TPS70933DRVR全新原装原理图各脚功能电路原理芯片引脚定义-中国IC网-芯三七

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产品型号TPS70933DRVR的概述

TPS70933DRVR概述 TPS70933DRVR是一款高效能的线性稳压器，设计用于提供低输入电压下的稳定输出。该芯片由德州仪器（Texas Instruments，TI）生产，广泛应用于为高精度模拟和数字电路提供电源。其特性使得TPS70933DRVR在便携式设备、通信设备及医疗仪器等领域都有着极为广泛的应用。 TPS70933DRVR的核心优势在于其极低的静态电流和出色的负载调节能力，特别适合需要长电池寿命和可靠性的系统。从典型应用来看，该芯片还可支持多种输出电压选项，从而为不同需求的设计提供灵活的解决方案。详细参数 1. 输入电压范围: TPS70933DRVR的输入电压范围为1.4 V至16 V，这使其能在多种电源配置下正常工作。 2. 输出电压: 该芯片提供固定的输出电压（例如3.3V），并且在不同的需求中，设计者可以选择不同版本的TPS709系列以满足特定电压要...

产品型号TPS70933DRVR的Datasheet PDF文件预览

TPS709xx

www.ti.com

SBVS186 –MARCH 2012

150-mA, 30-V, UltraLow I_Q, Low-Dropout Regulators with Enable

FEATURES

DESCRIPTION

The TPS709xx series of low-dropout (LDO) linear

regulators are ultralow quiescent current devices that

are designed for power-sensitive applications. A

precision band-gap and error amplifier provides 2%

accuracy over temperature. Quiescent current of only

1 µA makes the devices ideal solutions for battery-

powered, always ON systems that require very little

idle state power dissipation. All devices have a

thermal shutdown and current limit for safety.

•

UltraLow I_Q: 1 μA

•

Reverse Current Protection

Low I_SHUTDOWN: 150 nA

•

Input Voltage Range: 2.5 V to 30 V

Supports 200-mA Peak Output

Low Dropout: 300 mV at 50 mA

2% Accuracy Over Temperature

Available in Fixed-Output Voltages:

1.5 V to 6.5 V

The LDO can be put into shutdown mode by pulling

the EN pin low. The leakage current in this mode

goes down to less than 150 nA.

•

Thermal Shutdown and Overcurrent Protection

Packages: SOT23-5

The TPS709xx series is available in an SOT23-5

package.

APPLICATIONS

DBV PACKAGE

SOT23-5

(TOP VIEW)

•

Zigbee™ Networks

Home Automation

Metering

GND

OUT

Weighing Scales

Portable Power Tools

Remote Control Devices

Wireless Handsets, Smart Phones, PDAs,

WLAN and Other PC Add-On Cards

•

White Goods

Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of

Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.

Zigbee is a trademark of ZigBee Alliance.

All other trademarks are the property of their respective owners.

PRODUCT PREVIEW information concerns products in the

formative or design phase of development. Characteristic data and

other specifications are design goals. Texas Instruments reserves

the right to change or discontinue these products without notice.

TPS709xx

SBVS186 –MARCH 2012

www.ti.com

This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with

appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.

ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more

susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.

AVAILABLE OPTIONS⁽¹⁾

PRODUCT

V_OUT

XX is nominal output voltage (for example 28 = 2.8 V).

E is TBD

YYY is package designator

TPS709xxyyyz

Z is package quantity; R is for reel (3000 pieces), T is for tape (250 pieces)

(1) For the most current package and ordering information, see the Package Option Addendum at the end of this document, or visit the

device product folder at www.ti.com.

ABSOLUTE MAXIMUM RATINGS⁽¹⁾

Specified at T_J= –40°C to +125°C, unless otherwise noted. All voltages are with respect to GND.

VALUE

MIN

–0.3

MAX

UNIT

V_IN

+30

Voltage

V_EN

V_OUT

I_OUT

Maximum output current

Internally limited

Indefinite

Output short-circuit duration

Continuous total power dissipation

P_DISS

See the Thermal Information table

Junction, T_J

–55

+150

°C

Temperature

Storage, T_stg

Human body model (HBM)

Charged device model (CDM)

Electrostatic discharge (ESD) rating

500

(1) Stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. These are stress ratings

only, and functional operation of the device at these or any other conditions beyond those indicated under recommended operating

conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods my affect device reliability.

