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产品型号UCC2808AQDR-2Q1的概述

UCC2808AQDR-2Q1芯片概述 UCC2808AQDR-2Q1是一款高性能的双相升压（Boost）和降压（Buck）控制器，广泛应用于各种电源管理设计中，尤其是在多输出电源中。该芯片设计用于满足现代电力转换的高效率、低待机功耗和高密度的需求。它集成了两个控制环路，既能够处理电压模式控制，也能处理电流模式控制，使其在不同的应用情境中具有出色的适应性。 UCC2808AQDR-2Q1支持宽输入电压范围，从18V到100V，并且其输出电压可以通过外部元件进行灵活调整。这使得它在多种应用中都显示出极大的灵活性，比如电机驱动、电源适配器、电池管理系统等。此外，该芯片具有自恢复功能，可以在发生过载或短路时自动调整自身工作状态。 UCC2808AQDR-2Q1详细参数 1. 工作电压范围：输入电压范围为18V至100V；输出电压可调。 2. 工作频率：典型工作频率在250kHz至500kHz...

产品型号UCC2808AQDR-2Q1的Datasheet PDF文件预览

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ꢊ ꢋ ꢌ ꢍꢋ ꢌ ꢎꢏ ꢁꢀꢏ ꢏꢎꢐꢑ ꢒ ꢋꢓ ꢎ ꢍꢀꢔ ꢕꢆꢍ ꢀꢊ ꢊ ꢍ ꢌꢒ

SGLS183 − AUGUST 2003

Qualification in Accordance With

AEC-Q100

On-Chip Error Amplifier With 2-MHz Gain

Bandwidth Product

†

Qualified for Automotive Applications

On Chip VDD Clamping

Customer-Specific Configuration Control

Can Be Supported Along With

Major-Change Approval

Output Drive Stages Capable of 500-mA

Peak-Source Current, 1-A Peak-Sink

Current

D PACKAGE

(TOP VIEW)

ESD Protection Exceeds 1500 V Per

MIL-STD-883, Method 3015; Exceeds 200 V

Using Machine Model (C = 200 pF, R = 0)

VDD

COMP

Dual Output Drive Stages in Push-Pull

Configuration

OUTA

OUTB

GND

Current Sense Discharge Transistor to

Improve Dynamic Response

130-µA Typical Starting Current

1-mA Typical Run Current

Operation to 1 MHz

PW PACKAGE

(TOP VIEW)

OUTA

VDD

COMP

OUTB

GND

Internal Soft Start

†

Contact factory for details. Q100 qualification data available on

request.

description

The UCC2808A is a family of BiCMOS push-pull, high-speed, low-power, pulse-width modulators. The

UCC2808A contains all of the control and drive circuitry required for off-line or dc-to-dc fixed frequency

current-mode switching power supplies with minimal external parts count.

The UCC2808A dual output drive stages are arranged in a push-pull configuration. Both outputs switch at half

the oscillator frequency using a toggle flip-flop. The dead time between the two outputs is typically 60 ns to

200 ns depending on the values of the timing capacitor and resistors, thus limiting each output stage duty cycle

to less than 50%.

The UCC2808A family offers a variety of package options and choice of undervoltage lockout levels. The family

has UVLO thresholds and hysteresis options for off-line and battery powered systems. Thresholds are shown

in the ordering information table.

The UCC2808A is an enhanced version of the UCC2808 family. The significant difference is that the A versions

feature an internal discharge transistor from the CS pin to ground, which is activated each clock cycle during

the oscillator dead time. The feature discharges any filter capacitance on the CS pin during each cycle and helps

minimize filter capacitor values and current sense delay.

Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of

Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.

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POST OFFICE BOX 655303 • DALLAS, TEXAS 75265

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ꢊ ꢋꢌ ꢍꢋꢌ ꢎꢏ ꢁ ꢀꢏ ꢏꢎ ꢐꢑ ꢒꢋ ꢓꢎ ꢍ ꢀꢔ ꢕꢆꢍꢀ ꢊꢊ ꢍꢌ ꢒ

SGLS183 − AUGUST 2003

†

ORDERING INFORMATION

UVLO

Option

ORDERABLE

PART NUMBER

TOP-SIDE

MARKING

PACKAGE

SOIC (D)

Tape and reel

UCC2808AQDR−1Q1

UCC2808AD-1Q1

2808A1

−40°C to 125°C

12.5 V/8.3 V

4.3 V/4.1 V

‡

TSSOP (PW)

SOIC (D)

UCC2808AQPWR−1Q1

UCC2808AQDR−2Q1

UCC2808AD-2Q1

2808A2

−40°C to 125°C

‡

UCC2808AQPWR−2Q1

TSSOP (PW)

†

‡

Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are available

at www.ti.com/sc/package.

