS

Features .............................................................................................. 1

Downconverter Performance ......................................................6

Upconverter Performance......................................................... 10

Isolation and Return Loss Performance.................................. 12

Spurious and Harmonics Performance ................................... 14

Theory of Operation ...................................................................... 15

Applications Information .............................................................. 16

Typical Application Circuit....................................................... 16

Evaluation PCB Information .................................................... 16

Outline Dimensions ....................................................................... 17

Ordering Guide .......................................................................... 17

Applications....................................................................................... 1

Functional Block Diagram .............................................................. 1

General Description ......................................................................... 1

Revision History ............................................................................... 2

Specifications..................................................................................... 3

Absolute Maximum Ratings............................................................ 4

Thermal Resistance ...................................................................... 4

ESD Caution.................................................................................. 4

Pin Configuration and Function Descriptions............................. 5

Interface Schematics..................................................................... 5

Typical Performance Characteristics ............................................. 6

REVISION HISTORY

10/2016—Revision 0: Initial Version

Rev. 0 | Page 2 of 17

Data Sheet

HMC787A

SPECIFICATIONS

T_A= 25°C, IF = 100 MHz, LO = 17 dBm, and all measurements performed as downconverter, unless otherwise noted.

Table 1.

Parameter

Min

Typ

Max

Unit

FREQUENCY RANGE

RF

LO

3

DC

10

4

GHz

dBm

IF

LO DRIVE LEVEL

17

PERFORMANCE AT RF = 3 GHz to 9 GHz

Conversion Loss

9

11

dB

Single Sideband (SSB) Noise Figure

Input Third-Order Intercept (IP3)

Input 1 dB Compression Point (P1dB)

Input Second-Order Intercept (IP2)

RF to IF Isolation

9

dB

15

24

17

67

26

48

43

dBm

dB

15

35

LO to RF Isolation

LO to IF Isolation

dB

PERFORMANCE AT RF = 9 GHz to 10 GHz

Conversion Loss

9

11

dB

SSB Noise Figure

9

dB

Input IP3

Input P1dB

Input IP2

RF to IF Isolation

LO to RF Isolation

LO to IF Isolation

15

24

15

66

26

47

42

dBm

dB

15

25

dB

Rev. 0 | Page 3 of 17

HMC787A

Data Sheet

ABSOLUTE MAXIMUM RATINGS

Table 2.

THERMAL RESISTANCE

Thermal performance is directly linked to printed circuit board

(PCB) design and operating environment. Careful attention to

PCB thermal design is required.

Parameter

Rating

28 dBm

12 mA

RF Input Power

LO Input Power

IF Input Power

IF Source and Sink Current

Continuous Power Dissipation, P_DISS

(T_A= 85°C, Derate 11.6 mW/°C Above 85°C)

Maximum Junction Temperature

Maximum Peak Reflow Temperature (MSL3)¹

Operating Temperature Range

Storage Temperature Range

Electrostatic Discharge (ESD) Sensitivity

Human Body Model (HBM)

Table 3. Thermal Resistance

Package Type

E-12-1¹

θ_JA

θ_JC

Unit

1044 mW

120

86

°C/W

¹See JEDEC standard JESD51-2 for additional information on optimizing the

thermal impedance (PCB with 3 × 3 vias).

175°C

260°C

−40°C to +85°C

−55°C to +125°C

ESD CAUTION

1500 V (Class 1C)

1000 V (Class C5)

Field Induced Charged Device Model

(FICDM)

¹See the Ordering Guide section.

Stresses at or above those listed under Absolute Maximum

Ratings may cause permanent damage to the product. This is a

stress rating only; functional operation of the product at these

or any other conditions above those indicated in the operational

section of this specification is not implied. Operation beyond

the maximum operating conditions for extended periods may

affect product reliability.