THERMAL INFORMATION

TPS709xx

THERMAL METRIC⁽¹⁾

DBV (SOT23)

5 PINS

212.1

78.5

UNITS

θ_JA

Junction-to-ambient thermal resistance

θ_JCtop

θ_JB

Junction-to-case (top) thermal resistance

Junction-to-board thermal resistance

39.5

°C/W

ψ_JT

Junction-to-top characterization parameter

Junction-to-board characterization parameter

Junction-to-case (bottom) thermal resistance

2.86

ψ_JB

38.7

θ_JCbot

N/A

(1) For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.

Submit Documentation Feedback

TPS709xx

www.ti.com

SBVS186 –MARCH 2012

ELECTRICAL CHARACTERISTICS

At T_A= –40°C to +85°C, V_IN= V_{OUT (typ)}+ 1 V or 2.5 V (whichever is greater), I_OUT= 1 mA, V_EN= 2 V, and C_IN= C_OUT= 2.2-μF

ceramic, unless otherwise noted. Typical values are at T_A= +25°C.

TPS709xx

PARAMETER

TEST CONDITIONS

MIN

2.5

1.5

–2

TYP

MAX

UNIT

V_IN

Input voltage range

Output voltage range

DC output accuracy

Line regulation

V_OUT

6.5

V_O

ΔV_O/ΔV_IN

ΔV_O/ΔI_OUT

V_OUT(NOM)+ 1 V, 2.5 V ≤ V_IN≤ 24 V

0 mA ≤ I_OUT≤ 150 mA

I_OUT= 150 mA

μA

Load regulation

800

300

1650

650

400

1.8

V_DO

I_CL

Dropout voltage⁽¹⁾

Output current limit

I_OUT= 50 mA

V_OUT= 0.9 × V_OUT(NOM)

I_OUT= 0 mA

260

I_GND

Ground pin current

I_OUT= 100 mA

150

300

150

I_OUT= 150 mA

I_SHUTDOWN

Shutdown pin current

_EN≤ 0.4 V, V_IN= 2.0 V

f = 10 Hz

PSRR

Power-supply rejection ratio f = 100 Hz

f = 1 kHz

BW = 100 Hz to 100 kHz, I_OUT= 10 mA,

V_IN= 2.3 V, V_OUT= 1.8 V

V_N

Output noise voltage

300

150

μV_RMS

t_STR

Startup time⁽²⁾

μs

V_EN(HI)

I_EN

Enable pin high (enabled)

Enable pin high (disabled)

EN pin current

0.9

5.5

0.4

EN = 5.5 V, I_OUT= 10 µA

+160

+140

°C

Shutdown, temperature increasing

Reset, temperature decreasing

Thermal shutdown

temperature

t_SD

T_J

Operating junction

temperature

–40

+125

°C

(1) V_DOis measured for devices with V_IN= 0.98 × V_OUT(NOM)

(2) Startup time = time from EN assertion to 0.95 × V_OUT(NOM)

Submit Documentation Feedback

TPS709xx

SBVS186 –MARCH 2012

www.ti.com

FUNCTIONAL BLOCK DIAGRAM

OUT

Current

Limit

Thermal

Shutdown

Bandgap

LOGIC

Device

GND

Figure 1. Fixed-Voltage Version

Submit Documentation Feedback

TPS709xx

www.ti.com

SBVS186 –MARCH 2012

TYPICAL CHARACTERISTICS

Over operating temperature range (T_J= –40°C to +125°C), I_OUT= 10 mA, V_EN= 1.0 V, C_OUT= 2.2 μF, and V_IN= V_OUT(TYP)+ 1

V or 2.5 V (whichever is greater), unless otherwise noted. Typical values are at T_J= +25°C.

Submit Documentation Feedback

TPS709xx

SBVS186 –MARCH 2012

www.ti.com

APPLICATION INFORMATION

The TPS709xx are a series of devices that belong to a new family of next-generation, low-dropout (LDO) voltage

regulators. They consume low quiescent current and deliver excellent line and load transient performance. This

performance, combined with low noise, very good PSRR with little (V_IN– V_OUT) headroom, makes these devices

ideal for RF portable applications, current limit, and thermal protection. The TPS709xx are specified from –40°C

to +125°C.