Product Preview.

block diagram

COMP

VDD

OVERCURRENT

COMPARATOR

22 k

Ω

PEAK CURRENT

COMPARATOR

14 V

0.75 V

2.0 V

0.5 V

2.2 V

OUTA

VDD OK

OSCILLATOR

PWM

LATCH

1.2R

VDD−1 V

PWM

COMPARATOR

VDD

0.5 V

SOFT START

OUTB

GND

VOLTAGE

REFERENCE

SLOPE = 1 V/ms

Note: Pinout shown is for SOIC package. TSSOP pinout is different.

UDG-00097

POST OFFICE BOX 655303 • DALLAS, TEXAS 75265

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SGLS183 − AUGUST 2003

†}

absolute maximum ratings over operating free-air temperature (unless otherwise noted)

Supply voltage (IDD ≤ 10 mA) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15 V

Supply current . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20 mA

OUTA/OUTB source current (peak) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −0.5 A

OUTA/OUTB sink current (peak) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1.0 A

Analog inputs (FB, CS) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −0.3 V to VDD 0.3 V, not to exceed 6 V

Power dissipation at T = 25°C (D package) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 650 mW

Power dissipation at T = 25°C (PW package) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 400 mW

stg

Storage temperature, T

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −65°C to150°C

Junction temperature, T . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −55°C to 150°C

Lead temperature (soldering, 10 sec.) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 300°C

†

Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and

functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not

implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

Currents are positive into, negative out of the specified terminal. Consult Packaging Section of the Power Supply Control Data Book (TI Literature

Number SLUD003) for thermal limitations and considerations of packages.

electrical characteristics, T = −40°C to 125°C for the UCC2808AQ-x, VDD = 10 V (see Note 6), 1-µF

capacitor from VDD to GND, R = 22 kΩ, C = 330 pF T = T , (unless otherwise noted)

PARAMETER

TEST CONDITIONS

MIN

TYP

MAX UNITS

Oscillator Section

Oscillator frequency

175

194

0.5

213

kHz

V/V

Oscillator amplitude/VDD

See Note 1

0.44

0.56

NOTES: 1. Measured at RC. Signal amplitude tracks VDD.

6. For UCCx808A−1, set VDD above the start threshold before setting at 10 V.

POST OFFICE BOX 655303 • DALLAS, TEXAS 75265

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SGLS183 − AUGUST 2003

electrical characteristics, T = −40°C to 125°C for the UCC2808AQ-x, VDD = 10 V (see Note 6), 1-µF

capacitor from VDD to GND, R = 22 kΩ, C = 330 pF T = T , (unless otherwise noted)

PARAMETER

TEST CONDITIONS

MIN

TYP

MAX UNITS

Error Amplifier Section

Input voltage

COMP = 2 V

1.95

–1

2.05

Input bias current

Open loop voltage gain

COMP sink current

COMP source current

PWM Section

µA

2.5

FB = 2.2 V,

FB = 1.3 V,

COMP = 1 V

0.3

–0.2

COMP = 3.5 V

–0.5

Maximum duty cycle

Minimum duty cycle

Current Sense Section

Gain

Measured at OUTA or OUTB

COMP = 0 V

See Note 2

1.9

2.2

0.5

2.5

0.55

200

V/V

Maximum input signal

CS to output delay

CS source current

CS sink current

COMP = 5 V

See Note 3

CS from 0 mV to 600 mV

0.45

COMP = 3.5 V,

100

−200

CS = 0.5 V,

CS = 0 V

RC = 5.5 V

See Note 7

0.75

0.8

Over current threshold

COMP to CS offset

Output Section

OUT low level

0.65

0.35

0.85

1.2

I = 100 mA

I = −50 mA,

0.5

1.1

OUT high level

VDD – OUT

See Note 6

Rise time

= 1 nF

Fall time

Undervoltage Lockout Section

UCCx808A−1

UCCx808A−2

UCCx808A−1

UCCx808A−2

UCCx808A−1

UCCx808A−2

11.5

4.1

7.6

3.9

3.5

0.1

12.5

4.3

8.3

4.1

4.2

0.2

13.5

4.5

Start threshold

Minimum operating voltage after start

Hysteresis

4.3

5.1

0.3

Soft Start Section

COMP rise time

FB = 1.8 V,

Rise from 0.5 V to 4 V

3.5

Overall Section

Startup current

VDD < start threshold

130

260

µA

Operating supply current

VDD zener shunt voltage

FB = 0 V,

IDD = 10 mA

COMP

CS = 0 V

See Note 4

See Note 5 and 6

NOTES: 2. Gain is defined by: A +

0 ≤ V ≤ 0.4 V.