Rev. 0 | Page 4 of 17

Data Sheet

HMC787A

PIN CONFIGURATION AND FUNCTION DESCRIPTIONS

GND 1

LO 2

9

8

7

GND

RF

HMC787A

TOP VIEW

(Not to Scale)

GND 3

GND

PACKAGE

BASE

GND

NOTES

1. NIC = NOT INTERNALLY CONNECTED.

2. EXPOSED PAD. EXPOSED PAD MUST

BE CONNECTED TO RF/DC GROUND.

Figure 2. Pin Configuration

Table 4. Pin Function Descriptions

Pin No.

Mnemonic Description

1, 3, 4, 6, 7, 9 GND

Ground. Connect the package bottom to RF/dc ground. See Figure 3 for the GND interface schematic.

Local Oscillator. This pin is dc-coupled and matched to 50 Ω. See Figure 4 for the LO interface schematic.

Intermediate Frequency. This pin is dc-coupled. For applications not requiring operation to dc, externally

block this pin using a series capacitor whose value is chosen to pass the necessary IF frequency range. For

operation to dc, this pin must not source or sink more than 12 mA of current or device nonfunction and

possible device failure results. See for Figure 5 the IF interface schematic.

2

5

LO

IF

8

RF

NIC

EPAD

Radio Frequency. This pin is dc-coupled and matched to 50 Ω. See Figure 6 for the RF interface schematic.

Not Internally Connected.

Exposed Pad. Exposed pad must be connected to RF/dc ground.

10 to 12

INTERFACE SCHEMATICS

GND

IF

Figure 5. IF Interface Schematic

Figure 3. GND Interface Schematic

RF

LO

Figure 4. LO Interface Schematic

Figure 6. RF Interface Schematic

Rev. 0 | Page 5 of 17

HMC787A

Data Sheet

TYPICAL PERFORMANCE CHARACTERISTICS

DOWNCONVERTER PERFORMANCE

Data taken as downconverter, lower sideband (high-side LO), T_A= 25°C, and LO drive level = 17 dBm, unless otherwise noted.

Measurements taken with LO amplifier in line with lab bench LO source.

0

–2

+85°C

+25°C

–40°C

–2

13dBm

15dBm

17dBm

19dBm

21dBm

–4

–6

–8

–10

–12

–14

–16

–18

–20

–10

–12

–14

–16

–18

–20

3

4

5

6

7

8

9

10

11

3

4

5

6

7

8

9

10

11

RF FREQUENCY (GHz)

Figure 7. Conversion Gain vs. RF Frequency for Various Temperatures,

IF = 100 MHz, LO Power = 17 dBm

Figure 10. Conversion Gain vs. RF Frequency for Various LO Powers,

IF = 100 MHz, Temperature = 25°C

50

45

40

35

30

25

20

15

10

5

+85°C

+25°C

–40°C

45

40

35

30

25

20

15

10

5

13dBm

15dBm

17dBm

19dBm

21dBm

0

3

4

5

6

7

8

9

10

11

3

4

5

6

7

8

9

10

11

RF FREQUENCY (GHz)

Figure 8. Input Third-Order Intercept (IP3) vs. RF Frequency for Various

Temperatures, IF = 100 MHz, LO Power = 17 dBm

Figure 11. Input Third-Order Intercept (IP3) vs. RF Frequency for Various LO

Powers, IF = 100 MHz, Temperature = 25°C)

100

90

80

70

60

50

40

90

80

70

60

50

40

30

20

10

0

+85°C

+25°C

–40°C

13dBm

30

15dBm

17dBm

20

10

0

19dBm

21dBm

3

4

5

6

7

8

9

10

11

3

4

5

6

7

8

9

10

11

RF FREQUENCY (GHz)

Figure 9. Input Second-Order Intercept (IP2) vs. RF Frequency for Various

Temperatures, IF = 100 MHz, LO Power = 17 dBm

Figure 12. Input Second-Order Intercept (IP2) vs. RF Frequency for Various LO

Powers, IF = 100 MHz, Temperature = 25°C

Rev. 0 | Page 6 of 17

Data Sheet

HMC787A

20

18

16

14

12

10

8

20

18

16

14

12

10

8

+85°C

+25°C

–40°C

15dBm

17dBm

19dBm

6

4

2

0

2.5

0

2.5

3.5

4.5

5.5

6.5

7.5

8.5

9.5

10.5

3.5

4.5

5.5

6.5

7.5

8.5

9.5

10.5

RF FREQUENCY (GHz)

