MIL-PRF-19500/559E
4.4.2 Group B inspection. Group B inspection shall be conducted in accordance with the conditions specified for
subgroup testing in table VIa (JANS) of MIL-PRF-19500 and 4.4.2.1. Electrical measurements (end-points) and
delta requirements shall be in accordance with group A, subgroup 2 and 4.5.5 herein. See 4.4.2.2 for JAN, JANTX,
and JANTXV group B testing. Electrical measurements (end-points) and delta requirements for JAN, JANTX, and
JANTXV shall be after each step in 4.4.2.2 and shall be in accordance with group A, subgroup 2 and 4.5.5 herein.
4.4.2.1 Group B inspection, table VIa (JANS) of MIL-PRF-19500.
Subgroup Method Condition
*
*
B4
B5
1037
1027
VCB = 10 - 30 V dc; TJ = +150°C, 2,000 cycles. No heat sink or forced-air cooling
on devices shall be permitted.
(note: If a failure occurs, resubmission shall be at the test conditions of the original
sample.) VCB = 10 V dc, PD ≥ 100 percent of maximum rated PT (see 1.3).
Option 1: 96 hours minimum sample size in accordance with table VIa of
MIL-PRF-19500, adjust TA or PD to achieve TJ = +275°C minimum.
Option 2: 216 hours minimum, sample size = 45, c = 0; adjust TA or PD to achieve
TJ = +225°C minimum.
4.4.2.2 Group B inspection, (JAN, JANTX, and JANTXV). 1/
Step
1
Method
1039
Condition
Steady-state life: Test condition B, 340 hours, VCB = 10 -30 V dc, TJ = +150°C min. No
heat sink or forced-air cooling on the devices shall be permitted. n = 45 devices, c = 0.
2
1039
The steady-state life test of step 1 shall be extended to 1,000 hrs for each die design.
Samples shall be selected from a wafer lot every twelve months of wafer production.
Group B, step 2 shall not be required more than once for any single wafer lot. n = 45,
c = 0.
3
1032
High-temperature life (non-operating), t = 340 hours, TA = +200°C. n = 22, c = 0.
* 4.4.3 Group C inspection, Group C inspection shall be conducted in accordance with the conditions specified for
subgroup testing in table VII of MIL-PRF-19500, and in 4.4.3.1 (JANS).and 4.4.3.2 (JAN, JANTX, and JANTXV)
herein for group C testing. Electrical measurements (end-points) and delta requirements shall be in accordance with
group A, subgroup 2 and 4.5.5 herein, delta parameters apply to subgroup C6.
4.4.3.1 Group C inspection, table VII (JANS) of MIL-PRF-19500.
Subgroup Method Condition
C2
2036
Test condition E, 3 ounce weight; three bends of 15 degrees for 2N6990; three bends for
2N6989; not applicable to 2N6989U.
C6
1026
1,000 hours at VCB = 10 V dc; TJ = +150°C min. No heat sink or forced-air cooling on
device shall be permitted.
1/ Separate samples may be used for each step. In the event of a group B failure, the manufacturer may pull a
new sample at double size from either the failed assembly lot or from another assembly lot from the same wafer
lot. If the new “assembly lot” option is exercised, the failed assembly lot shall be scrapped.
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