3. Parameter measured at trip point of latch with FB at 0 V.

4. Start threshold and zener shunt threshold track one another.

5. Does not include current in the external oscillator network.

6. For UCC2808A−1, set VDD above the start threshold before setting at 10 V.

7. The internal current sink on the CS pin is designed to discharge an external filter capacitor. It is not intended to be a dc sink path.

POST OFFICE BOX 655303 • DALLAS, TEXAS 75265

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SGLS183 − AUGUST 2003

pin assignments

COMP: COMP is the output of the error amplifier and the input of the PWM comparator. The error amplifier in

the UCC2808A is a true low-output impedance, 2-MHz operational amplifier. As such, the COMP pin can both

source and sink current. However, the error amplifier is internally current limited, so that zero duty cycle can be

externally forced by pulling COMP to GND.

The UCC2808A family features built-in full-cycle soft start. Soft start is implemented as a clamp on the maximum

COMP voltage.

CS: The input to the PWM, peak current, and overcurrent comparators. The overcurrent comparator is only

intended for fault sensing. Exceeding the overcurrent threshold will cause a soft start cycle. An internal MOSFET

discharges the current sense filter capacitor to improve dynamic performance of the power converter.

FB: The inverting input to the error amplifier. For best stability, keep FB lead length as short as possible and

FB stray capacitance as small as possible.

GND: Reference ground and power ground for all functions. Due to high currents, and high frequency operation

of the UCC2808A, a low impedance circuit board ground plane is highly recommended.

OUTA and OUTB: Alternating high current output stages. Both stages are capable of driving the gate of a power

MOSFET. Each stage is capable of 500-mA peak-source current, and 1-A peak-sink current.

The output stages switch at half the oscillator frequency, in a push-pull configuration. When the voltage on the

RC pin is rising, one of the two outputs is high, but during fall time, both outputs are off. This dead time between

the two outputs, along with a slower output rise time than fall time, insures that the two outputs can not be on

at the same time. This dead time is typically 60 ns to 200 ns and depends upon the values of the timing capacitor

and resistor.

The high-current-output drivers consist of MOSFET output devices, which switch from VDD to GND. Each

output stage also provides a very low impedance to overshoot and undershoot. This means that in many cases,

external-schottky-clamp diodes are not required.

RC: The oscillator programming pin. The UCC2808A’s oscillator tracks VDD and GND internally, so that

variations in power supply rails minimally affect frequency stability. Figure 1 shows the oscillator block diagram.

Only two components are required to program the oscillator: a resistor (tied to the VDD and RC), and a capacitor

(tied to the RC and GND). The approximate oscillator frequency is determined by the simple formula:

1.41

OSCILLATOR

where frequency is in Hz, resistance in Ohms, and capacitance in Farads. The recommended range of timing

resistors is between 10 kΩ and 200 kΩ and range of timing capacitors is between 100 pF and 1000 pF. Timing

resistors less than 10 kΩ should be avoided.

For best performance, keep the timing capacitor lead to GND as short as possible, the timing resistor lead from

VDD as short as possible, and the leads between timing components and RC as short as possible. Separate

ground and VDD traces to the external timing network are encouraged.

POST OFFICE BOX 655303 • DALLAS, TEXAS 75265

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ꢋ

ꢊ

ꢋ

ꢌ

ꢍ

ꢋ

ꢌ

ꢎ

ꢏ

ꢁ

ꢀ

ꢏ

ꢎ

ꢐ

ꢑ

ꢒ

ꢓ

ꢎ

ꢍ

ꢀ

ꢔ

ꢕ

ꢆ

ꢍ

ꢀ

ꢊꢊ

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SGLS183 − AUGUST 2003

pin assignments (continued)

1.41

FREQUENCY =

VDD

(APPROXIMATE

FREQUENCY)

OSCILLATOR

OUTPUT

0.2 V

UDG-00095

Figure 1. Block Diagram for Oscillator

NOTE A: The oscillator generates a sawtooth waveform on RC. During the RC rise time, the output stages alternate on time, but both stages are

off during the RC fall time. The output stages switch a 1/2 the oscillator frequency, with ensured duty cycle of < 50% for both outputs.