Figure 13. Single Sidband Noise Figure vs. RF Frequency for Various

Temperatures, IF = 100 MHz, LO Power = 17 dBm

Figure 16. Single Sidband Noise Figure vs. RF Frequency for Various LO

Powers, IF = 100 MHz, Temperature = 25°C

0

–2

–4

+85°C

+25°C

–40°C

–2

13dBm

15dBm

–4

–6

17dBm

19dBm

21dBm

–6

–8

–10

–12

–14

–16

–18

–20

–10

–12

–14

–16

–18

–20

3

4

5

6

7

8

9

10

3

4

5

6

7

8

9

10

RF FREQUENCY (GHz)

Figure 14. Conversion Gain vs. RF Frequency for Various Temperatures,

IF = 1100 MHz, LO Power = 17 dBm

Figure 17. Conversion Gain vs. RF Frequency for Various LO Powers,

IF = 1100 MHz, Temperature = 25°C

50

45

40

35

30

25

20

45

40

35

30

25

20

15

10

5

+85°C

+25°C

–40°C

15

13dBm

15dBm

17dBm

19dBm

21dBm

10

5

0

3

4

5

6

7

8

9

10

3

4

5

6

7

8

9

10

RF FREQUENCY (GHz)

Figure 15. Input Third-Order Intercept (IP3) vs. RF Frequency for Various

Temperatures, IF = 1100 MHz, LO Power = 17 dBm

Figure 18. Input Third-Order Intercept (IP3) vs. RF Frequency for Various LO

Powers, IF = 1100 MHz, Temperature = 25°C

Rev. 0 | Page 7 of 17

HMC787A

Data Sheet

0

–2

0

–2

+85°C

+25°C

–40°C

13dBm

15dBm

17dBm

19dBm

21dBm

–4

–6

–8

–10

–12

–14

–16

–18

–10

–12

–14

–16

–18

–20

5

6

7

8

9

10

5

6

7

8

9

10

RF FREQUENCY (GHz)

Figure 19. Conversion Gain vs. RF Frequency for Various Temperatures,

IF = 3000 MHz, LO Power = 17 dBm

Figure 22. Conversion Gain vs. RF Frequency for Various LO Powers,

IF = 3000 MHz, Temperature = 25°C

50

13dBm

45

40

35

30

25

20

15

10

5

45

+85°C

+25°C

–40°C

15dBm

17dBm

19dBm

21dBm

40

35

30

25

20

15

10

5

0

5

6

7

8

9

10

5

6

7

8

9

10

RF FREQUENCY (GHz)

Figure 20. Input Third-Order Intercept (IP3) vs. RF Frequency for Various

Temperatures, IF = 3000 MHz, LO Power = 17 dBm

Figure 23. Input Third-Order Intercept (IP3) vs. RF Frequency for Various LO

Powers, IF = 3000 MHz, Temperature = 25°C

100

90

80

70

60

50

40

90

80

70

60

50

40

30

20

10

0

+85°C

+25°C

–40°C

13dBm

30

15dBm

17dBm

20

10

0

19dBm

21dBm

5

6

7

8

9

10

5

6

7

8

9

10

RF FREQUENCY (GHz)

Figure 21. Input Second-Order Intercept (IP2) vs. RF Frequency at Various

Temperatures, IF = 3000 MHz, LO Power = 17 dBm

Figure 24. Input Second-Order Intercept (IP2) vs. RF Frequency for Various LO

Powers, IF = 3000 MHz, Temperature = 25°C

Rev. 0 | Page 8 of 17

Data Sheet

HMC787A

0

–2

0

–2

13dBm

15dBm

17dBm

19dBm

20dBm

+85°C

+25°C

–40°C

–4

–6

–8

–10

–12

–14

–16

–18

–10

–12

–14

–16

–18

–20

0

1

2

3

4

5

0

1

2

3

4

5

IF FREQUENCY (GHz)