BOARD LAYOUT RECOMMENDATIONS TO IMPROVE PSRR AND NOISE PERFORMANCE

Input and output capacitors should be placed as close to the device pins as possible. To improve ac performance

(such as PSRR, output noise, and transient response), it is recommended that the board be designed with

separate ground planes for V_INand V_OUT, with the ground plane connected only at the GND pin of the device. In

addition, the ground connection for the output capacitor should be connected directly to the device GND pin.

INTERNAL CURRENT LIMIT

The TPS709xx internal current limit helps to protect the regulator during fault conditions. During current limit, the

output sources a fixed amount of current that is largely independent of output voltage. In such a case, the output

voltage is not regulated, and can be measured as V_OUT= I_LIMIT× R_LOAD. The PMOS pass transistor dissipates

[(V_IN– V_OUT) × I_LIMIT] until a thermal shutdown is triggered and the device turns off. As the device cools down, it

is turned on by the internal thermal shutdown circuit. If the fault condition continues, the device cycles between

current limit and thermal shutdown; see the Thermal Information section for more details.

The TPS709xx is characterized over the recommended operating output current range up to 150 mA. The

internal current limit begins to limit the output current at a minimum of 260 mA of output current. The TPS709xx

continues to operate for output currents between 150 mA and 260 mA but some data sheet parameters may not

be met, resulting in increased power dissipation.

DROPOUT VOLTAGE

The TPS709xx uses a PMOS pass transistor to achieve low dropout. When (V_IN– V_OUT) is less than the dropout

voltage (V_DO), the PMOS pass device is in the linear region of operation and the input-to-output resistance is the

R_DS(ON)of the PMOS pass element. V_DOapproximately scales with the output current because the PMOS device

behaves as a resistor in dropout.

As with any linear regulator, PSRR and transient response are degraded as (V_IN– V_OUT) approaches dropout.

This effect is shown in in the Typical Characteristics.

TRANSIENT RESPONSE

As with any regulator, increasing the output capacitor size reduces over- and undershoot magnitude, but

increases transient response duration.

UNDERVOLTAGE LOCK-OUT (UVLO)

The TPS709xx uses an undervoltage lockout (UVLO) circuit to keep the output shut off until the internal circuitry

operates properly.

REVERSE CURRENT PROTECTION

The TPS709xx have integrated reverse current protection. Reverse current protection prevents current from

flowing from the OUT pin to the IN pin when output voltage is higher than input voltage. The reverse current

protection circuitry places the power path in high impedance when it detects that the output voltage is higher than

the input voltage. This setting reduces leakage current from the output to the input to TBD nA, typical. The

reverse current protection is always active regardless of the enable pin logic state or if the OUT pin voltage is

greater than 2.0 V. Reverse current can flow if the output voltage is less than 2.0 V and if input voltage is less

than the output voltage.

Submit Documentation Feedback

TPS709xx

www.ti.com

SBVS186 –MARCH 2012

THERMAL INFORMATION

Thermal protection disables the output when the junction temperature rises to approximately +165°C, allowing

the device to cool. When the junction temperature cools to approximately +145°C, the output circuitry is again

enabled. Depending on power dissipation, thermal resistance, and ambient temperature, the thermal protection

circuit may cycle on and off. This cycling limits the dissipation of the regulator, protecting it from damage as a

result of overheating.

Any tendency to activate the thermal protection circuit indicates excessive power dissipation or an inadequate

heatsink. For reliable operation, junction temperature should be limited to +125°C, maximum. To estimate the

margin of safety in a complete design (including heatsink), increase the ambient temperature until the thermal

protection is triggered; use worst-case loads and signal conditions. For good reliability, thermal protection should

trigger at least +35°C above the maximum expected ambient condition of the particular application. This

configuration produces a worst-case junction temperature of +125°C at the highest expected ambient

temperature and worst-case load.

The TPS709xx internal protection circuitry is designed to protect against overload conditions. It is not intended to

replace proper heatsinking. Continuously running the TPS709xx into thermal shutdown degrades device

reliability.

POWER DISSIPATION

The ability to remove heat from the die is different for each package type, which presents different considerations

in the printed circuit board (PCB) layout. The PCB area around the device that is free of other components

moves the heat from the device to ambient air. Performance data for JEDEC low and high-K boards are given in

the Thermal Information table. Using heavier copper increases the effectiveness in removing heat from the

device. The addition of plated through-holes to heat-dissipating layers also improves the heatsink effectiveness.