VDD: The power input connection for this device. Although quiescent VDD current is very low, total supply

current will be higher, depending on OUTA and OUTB current, and the programmed oscillator frequency. Total

VDD current is the sum of quiescent VDD current and the average OUT current. Knowing the operating

frequency and the MOSFET gate charge (Qg), average OUT current can be calculated from:

+ Q F, where F is frequency

OUT

To prevent noise problems, bypass VDD to GND with a ceramic capacitor as close to the chip as possible along

with an electrolytic capacitor. A 1-µF decoupling capacitor is recommended.

APPLICATION INFORMATION

A 200-kHz push-pull application circuit with a full-wave rectifier is shown in Figure 2. The output, V , provides

5 V at 50 W maximum and is electrically isolated from the input. Since the UCC2808A is a peak-current-mode

controller the 2N2907 emitter following amplifier (buffers the CT waveform) provides slope compensation which

is necessary for duty ratios greater than 50%. Capacitor decoupling is very important with a single ground IC

controller, and a 1 µF is suggested as close to the IC as possible. The controller supply is a series RC for start-up,

paralleled with a bias winding on the output inductor used in steady state operation.

Isolation is provided by an optocoupler with regulation done on the secondary side using the TL431 adjustable

precision shunt regulator. Small signal compensation with tight voltage regulation is achieved using this part

on the secondary side. Many choices exist for the output inductor depending on cost, volume, and mechanicall

strength. Several design options are iron powder, molypermalloy (MPP), or a ferrite core with an air gap as

shown here. The main power transformer has a Magnetics Inc. ER28 size core made of P material for efficient

operation at this frequency and temperature. The input voltage may range from 36 V dc to 72 V dc.

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SGLS183 − AUGUST 2003

APPLICATION INFORMATION

UDG-00096

Figure 2. Typical Application Diagram: 48-V In, 5-V, 50-W Output

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SGLS183 − AUGUST 2003

TYPICAL CHARACTERISTICS

IDD

OSCILLATOR FREQUENCY

EXTERNAL RC VALUES

COMP TO CS OFFSET

TEMPERATURE

OSCILLATOR FREQUENCY

1000

100

1.2

1.0

C = 100 pF

VDD = 10 V, t = 25

IDD

with 1 nF load

C = 220 pF

C = 330 pF

0.8

0.6

0.4

C = 1000 pF

C = 820 pF

C = 560 pF

IDD

0.2

without load

−55 −35 −15

85 105 125

200

400

600

800

1000

1200

100

150

200

- °C

Temperature

Ω

RT − Timing Resistor − k

Oscillator Frequency − kHz

Figure 3

Figure 4

Figure 5

ERROR AMPLIFIER GAIN AND PHASE

OUTPUT DEAD TIME

EXTERNAL RC VALUES

DEAD TIME

TEMPERATURE

RESPONSE

FREQUENCY

300

250

400

350

300

250

200

150

100

180

C = 1000 pF

160

140

120

100

VDD = 5 V

VDD = 7.5 V

C = 560 pF

C = 820 pF

C = 330 pF

200

150

Phase

VDD = 10 V

C = 220 pF

100

Gain

C = 100 pF

−100

−50

100

150

100

10000

1000000

100

150

200

250

Temperature - °C

RT − Timing Resistor − k Ω

Frequency − Hz

Figure 6

Figure 7

Figure 8

CS R

DS(on)

RC R

DS(on)

TEMPERATURE

120

300

100

250

VDD = 5 V

200

150

100

VDD = 7.5 V

VDD = 10 V

−100

−50

100

150

−100

−50

100

150

Temperature - °C

Figure 9

Figure 10

POST OFFICE BOX 655303 • DALLAS, TEXAS 75265

PACKAGE OPTION ADDENDUM

www.ti.com

30-Mar-2005

PACKAGING INFORMATION

Orderable Device

Status ⁽¹⁾

Package Package

Pins Package Eco Plan ⁽²⁾Lead/Ball Finish MSL Peak Temp ⁽³⁾

Qty

Type

SOIC

Drawing

UCC2808AQDR-1Q1

UCC2808AQDR-2Q1

ACTIVE

2500

TBD

Call TI

Level-1-220C-UNLIM

⁽¹⁾The marketing status values are defined as follows:

ACTIVE: Product device recommended for new designs.

LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.

NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in

a new design.

PREVIEW: Device has been announced but is not in production. Samples may or may not be available.

OBSOLETE: TI has discontinued the production of the device.