Figure 25. Conversion Gain vs. IF Frequency for Various Temperatures,

LO = 9510 MHz, LO Power = 17 dBm

Figure 28. Conversion Gain vs. IF Frequency for Various LO Powers,

LO = 9510 MHz, LO Power = 17 dBm

50

45

40

35

30

25

20

15

10

5

+85°C

+25°C

–40°C

13dBm

15dBm

17dBm

19dBm

20dBm

45

40

35

30

25

20

15

10

5

0

1

2

3

4

5

0

1

2

3

4

5

IF FREQUENCY (GHz)

Figure 26. Input Third-Order Intercept (IP3) vs. IF Frequency for Various

Temperatures, LO = 9510 MHz, LO Power = 17 dBm

Figure 29. Input Third-Order Intercept (IP3) vs. IF Frequency for Various LO

Powers, LO = 9510 MHz, LO Power = 17 dBm

30

+85°C

+25°C

–40°C

25

20

15

10

5

0

3

4

5

6

7

8

9

10

11

RF FREQUENCY (GHz)

Figure 27. Input 1 dB Gain Compression (P1dB) vs. RF Frequency for Various

Temperatures, IF = 100 MHz, LO = 17 dBm

Rev. 0 | Page 9 of 17

HMC787A

Data Sheet

UPCONVERTER PERFORMANCE

Data taken as upconverter, lower sideband (high-side LO), T_A= 25°C, and LO drive level = 17 dBm, unless otherwise noted.

Measurements taken with LO amplifier in line with lab bench LO source.

0

15dBm

17dBm

19dBm

21dBm

–2

+85°C

+25°C

–40°C

–2

–4

–6

–8

–10

–12

–14

–16

–18

–20

–10

–12

–14

–16

–18

–20

3

4

5

6

7

8

9

10

11

3

4

5

6

7

8

9

10

11

RF FREQUENCY (GHz)

Figure 30. Conversion Gain vs. RF Frequency for Various Temperatures,

IF = 100 MHz, LO Power = 17 dBm

Figure 33. Conversion Gain vs. RF Frequency for Various LO Powers,

IF = 100 MHz, Temperature = 25°C

50

15dBm

45

40

35

30

25

20

15

10

5

+85°C

+25°C

–40°C

45

17dBm

19dBm

40

35

30

25

20

15

10

5

21dBm

0

3

4

5

6

7

8

9

10

11

3

4

5

6

7

8

9

10

11

RF FREQUENCY (GHz)

Figure 31. Input Third-Order Intercept (IP3) vs. RF Frequency for Various

Temperatures, IF = 100 MHz, LO Power = 17 dBm

Figure 34. Input Third-Order Intercept (IP3) vs. RF Frequency for Various LO

Powers, IF = 100 MHz, Temperature = 25°C

0

–2

–4

+85°C

+25°C

–40°C

–2

13dBm

15dBm

–4

–6

17dBm

19dBm

21dBm

–6

–8

–10

–12

–14

–16

–18

–20

–10

–12

–14

–16

–18

–20

3

4

5

6

7

8

9

10

11

3

4

5

6

7

8

9

10

11

RF FREQUENCY (GHz)

Figure 32. Conversion Gain vs. RF Frequency for Various Temperatures,

IF = 1100 MHz, LO Power = 17 dBm

Figure 35. Conversion Gain vs. RF Frequency for Various LO Powers,

IF = 1100 MHz, Temperature = 25°C

Rev. 0 | Page 10 of 17

Data Sheet

HMC787A

50

45

40

35

30

25

20

15

10

5

50

45

40

35

30

25

20

15

10

5

+85°C

+25°C

–40°C

13dBm

15dBm

17dBm

19dBm

21dBm

0

3

4

5

6

7

8

9

10

11

3

4

5

6

7

8

9

10

11

RF FREQUENCY (GHz)

