MIL-PRF-19500/556F
3.2 Abbreviations, symbols, and definitions. Abbreviations, symbols, and definitions used herein shall be as specified in MIL-PRF-
19500 and as follows:
C - - - - - - - - - - - - - - - - - - - - -
- - - - - - - - - - - - - - - - - - - -
Coulomb.
g
FS
DC forward transconductance.
I
S
- - - - - - - - - - - - - - - - - - - - -
Source current through drain (forward biased V ).
SD
V
- - - - - - - - - - - - - - - - - -
Drain to source breakdown voltage, all other terminals short-circuited to source.
Source pin to case isolation current.
(BR)DSS
I
- - - - - - - - - - - - - - - - - -
(ISO)
3.3 Interface requirements and physical dimensions. The Interface requirements and physical dimensions shall be as specified in
MIL-PRF-19500, and figures 1 (T0-205), 3 (LCC), 4, 5, and 6 (die) herein.
3.3.1 Lead material and finish. Lead material shall be Kovar, Alloy 52, and a copper core is permitted (for T0-205AF). Lead finish shall
be solderable in accordance with MIL-PRF-19500, MIL-STD-750, and herein. Where a choice of lead finish is desired, it shall be
specified in the acquisition document (see 6.3).
3.3.2 Internal construction. Multiple chip construction shall not be permitted.
3.4 Marking. Marking shall be in accordance with MIL-PRF-19500. At the option of the manufacturer, marking of country of origin may
be omitted from the body of the transistor, but shall be retained on the initial container.
3.5 Electrostatic discharge protection. The devices covered by this specification require electrostatic protection.
3.5.1 Handling. MOS devices must be handled with certain precautions to avoid damage due to the accumulation of static charge.
However, the following handling practices are recommended (see 3.5).
a. Devices should be handled on benches with conductive handling devices.
b. Ground test equipment, tools, and personnel handling devices.
c. Do not handle devices by the leads.
d. Store devices in conductive foam or carriers.
e. Avoid use of plastic, rubber, or silk in MOS areas.
f.
Maintain relative humidity above 50 percent if practical.
g. Care should be exercised during test and troubleshooting to apply not more than maximum rated voltage to any lead.
h. Gate must be terminated to source, R 100 k, whenever bias voltage is to be applied drain to source.
3.6 Electrical performance characteristics. Unless otherwise specified herein, the electrical performance characteristics are as
specified in 1.3, 1.4, and table I.
3.7 Electrical test requirements. The electrical test requirements shall be the subgroups specified in 4.4.2 and 4.4.3.
3.8 Qualification. Devices furnished under this specification shall be products that are authorized by the qualifying activity for listing
on the applicable qualified products list before contract award (see 4.2 and 6.2 ).
4. VERIFICATION
4.1 Classification of Inspections. The inspection requirements specified herein are classified as follows:
a. Qualification inspection (see 4.2).
b. Screening (see 4.3)
c. Conformance inspection (see 4.4).
4.2 Qualification inspection. Qualification inspection shall be in accordance with MIL-PRF-19500. Alternate flow is allowed for
qualification inspection in accordance with MIL-PRF-19500.
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