(2)

Eco Plan

The planned eco-friendly classification: Pb-Free (RoHS) or Green (RoHS

no Sb/Br)

please check

http://www.ti.com/productcontent for the latest availability information and additional product content details.

TBD: The Pb-Free/Green conversion plan has not been defined.

Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements

for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered

at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.

Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame

retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)

(3)

MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder

temperature.

Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is

provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the

accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take

reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on

incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited

information may not be available for release.

In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI

to Customer on an annual basis.

Addendum-Page 1

IMPORTANT NOTICE

Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications,

enhancements, improvements, and other changes to its products and services at any time and to discontinue

any product or service without notice. Customers should obtain the latest relevant information before placing

orders and should verify that such information is current and complete. All products are sold subject to TI’s terms

and conditions of sale supplied at the time of order acknowledgment.

TI warrants performance of its hardware products to the specifications applicable at the time of sale in

accordance with TI’s standard warranty. Testing and other quality control techniques are used to the extent TI

deems necessary to support this warranty. Except where mandated by government requirements, testing of all

parameters of each product is not necessarily performed.

TI assumes no liability for applications assistance or customer product design. Customers are responsible for

their products and applications using TI components. To minimize the risks associated with customer products

and applications, customers should provide adequate design and operating safeguards.

TI does not warrant or represent that any license, either express or implied, is granted under any TI patent right,

in which TI products or services are used. Information published by TI regarding third-party products or services

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Use of such information may require a license from a third party under the patents or other intellectual property

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Reproduction of information in TI data books or data sheets is permissible only if reproduction is without

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Resale of TI products or services with statements different from or beyond the parameters stated by TI for that

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is an unfair and deceptive business practice. TI is not responsible or liable for any such statements.

Following are URLs where you can obtain information on other Texas Instruments products and application

solutions:

Products

Applications

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Amplifiers

amplifier.ti.com

www.ti.com/audio

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dataconverter.ti.com

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www.ti.com/automotive

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dsp.ti.com

Broadband

Digital Control

Military

www.ti.com/broadband

www.ti.com/digitalcontrol

www.ti.com/military

Interface

Logic

interface.ti.com

logic.ti.com

Power Mgmt

Microcontrollers

power.ti.com

Optical Networking

Security

www.ti.com/opticalnetwork

www.ti.com/security

www.ti.com/telephony

www.ti.com/video

microcontroller.ti.com

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Wireless

www.ti.com/wireless

Mailing Address:

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Post Office Box 655303 Dallas, Texas 75265

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UCC2808AQDR-2Q1产品参数

型号:	UCC2808AQDR-2Q1
Brand Name：	Texas Instruments
是否无铅：	不含铅
是否Rohs认证：	符合
生命周期：	Active
IHS 制造商：	TEXAS INSTRUMENTS INC
零件包装代码：	SOIC
包装说明：	GREEN, PLASTIC, MS-012AA, SOIC-8
针数：	8
Reach Compliance Code：	compliant
ECCN代码：	EAR99
HTS代码：	8542.39.00.01
Factory Lead Time：	6 weeks
风险等级：	1.68
Is Samacsys：	N
模拟集成电路 - 其他类型：	SWITCHING CONTROLLER
控制模式：	CURRENT-MODE
控制技术：	PULSE WIDTH MODULATION
最大输入电压：	15 V
最小输入电压：	4.3 V
标称输入电压：	10 V
JESD-30 代码：	R-PDSO-G8
JESD-609代码：	e4
长度：	4.9 mm
湿度敏感等级：	1
功能数量：	1
端子数量：	8
最高工作温度：	125 °C
最低工作温度：	-40 °C
最大输出电流：	1 A
封装主体材料：	PLASTIC/EPOXY
封装代码：	SOP
封装等效代码：	SOP8,.25
封装形状：	RECTANGULAR
封装形式：	SMALL OUTLINE
峰值回流温度（摄氏度）：	260
认证状态：	Not Qualified
筛选级别：	AEC-Q100
座面最大高度：	1.75 mm
子类别：	Switching Regulator or Controllers
表面贴装：	YES
切换器配置：	PUSH-PULL
最大切换频率：	213 kHz
技术：	BICMOS
温度等级：	AUTOMOTIVE
端子面层：	Nickel/Palladium/Gold (Ni/Pd/Au)
端子形式：	GULL WING
端子节距：	1.27 mm
端子位置：	DUAL
处于峰值回流温度下的最长时间：	NOT SPECIFIED
宽度：	3.9 mm
Base Number Matches：	1

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