Figure 36. Input Third-Order Intercept (IP3) vs. RF Frequency for Various

Temperatures at IF = 1100 MHz, LO Power = 17 dBm

Figure 39. Input Third-Order Intercept (IP3) vs. RF Frequency for Various LO

Powers at IF = 1100 MHz, Temperature = 25°C

0

–2

–4

+85°C

+25°C

–40°C

–2

13dBm

15dBm

17dBm

19dBm

21dBm

–4

–6

–8

–10

–12

–14

–16

–18

–20

–10

–12

–14

–16

–18

–20

5

6

7

8

9

10

5

6

7

8

9

10

RF FREQUENCY (GHz)

Figure 37. Conversion Gain vs. RF Frequency for Various Temperatures,

IF = 3000 MHz, LO Power = 17 dBm

Figure 40. Conversion Gain vs. RF Frequency for Various LO Powers,

IF = 3000 MHz, Temperature = 25°C

50

+85°C

+25°C

45

40

45

13dBm

15dBm

17dBm

19dBm

21dBm

–40°C

40

35

30

25

20

15

10

5

35

30

25

20

15

10

5

0

5

6

7

8

9

10

5

6

7

8

9

10

RF FREQUENCY (GHz)

Figure 38. Input Third-Order Intercept (IP3) vs. RF Frequency for Various

Temperatures at IF = 3000 MHz, LO Power = 17 dBm

Figure 41. Input Third-Order Intercept (IP3) vs. RF Frequency for Various LO

Powers at IF = 3000 MHz, Temperature = 25°C

Rev. 0 | Page 11 of 17

HMC787A

Data Sheet

ISOLATION AND RETURN LOSS PERFORMANCE

Data taken as downconverter, lower sideband (high-side LO), IF = 100 MHz, T_A= 25°C, and LO drive level = 17 dBm, unless otherwise

noted. Measurements taken with LO amplifier in line with lab bench LO source.

80

70

60

50

40

30

20

10

0

80

70

60

50

40

30

20

10

0

+85°C

+25°C

–40°C

19dBm

17dBm

15dBm

LO TO RF

LO TO IF

3

4

5

6

7

8

9

10

11

3

4

5

6

7

8

9

10

11

RF FREQUENCY (GHz)

Figure 45. LO to RF and LO to IF Isolation vs. RF Frequency for Various LO

Powers, Temperature = 25°C

Figure 42. LO to RF and LO to IF Isolation vs. RF Frequency for Various

Temperatures, LO Power = 17 dBm

80

15dBm

+85°C

70

17dBm

+25°C

19dBm

–40°C

60

50

40

30

20

10

0

50

40

30

20

10

0

3

4

5

6

7

8

9

10

11

3

4

5

6

7

8

9

10

11

RF FREQUENCY (GHz)

Figure 46. RF to IF Isolation vs. RF Frequency for Various LO Powers,

Temperature = 25°C, LO Frequency = 7000 MHz

Figure 43. RF to IF Isolation vs. RF Frequency for Various Temperatures,

LO Frequency = 7000 MHz, LO Power = 17 dBm

5

0

10

+85°C

5

+25°C

–40°C

–5

0

–10

–15

–20

–25

–5

–10

–15

–20

–25

–30

+85°C

–30

+25°C

–40°C

–35

–40

0

1

2

3

4

5

6

7

8

9

10 11 12 13 14 15 16

3

4

5

6

7

8

9

10

11

IF FREQUENCY (GHz)

LO FREQUENCY (GHz)

Figure 47. IF Return Loss vs. IF Frequency at Various Temperatures,

LO Power = 17 dBm, LO Frequency = 6 GHz

Figure 44. LO Return Loss vs. LO Frequency at Various Temperatures,

LO Power = 17 dBm

Rev. 0 | Page 12 of 17

Data Sheet

HMC787A

5

0

–5

–10

–15

–20

–25

–30

–35

–40

+85°C

+25°C

–40°C

0

1

2

3

4

5

6

7

8

9

10 11 12 13 14 15 16

RF FREQUENCY (GHz)

Figure 48. RF Return Loss vs. RF Frequency at Various Temperatures,

LO Power = 17 dBm, LO Frequency = 6 GHz

Rev. 0 | Page 13 of 17

HMC787A

Data Sheet

SPURIOUS AND HARMONICS PERFORMANCE

Mixer spurious products are measured in dBc from the IF output power level, unless otherwise noted. Spur values are (M × RF) − (N × LO).