Power dissipation depends on input voltage and load conditions. Power dissipation (P_D) is equal to the product of

the output current and the voltage drop across the output pass element, as shown in Equation 1:

P_D= (V_IN– V_OUT) × I_OUT

(1)

Submit Documentation Feedback

PACKAGE OPTION ADDENDUM

www.ti.com

5-Jun-2012

PACKAGING INFORMATION

Status ⁽¹⁾

Eco Plan ⁽²⁾

MSL Peak Temp ⁽³⁾

Samples

Orderable Device

Package Type Package

Drawing

Pins

Package Qty

Lead/

Ball Finish

(Requires Login)

TPS70912DBVR

TPS70912DBVT

TPS709135DBVR

TPS709135DBVT

TPS70916DBVR

TPS70916DBVT

TPS70918DBVR

TPS70918DBVT

TPS70919DBVR

TPS70919DBVT

TPS70925DBVR

TPS70925DBVT

TPS70927DBVR

TPS70927DBVT

TPS70928DBVR

TPS70928DBVT

TPS70930DBVR

TPS70930DBVT

TPS70933DBVR

PREVIEW

SOT-23

DBV

3000

250

TBD

Call TI

3000

250

3000

250

3000

250

3000

250

3000

250

3000

250

3000

250

3000

250

3000

Green (RoHS

& no Sb/Br)

CU NIPDAU Level-1-260C-UNLIM

TPS70933DBVT

PREVIEW

SOT-23

DBV

250

Green (RoHS

& no Sb/Br)

CU NIPDAU Level-1-260C-UNLIM

TPS70950DBVR

TPS70950DBVT

PREVIEW

SOT-23

DBV

3000

250

TBD

Call TI

⁽¹⁾The marketing status values are defined as follows:

ACTIVE: Product device recommended for new designs.

LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.

NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.

PREVIEW: Device has been announced but is not in production. Samples may or may not be available.

OBSOLETE: TI has discontinued the production of the device.

Addendum-Page 1

PACKAGE OPTION ADDENDUM

www.ti.com

5-Jun-2012

⁽²⁾Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability

information and additional product content details.

TBD: The Pb-Free/Green conversion plan has not been defined.

Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that

lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.

Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between

the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.

Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight

in homogeneous material)

⁽³⁾MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.

Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information

provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and

continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.

TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.

In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.

Addendum-Page 2

IMPORTANT NOTICE

Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications, enhancements, improvements,

and other changes to its products and services at any time and to discontinue any product or service without notice. Customers should

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TPS70933DRVR相关文章

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TPS70933DRVR产品参数

型号:	TPS70933DRVR
Brand Name：	Texas Instruments
是否无铅：	不含铅
是否Rohs认证：	符合
生命周期：	Active
包装说明：	HVSON,
Reach Compliance Code：	compliant
ECCN代码：	EAR99
HTS代码：	8542.39.00.01
Factory Lead Time：	12 weeks
风险等级：	0.86
可调性：	FIXED
最大回动电压 1：	1.4 V
标称回动电压 1：	0.3 V
最大输入电压：	30 V
最小输入电压：	2.7 V
JESD-30 代码：	S-PDSO-N6
JESD-609代码：	e4
长度：	2 mm
湿度敏感等级：	1
功能数量：	1
输出次数：	1
端子数量：	6
工作温度TJ-Max：	125 °C
工作温度TJ-Min：	-40 °C
最大输出电流 1：	0.15 A
最大输出电压 1：	3.333 V
最小输出电压 1：	3.267 V
标称输出电压 1：	3.3 V
封装主体材料：	PLASTIC/EPOXY
封装代码：	HVSON
封装形状：	SQUARE
封装形式：	SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE
峰值回流温度（摄氏度）：	260
调节器类型：	FIXED POSITIVE SINGLE OUTPUT LDO REGULATOR
座面最大高度：	0.8 mm
表面贴装：	YES
端子面层：	Nickel/Palladium/Gold (Ni/Pd/Au)
端子形式：	NO LEAD
端子节距：	0.65 mm
端子位置：	DUAL
处于峰值回流温度下的最长时间：	NOT SPECIFIED
宽度：	2 mm
Base Number Matches：	1

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