SPICE MODEL: PDR3G
PDR3G
3A GLASS PASSIVATED RECTIFIER
ä
PowerDI 5
Features
·
·
·
·
·
·
Glass Passivated Die Construction
A
Low Leakage Current
D
b2
A2
High Forward Surge Current Capability
Lead Free Finish, RoHS Compliant (Note 1)
"Green" Molding Compound (No Br, Sb)
Qualified to AEC-Q101 Standards for High Reliability
ä
PowerDI 5
L1
L1
Min
1.05
0.33
0.80
1.70
3.90
Max
1.15
0.43
0.99
1.88
4.05
Dim
A
E
E1
A2
b1
b2
D
e
A2
b1
b1
Mechanical Data
D
·
·
Case: PowerDIä5
D2
b2
D2
E
3.05 NOM
Case Material: Molded Plastic, “Green” Molding
Compound. UL Flammability Classification Rating 94V-0
L
6.40
6.60
e
1.84 NOM
·
·
Moisture sensitivity: Level 1 per J-STD-020C
E2
E
Terminals: Finish – Matte Tin annealed over Copper
leadframe. Solderable per MIL-STD-202, Method 208
E1
E2
L
5.30
5.45
W
e
3
L1
3.55 NOM
·
·
·
Polarity: See Diagram
e
0.75
0.50
1.20
0.95
0.65
1.50
Marking: See Page 3
b1
b1
L1
W
Weight: 0.095 grams (approx.)
LEFT PIN
BOTTOMSIDE
HEAT SINK
RIGHT PIN
All Dimensions in mm
Note: Pins Left & Right must
be electrically connected
at the printed circuit board.
@ TA = 25°C unless otherwise specified
Maximum Ratings
Single phase, half wave, 60Hz, resistive or inductive load.
For capacitive load, derate current by 20%.
Value
Characteristic
Symbol
Unit
VRRM
VRWM
VR
Peak Repetitive Reverse Voltage
Working Peak Reverse Voltage
DC Blocking Voltage
400
V
VR(RMS)
IO
RMS Reverse Voltage
283
3
V
A
Average Rectified Output Current (See also figure 4)
Non-Repetitive Peak Forward Surge Current
8.3ms Single half sine-wave Superimposed on Rated Load
IFSM
100
A
Tj
Operating Temperature Range
Storage Temperature Range
-65 to +150
-65 to +150
°C
°C
TSTG
@ TA = 25°C unless otherwise specified
Thermal Characteristics
Characteristic
Symbol
RqJS
Typ
Max
2.0
¾
Unit
°C/W
°C/W
°C/W
°C/W
Thermal Resistance Junction to Soldering Point
Thermal Resistance Junction to Ambient Air (Note 2)
Thermal Resistance Junction to Ambient Air (Note 3)
Thermal Resistance Junction to Ambient Air (Note 4)
¾
75
65
45
RqJA
RqJA
¾
RqJA
¾
Notes:
1. RoHS revision 13.2.2003. Glass and High Temperature Solder Exemptions Applied, see EU Directive Annex Notes 5 and 7.
2. FR-4 PCB, 2 oz. Copper, minimum recommended pad layout per http://www.diodes.com/datasheets/ap02001.pdf.
3. Polymide PCB, 2 oz. Copper, minimum recommended pad layout per http://www.diodes.com/datasheets/ap02001.pdf.
4. Polymide PCB, 2 oz. Copper. Cathode pad dimensions 9.4mm x 7.2mm. Anode pad dimensions 2.7mm x 1.6mm.
DS30547 Rev. 6 - 2
1 of 3
PDR3G
PowerDI is a trademark of Diodes Incorporated.
www.diodes.com
ã Diodes Incorporated