LO Harmonics

M × N Spurious Outputs, IF = 3000 MHz

LO = 17 dBm, and all values in dBc below input LO level

measured at RF port.

RF = 3.1 GHz, LO = 6.1 GHz, RF power = −5 dBm, and

LO power = 17 dBm.

N × LO

Table 5. Harmonics of LO

0

1

2

3

4

N_LOSpur at RF Port

0

1

2

3

4

Not applicable

13

0

99

93

89

28

47

89

94

99

44

45

89

87

92

44

64

86

87

90

LO Frequency (GHz)

1

2

3

4

13.6

90.7

91

3

6

10

55

46

41

53

45

57

58

64

61

59

76

61

M × RF

90.2

M × N Spurious Outputs, IF = 100 MHz

RF = 6.1 GHz, LO = 3.1 GHz, RF power = −5 dBm, and

LO power = 17 dBm.

RF = 3.1 GHz, LO = 3 GHz, RF power = −5 dBm, and

LO power = 17 dBm.

N × LO

0

1

2

3

4

0

1

2

3

4

0

1

2

3

4

Not applicable

13

0

88

86

39

24

89

85

28

18

92

87

50

90

97

89

0

1

2

3

4

Not applicable

14

0

93

90

88

38

25

98

92

91

32

27

94

98

94

54

60

90

94

98

16

89

86

82

12.3

90.1

91.1

89.1

M × RF

RF = 10.1 GHz, LO = 7.1 GHz, RF power = −5 dBm, and

LO power = 17 dBm.

RF = 6.1 GHz, LO = 6 GHz, RF power = −5 dBm, and

LO power = 17 dBm.

N × LO

0

1

2

3

4

0

1

2

3

4

0

1

2

3

4

Not applicable

11

0

86

81

76

28

30

84

86

79

41

35

94

87

83

54

52

86

92

87

0

1

2

3

4

Not applicable

12

0

91

88

87

26

36

97

88

89

42

35

90

95

90

42

50

88

87

96

17.7

82.9

75

16.3

89.1

86.2

83.1

M × RF

68

RF =10.1 GHz, LO = 10 GHz, RF power = −5 dBm, and

LO power = 17 dBm.

N × LO

0

1

2

3

4

0

1

2

3

4

Not applicable

4

0

84

82

78

39

87

97

87

83

36

83

87

97

89

43

79

83

87

95

19.9

84.3

78.4

72.4

M × RF

Rev. 0 | Page 14 of 17

Data Sheet

HMC787A

THEORY OF OPERATION

The HMC787A is a general-purpose, double balanced mixer in

a 12-terminal, RoHS compliant, ceramic leadless chip carrier

(LCC) package that can be used as an upconverter or down-

converter from 3 GHz to 10 GHz. This mixer is fabricated in a

gallium arsenide (GaAs), metal semiconductor field effect

transistor (MESFET) process and requires no external components

or matching circuitry. The HMC787A provides excellent local

oscillator (LO) to radio frequency (RF) and LO to intermediate

frequency (IF) isolation due to optimized balun structures and

operates with a LO drive level of 17 dBm. The ceramic LCC

package eliminates the need for wire bonding and is compatible

with high volume, surface-mount manufacturing techniques.

Rev. 0 | Page 15 of 17

HMC787A

Data Sheet

APPLICATIONS INFORMATION

TYPICAL APPLICATION CIRCUIT

EVALUATION PCB INFORMATION

Figure 49 shows the typical application circuit for the HMC787A.

The LO and RF pins are internally ac-coupled. When IF operation

is not required until dc, it is recommended to use an ac-coupled

capacitor at the IF port. When IF operation to dc is required,

do not exceed the IF source and sink currents specified in the

Absolute Maximum Ratings section.

The circuit board used in the application must use RF circuit

design techniques. Signal lines must have 50 Ω impedance, and

the package ground leads and exposed pad must be connected

directly to the ground plane similarly to that shown in Figure 50.

Use a sufficient number of via holes to connect the top and

bottom ground planes. The evaluation circuit board shown in

Figure 50 is available from Analog Devices, Inc., upon request.

1

2

3

9

8

7

RF

LO

IF

Figure 49. Typical Applications Circuit

Figure 50. Evaluation PCB Top Layer

Table 6. Bill of Materials for the EV1HMC787ALC3B Evaluation PCB

Quantity

Reference Designator

Part Number

Description

1

2

1

117611-1

104935

105192

PCB, evaluation board

2.92 mm connectors, SRI

SMA connector, Johnson

Device under test (DUT)

J1 to J2

J3

U1

HMC787ALCB

Rev. 0 | Page 16 of 17

Data Sheet

HMC787A

OUTLINE DIMENSIONS

3.13

3.00 SQ

2.87

0.36

0.30

0.24

PIN 1

INDICATOR

PIN 1

(0.32 × 0.32)

10

12

9

1

3

0.50

BSC

1.60

1.50 SQ

1.40

EXPOSED

PAD

7

6

4

BOTTOM VIEW

TOP VIEW

SIDE VIEW

1.00 REF

2.10 BSC

0.92 MAX

FOR PROPER CONNECTION OF

THE EXPOSED PAD, REFER TO

THE PIN CONFIGURATION AND

FUNCTION DESCRIPTIONS

SEATING

PLANE

SECTION OF THIS DATA SHEET.

Figure 51. 12-Terminal Ceramic Leadless Chip Carrier [LCC]

(E-12-1)

Dimensions shown in millimeters

ORDERING GUIDE

Temperature

Range

Package Body

Material

MSL

Package

Description

Package

Option

Package

Marking³

Model¹

Lead Finish

Rating²

HMC787ALC3B

−40°C to +85°C

Alumina Ceramic

Gold over

Nickel

MSL3

12-Terminal

Ceramic Leadless

Chip Carrier [LCC]

12-Terminal

Ceramic Leadless

Chip Carrier [LCC]

12-Terminal

Ceramic Leadless

Chip Carrier [LCC]

E-12-1

H787A

XXXX

HMC787ALC3BTR

HMC787ALC3BTR-R5

EV1HMC787ALC3B

Gold over

Nickel

H787A

XXXX

Gold over

Nickel

H787A

XXXX

Evaluation PCB

Assembly

¹The HMC787ALC3B, the HMC787ALC3BTR, and the HMC787ALC3BTR-R5 are RoHS Compliant Parts.

²See the Absolute Maximum Ratings section.

³The HMC787ALC3B, the HMC787ALC3BTR, and the HMC787ALC3BTR-R5 have a four digit lot number.

registered trademarks are the property of their respective owners.

D13608-0-10/16(0)

Rev. 0 | Page 17 of 17

型号:	HMC787ALC3BTR
Brand Name：	Analog Devices Inc
是否无铅：	含铅
是否Rohs认证：	符合
生命周期：	Active
针数：	12
制造商包装代码：	E-12-4
Reach Compliance Code：	compliant
风险等级：	2.16
特性阻抗：	50 Ω
构造：	COMPONENT
最大变频损耗：	11 dB
最大输入功率 (CW)：	28 dBm
最大工作频率：	10000 MHz
最小工作频率：	3000 MHz
最高工作温度：	85 °C
最低工作温度：	-40 °C
射频/微波设备类型：	TRIPLE BALANCED
端子面层：	Tungsten/Nickel/Gold (W/Ni/Au)
Base Number Matches：	1

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